IP Library Patent Application 15861346
Patent Application
App. No. 15/861,346

Ultrathin Laminates

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Quick Facts
Patent No.
US None
App. No.
15/861,346
Abstract

Ultrathin copper clad laminates including a fabric sheet material layer having a first planar surface, a second planar surface and an original thickness of from about 10 to about 30 microns and at least one copper foil sheet that is adhered to a planar surface of the fabric sheet material by a cured resin wherein the base laminate has a thickness of from about 1.0 to about 1.75 mils.

Claims (13)

1 - 28 . (canceled)

29 . A laminate comprising:

a b-staged resin impregnated woven glass fabric sheet having a first planar surface and a second planar surface wherein the woven glass fabric sheet has a thickness greater than 0.5 mils and less than 1 mil, the woven glass fabric sheet further being woven from glass filaments having a diameter of from 3 to 5 microns and including a maximum of 2 filaments stacked over and under;

a first copper foil sheet having a thickness of from about 15 to 25 microns that is adhered to the b-staged resin impregnated woven fabric sheet first planar surface; and

an optional second copper foil sheet having a thickness of from about 15 to 25 microns that is adhered to the b-staged resin impregnated woven fabric sheet second planar surface, the laminate having a base laminate thickness of from about 1.0 to about 1.75 mils, the laminate further having a dielectric thickness of from about 0.8 to about 1.2 mils

30 . The laminate of claim 29 including the second copper foil sheet.

30 . The laminate of claim 29 wherein the resin includes no fillers.

31 . The laminate of claim 29 where in the resin Tg is from about 180-200° C.

32 . The laminate of claim 29 wherein the base laminate thickness differs by no more than 20% when measured at the center and each of four corners of a 18 inch by 24 inch rectangular laminate sheet.

33 . The laminate of claim 29 wherein the resin includes at least one epoxy resin and at least one phenolic resin.

34 . The laminate of claim 33 wherein the resin includes from greater that 0 to 2 wt % on a dry resin basis of phenoxy resin.

35 . The laminate of claim 29 wherein the copper foil layer is removed by etching.

36 . The laminate of claim 29 having a peel strength of at least about 4.5 lb/in.

Assignments (3)
SECURITY INTEREST Recorded Dec 26, 2019
From: ISOLA USA CORP.
To: CERBERUS BUSINESS FINANCE, LLC
Reel/Frame 051368/0775 →
SECURITY INTEREST Recorded Dec 26, 2019
From: ISOLA USA CORP.
To: CERBERUS BUSINESS FINANCE, LLC
Reel/Frame 051369/0038 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 4, 2018
From: SCHUMACHER, JOHANN R.; SCHULTZ, STEVEN M.; WILSON, STANLEY E.; AMLA, TARUN
To: ISOLA USA CORP.
Reel/Frame 044539/0987 →