IP Library Granted Patent US 10,551,578
Granted Patent B2
US 10,551,578 · App. 15/860,617 · Granted Feb 4, 2020

Component alignment

Inventors: Darin James Douma (Monrovia, CA); Frank J. Flens (Campbell, CA)
Assignee: Finisar Corporation
G02B6/4244G02B6/423G02B6/4204G02B6/428G02B6/4238G02B6/4239G02B6/4257G02B6/4249
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Quick Facts
Patent No.
US 10,551,578
App. No.
15/860,617
Granted
Feb 4, 2020
Kind
B2
Abstract

A system may include a substrate and a lens component. The substrate may include pads and solder protuberances. Each solder protuberance may be located on a pad. The lens component may define grooves sized to receive at least a portion of the solder protuberances. The lens component may be positioned relative to the substrate such that at least a portion of each solder protuberance is positioned within the grooves.

Claims (29)

1. A system comprising:

a substrate including a plurality of pads and a plurality of solder protuberances, each solder protuberance of the plurality of solder protuberances having a spherical cap shape, and each solder protuberance of the plurality of solder protuberances being located on an associated pad of the plurality of pads; and

a lens component defining one or more grooves, each of the one or more grooves including two surfaces positioned such that the one or more grooves form a V-shaped cross-section, the lens component positioned relative to the substrate such that at least a portion of each solder protuberance of the plurality of solder protuberances is positioned within the one or more grooves and the spherical cap shape of each solder protuberance of the plurality of solder protuberances contacts each of the two surfaces of the one or more grooves.

2. The system of claim 1 , further comprising epoxy located within the one or more grooves.

3. The system of claim 1 , wherein the lens component further defines an epoxy well and one or more drain holes in fluid communication with the epoxy well and the one or more grooves.

4. The system of claim 1 , wherein the two surfaces of each of the one or more grooves are positioned such that the one or more grooves include one or more angular grooves.

5. The system of claim 4 , wherein the two surfaces of each of the one or more angular grooves are positioned such that the one or more angular grooves include one or more right-angle grooves.

6. The system of claim 5 , wherein the one or more right-angle grooves have a nominal opening width equal to a nominal diameter of the pads of the plurality of pads.

7. The system of claim 1 , further comprising:

a cable lens component configured to be located on the lens component; and

a plurality of optical fibers at least partially positioned in the cable lens component.

8. The system of claim 7 , further comprising a lens clip configured to be removably located on the lens component and to urge the cable lens component against the lens component.

9. The system of claim 7 , wherein the lens component includes a protrusion defining an area on which the cable lens component is located.

10. The system of claim 9 , wherein the protrusion separates the area on which the cable lens component is located from an epoxy well.

11. The system of claim 7 , wherein the cable lens component is configured to be selectively separated into two or more portions.

12. The system of claim 1 , wherein the lens component includes molded plastic.

13. The system of claim 1 , substrate includes a lithographically formed printed circuit board.

14. The system of claim 1 , wherein the pads include circular pads having a nominal diameter of 500 microns.

15. The system of claim 1 , wherein the spherical cap shape of each of the solder protuberances of the plurality of solder protuberances has a nominal radius of 300 microns.

16. An optoelectronic transceiver comprising:

a substrate including a plurality of pads and a plurality of solder protuberances, each solder protuberance of the plurality of solder protuberances having a spherical cap shape, and each solder protuberance of the plurality of solder protuberances being located on an associated pad of the plurality of pads;

a transceiver lens component defining one or more grooves, each of the one or more grooves including two surfaces positioned such that the one or more grooves form a V-shaped cross-section, the lens component positioned relative to the substrate such that at least a portion of each solder protuberance of the plurality of solder protuberances is positioned within the one or more grooves and the spherical cap shape of each solder protuberance of the plurality of solder protuberances contacts each of the two surfaces of the one or more grooves;

a fiber optic cable including:

a cable lens component configured to be located on the transceiver lens component; and

a plurality of optical fibers at least partially positioned in the cable lens component; and

a lens clip configured to be removably located on the transceiver lens component and to urge the cable lens component against the transceiver lens component.

17. The optoelectronic transceiver of claim 16 , further comprising epoxy located within the one or more grooves.

18. The optoelectronic transceiver of claim 16 , wherein the transceiver lens component further defines an epoxy well and one or more drain holes in fluid communication with the epoxy well and the one or more grooves.

19. The optoelectronic transceiver of claim 16 , wherein the two surfaces of each of the one or more grooves are positioned such that the one or more grooves include one or more right-angle grooves.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 2, 2018
From: DOUMA, DARIN JAMES; FLENS, FRANK J.
To: FINISAR CORPORATION
Reel/Frame 044519/0657 →