IP Library Granted Patent US 10,437,762
Granted Patent B2
US 10,437,762 · App. 15/872,100 · Granted Oct 8, 2019

Partitioned interconnect slot for inter-processor operation

Inventors: John Christopher Beckett (Georgetown, TX); Rich M. Hernandez (Round Rock, TX); Robert Wayne Hormuth (Cedar Park, TX); Mukund P. Khatri (Austin, TX); Yogesh Varma (Austin, TX)
Assignee: Dell Products, L.P.
G06F13/385G06F9/4406G06F13/4068G06F13/4282G06F2213/0026G06F2213/0042
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Quick Facts
Patent No.
US 10,437,762
App. No.
15/872,100
Granted
Oct 8, 2019
Kind
B2
Abstract

Systems and methods for providing a partitioned interconnect slot for inter-processor operation. In an illustrative, non-limiting embodiment, an Information Handling System (IHS) may include: a processor comprising a first core and a second core; and a memory coupled to the processor, the memory having program instructions stored thereon that, upon execution, cause the IHS to enable an Input/Output (I/O) device to communicate directly with the first core and the second core utilizing a single interconnect slot.

Claims (23)

1. An Information Handling System (IHS), comprising:

a processor comprising a first core and a second core;

a memory coupled to the processor, the memory having program instructions stored thereon that, upon execution, cause the IHS to enable an Input/Output (I/O) device to communicate directly with the first core and the second core utilizing a single interconnect slot; and

a Basic Input/Output System (BIOS) coupled to the processor, the BIOS having program instructions stored thereon that, upon execution, cause the IHS to associate two or more interconnect slot entries with the single interconnect slot, wherein a first interconnect slot entry includes a first proximity domain construct that allows the first core to spawn a first interrupt or thread directed to a first portion of the single interconnect slot, and wherein a second interconnect slot entry includes a second proximity domain construct that allows the second core to spawn a second interrupt or thread directed to a second portion of the single interconnect slot.

2. The IHS of claim 1 , wherein the first and second cores access a single I/O device coupled to the single interconnect slot.

3. The IHS of claim 1 , wherein the program instructions, upon execution, further cause the IHS to enable the first core and the second core to communicate with the I/O device via the single interconnect slot in the absence of link traversal operations between the first core and the second core.

4. The IHS of claim 1 , wherein the first core and the second core share a non-volatile memory (NVM) bridge adapter.

5. The IHS of claim 4 , wherein the program instructions, upon execution, further cause the IHS to reduce latency of communication between (a) the first and second cores and (b) the NVM bridge adapter.

6. The IHS of claim 1 , further comprising a Basic Input/Output System (BIOS) coupled to the processor, the BIOS having program instructions stored thereon that, upon execution, cause the IHS to identify a type of the single interconnect slot.

7. A hardware memory device having program instructions stored thereon that, upon execution by an Information Handling System (IHS) having a processor comprising a first core and a second core, cause the IHS to:

associate two or more interconnect slot entries with an interconnect slot, wherein a first interconnect slot entry includes a first proximity domain construct that allows the first core to spawn a first interrupt or thread directed to a first portion of the interconnect slot, and wherein a second interconnect slot entry includes a second proximity domain construct that allows the second core to spawn a second interrupt or thread directed to a second portion of the interconnect slot;

enable the first core to communicate directly with an Input/Output (I/O) device via an interconnect slot; and

enable the second core to communicate directly with the I/O device via the interconnect slot.

8. The hardware memory device of claim 7 , wherein the direct communications exclude link traversal operations between the first core and the second core.

9. The hardware memory device of claim 7 , wherein the first core and the second core share a non-volatile memory (NVM) bridge adapter.

10. The hardware memory device of claim 9 , wherein the program instructions, upon execution, further cause the IHS to reduce latency of communication between (a) the first and second cores and (b) the NVM bridge adapter.

11. In an Information Handling System (IHS) having comprising a processor having at least a first core and a second core, a method comprising:

associating two or more interconnect slot entries with the interconnect slot, wherein a first interconnect slot entry includes a first proximity domain construct that allows the first core to spawn a first interrupt or thread directed to a first portion of the interconnect slot, and wherein a second interconnect slot entry includes a second proximity domain construct that allows the second core to spawn a second interrupt or thread directed to a second portion of the interconnect slot;

enabling the first core to communicate directly with an Input/Output (I/O) device via an interconnect slot; and

enabling the second core to communicate directly with the I/O device via the interconnect slot.

12. The method of claim 11 , wherein the direct communications exclude link traversal operations between the first core and the second core.

13. The method of claim 11 , wherein the first core and the second core share a non-volatile memory (NVM) bridge adapter.

14. The method of claim 13 , further comprising reducing latency of communication between (a) the first and second cores and (b) the NVM bridge adapter.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045482/0131) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO WYSE TECHNOLOGY L.L.C.)
Reel/Frame 061749/0924 →
RELEASE OF SECURITY INTEREST AT REEL 045482 FRAME 0395 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058298/0314 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Mar 1, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 045482/0131 →
PATENT SECURITY AGREEMENT (CREDIT) Recorded Mar 1, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 045482/0395 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 16, 2018
From: BECKETT, JOHN CHRISTOPHER; HERNANDEZ, RICH M.; HORMUTH, ROBERT WAYNE; KHATRI, MUKUND P.; VARMA, YOGESH
To: DELL PRODUCTS, LP .
Reel/Frame 044631/0673 →
Continuity (1)
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