High-frequency module
A high-frequency module includes a wiring substrate, a high-frequency circuit including circuit components disposed on the upper surface of the wiring substrate, a post made of metal and disposed on the upper surface of the wiring substrate, a sealing resin covering the circuit components, and an antenna substrate disposed on the upper surface of the sealing resin and having an antenna formed by a metal pattern. A groove is provided on the sealing resin, at least a part of the post is exposed from the groove, a central surface and two opposing side wall surfaces located higher than the central surface are formed at the upper side of the post, and a conductive adhesive is bonded to the central surface, the two side wall surfaces, and the antenna.
1. A high-frequency module comprising:
a wiring substrate;
a high-frequency circuit including circuit components disposed on an upper surface of the wiring substrate;
a post comprised of metal and disposed on the upper surface of the wiring substrate;
a sealing resin covering the circuit components; and
an antenna substrate disposed on an upper surface of the sealing resin and having an antenna comprising a metal pattern, wherein:
a groove is provided on the sealing resin, and at least a part of the post is exposed from the groove,
a central surface and two opposing side wall surfaces located higher than the central surface are formed at an upper side of the post, and
a conductive adhesive is bonded to the central surface and the two side wall surfaces of the post and the antenna.
2. The high-frequency module according to claim 1 , wherein
the sealing resin is provided in a rectangular shape, and the groove provided on the sealing resin is provided with a uniform width from one side of the sealing resin provided in a rectangular shape to another side of the sealing resin opposing the one side, and
the circuit components include a first circuit component and a second circuit component having a lower height than the first circuit component, and the second circuit component is disposed below the groove.
3. The high-frequency module according to claim 1 , wherein:
a side through hole is provided on a side surface of the antenna substrate, and an electrode portion is formed on a surface of the side through hole, and
the electrode portion is connected to the post by the conductive adhesive.