Fluid heating apparatuses, systems, and methods
A low leakage current fluid heater and systems and methods thereof. The fluid heater has a configuration whereby a heating element is isolated from a fluid channel so as to leak into fluid passing through the channel an allowed amount of leakage current. Fluid passing through the fluid heater can be heated to a desired temperature. A controller can provide control signals to driver the fluid heater to the desired temperature and maintain the temperature at the desired temperature.
1. A fluid heating apparatus that leaks or induces an amount of current into a fluid flowing therethrough, the fluid heating apparatus comprising:
two parallel plates separated from each other by a seal and defining a fluid channel to receive the fluid, the fluid channel extending between the two parallel plates and the seal;
at least a portion of each of the two parallel plates being exposed to the fluid within the fluid channel, the two parallel plates including a non-fouling material;
at least one heat transferring element adjacent to at least one of the two parallel plates; and
at least one heating element adjacent the heat transferring element, wherein
the fluid heating apparatus is a groundless, extracorporeal, in-line fluid heating apparatus and said amount of current is less than 10 μA.
2. The fluid heating apparatus of claim 1 , wherein the fluid heating apparatus is configured and operative to heat the fluid flowing therethrough from 15° C. to 40° C., flowing at a flow rate of 300 ml/min.
3. The fluid heating apparatus of claim 1 , wherein the fluid heating apparatus is configured and operative to heat the fluid flowing therethrough from 38° C. to 43° C. at a flow rate of up to 500 ml/min.
4. The fluid heating apparatus of claim 1 , wherein the at least one heating element includes at least two heating elements.
5. The fluid heating apparatus of claim 1 , further comprising
a temperature sensor, the temperature sensor being electronically coupled to a controller, the controller being operative to receive feedback signals from the temperature sensor and to provide control signals to control an output of the at least one heating element.
6. The fluid heating apparatus of claim 1 , wherein the fluid heating apparatus is a component of a fluid processing system.
7. The fluid heating apparatus of claim 1 , wherein the fluid channel, in cross sectional view, is one of circular, square, rectangular, oval, or has a varying dimension a different cross sections thereof.
8. The fluid heating apparatus of claim 1 , wherein the at least one heat transferring element is a heat spreading element.
9. The fluid heating apparatus of claim 1 , wherein the at least one heating element is a ceramic heating element.
10. The fluid heating apparatus of claim 1 , wherein the at least one heating element is a transistor.
11. The fluid heating apparatus of claim 10 , wherein a current of the transistor is controlled.
12. The fluid heating apparatus of claim 1 , wherein the at least one heating element is comprised of a plurality of transistors, the transistors being one of MOSFETs, IGBTs, BJTs, or a combination thereof.
13. The fluid heating apparatus of claim 12 , wherein the plurality of transistors provide balanced dissipation.
14. The fluid heating apparatus of claim 12 , wherein each transistor is controlled or controllable so as to balance power therebetween.
15. The fluid heating apparatus of claim 1 , wherein
the non-fouling material is gold and nickel.
16. The fluid heating apparatus of claim 15 , wherein
the gold and the nickel is applied in multiple layers to result in a multi-layer plate.
17. A fluid heating apparatus, that leaks or induces an amount of current into a fluid flowing therethrough, the fluid heating apparatus comprising:
a fluid channel interface interfacing with a fluid channel, the fluid channel interface including a non-fouling material;
at least one heat transferring element adjacent the fluid channel interface; and
at least one heating element adjacent the heat transferring element, wherein
the fluid heating apparatus is a groundless, extracorporeal, in-line fluid heating apparatus,
the at least one heating element is comprised of a plurality of transistors, the transistors being one of MOSFETs, IGBTs, BJTs, or a combination thereof,
a current through the plurality of transistors is controlled so as to be proportional to rectified line voltage for unity power factor,
current proportionality is controlled to maintain constant power as the line voltage varies,
one or more of the transistors is in combination with a corresponding insulating substrate,
the at least one heating element is to provide heating to a flat plate in contact with a bag of fluid, and
the at least one heat transferring element is a plate with a surface upon which a bag of dialysate is to rest or rests.