IP Library Granted Patent US 10,631,433
Granted Patent B2
US 10,631,433 · App. 15/868,207 · Granted Apr 21, 2020

Door cooler

Inventor: Harri Kaivo-Oja (Vaasa, FI)
Assignee: Vacon OY
H05K7/20272H05K5/03H05K7/20145H05K7/20609H05K7/20927
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Quick Facts
Patent No.
US 10,631,433
App. No.
15/868,207
Granted
Apr 21, 2020
Kind
B2
Abstract

An arrangement for cooling the inside air of an enclosure of a liquid cooled power electronic device, the arrangement comprising an air to liquid heat exchanger attached to the door of an enclosure, and means for circulating the inside air of the enclosure through an air channel of the heat exchanger. The heat exchanger comprises a cooler with internal liquid circulation, assembled inside the air channel and connected to the main liquid circulation of the enclosure, for example by flexible connection pipes, which allow the enclosure door to be opened without disturbing the liquid circulation.

Claims (26)

1. An arrangement for cooling inside air of an enclosure which houses a liquid cooled power electronics device within the enclosure, wherein components of the liquid cooled power electronics device are cooled by a main liquid circulation, the arrangement comprising:

a cover plate attached to a door of the enclosure, the door or the cover plate having apertures at a top end and at a bottom end so as to form an air channel between the cover plate and the door, the air channel connecting to inside of the enclosure; and

an air to liquid heat exchanger which is attached to the door of the enclosure, and is located between the cover plate and the door,

wherein the air to liquid heat exchanger further comprises a cooler with internal liquid circulation, the internal liquid circulation of the cooler being connected to the main liquid circulation of the liquid cooled power electronics device, and

the inside air of the enclosure is passed through the aperture at the top into the air channel, cooled by the cooler and returned to the inside of the enclosure.

2. The arrangement as claimed in claim 1 , wherein the heat exchanger is connected to the main liquid circulation of the power electronics device by flexible connection pipes which allow the door of the enclosure to be opened without disturbing the internal liquid circulation of the cooler.

3. The arrangement as claimed in claim 2 , wherein the heat exchanger is attached to inside of the door of the enclosure, the plate having apertures at the top end and at the bottom end.

4. The arrangement as claimed in claim 2 , wherein the heat exchanger is attached to outside of the door of the enclosure, the door having apertures at the top end and at the bottom end.

5. The arrangement according to claim 2 , wherein a direction of air flow in the air channel of the air to liquid heat exchanger is vertical.

6. The arrangement according to claim 2 , wherein the inside air of the enclosure is circulated through the air channel of the heat exchanger by gravity.

7. The arrangement as claimed in claim 1 , wherein the heat exchanger is attached to inside of the door of the enclosure, the plate having apertures at the top end and at the bottom end.

8. The arrangement according to claim 7 , wherein a direction of air flow in the air channel of the air to liquid heat exchanger is vertical.

9. The arrangement as claimed in claim 1 , wherein the heat exchanger is attached to outside of the door of the enclosure, the door having apertures at the top end and at the bottom end.

10. The arrangement according to claim 9 , wherein a direction of air flow in the air channel of the air to liquid heat exchanger is vertical.

11. The arrangement according to claim 1 , wherein a direction of air flow in the air channel of the air to liquid heat exchanger is vertical.

12. The arrangement according to claim 1 , wherein the inside air of the enclosure is circulated through the air channel of the heat exchanger by gravity.

13. The arrangement according to claim 1 , further comprising a fan assembled on an aperture of the air channel for circulating the inside air of the enclosure through the air channel of the heat exchanger.

14. The arrangement according to claim 1 , wherein the arrangement does not comprise a fan.

15. A liquid cooled power electronic converter mounted inside an enclosure, wherein a cover plate attached to a door of the enclosure, the door or the cover plate having apertures at a top end and at a bottom end so as to form an air channel between the cover plate and the door, the air channel connecting to inside of the enclosure, wherein inside air of the enclosure is cooled by circulating air through an air channel of an air to liquid heat exchanger attached to the door of the enclosure, and is located between the cover plate and the door, wherein the heat exchanger further comprises a cooler with internal liquid circulation, the internal liquid circulation of the cooler being connected to a main liquid circulation of the liquid cooled power electronic converter, wherein components of the liquid cooled power electronic converter are cooled by the main liquid circulation, and wherein the inside air of the enclosure is passed through the aperture at the top into the air channel, cooled by the cooler and returned to the inside of the enclosure.

16. An arrangement for cooling inside air of an enclosure of a liquid cooled power electronics device, the arrangement comprising:

a cover plate attached to a door of the enclosure, the door or the cover plate having apertures at a top end and at a bottom end so as to form an air channel between the cover plate and the door, the air channel connecting to inside of the enclosure; and

an air to liquid heat exchanger which is attached to the door of the enclosure, and is located between the cover plate and the door,

wherein the air to liquid heat exchanger further comprises a cooler with internal liquid circulation, the internal liquid circulation of the cooler being connected to a main liquid circulation of the liquid cooled power electronics device,

the inside air of the enclosure is passed through the aperture at the top into the air channel, cooled by the cooler and returned to the inside of the enclosure, and

the liquid cooled power electronics device is arranged within the enclosure.

17. The arrangement according to claim 16 , wherein the liquid cooled power electronics device is a frequency converter.

Assignments (2)
CHANGE OF NAME Recorded Jul 13, 2024
From: VACON OY
To: DANFOSS DRIVES OY
Reel/Frame 068321/0125 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2018
From: KAIVO-OJA, HARRI
To: VACON OY
Reel/Frame 045079/0761 →