Systems and devices for acheiving high throughput attachment and sub-micron alignment of components
View Patent ↗Systems and devices for achieving high throughput attachment of sub-micron alignment of components are provided. One such device can include a fixture for holding a chuck, the fixture including a plurality of alignment features for adjusting a position of the chuck, the chuck includes a top layer including a vacuum aperture for holding a first component and a bottom layer made from a translucent material, wherein the bottom layer is directly attached to the top layer.
1. A system for bonding components, the system comprising:
a first component;
a second component;
a device comprising:
a chuck including:
a top layer comprising a first material;
a bottom layer comprising a second material different from the first material wherein the bottom layer comprises a translucent material;
a vacuum hole; and
a fixture for holding the chuck;
a first stress absorption layer positioned between the fixture and an external surface of the chuck;
a pick up tool; and
an assembly heating element,
wherein the pick up tool is configured to:
pick up the first component and place it on the vacuum hole of the chuck,
pick up and bring the second component into contact with the first component,
wherein the assembly heating element is configured to heat the first component to thereby bond the first and second component.
2. The system of claim 1 , wherein the top layer comprises silicon carbide.
3. A system for bonding components, the system comprising:
a first component;
a second component;
a device comprising:
a chuck including:
a top layer comprising a first material;
a bottom layer comprising a second material different from the first material wherein the bottom layer comprises glass sapphire;
a vacuum hole; and
a fixture for holding the chuck;
a first stress absorption layer positioned between the fixture and an external surface of the chuck;
a pick up tool; and
an assembly heating element,
wherein the pick up tool is configured to:
pick up the first component and place it on the vacuum hole of the chuck,
pick up and bring the second component into contact with the first component,
wherein the assembly heating element is configured to heat the first component to thereby bond the first and second component.
4. The system of claim 1 , wherein the first stress absorption layer is positioned between the top layer and the fixture, and wherein the system further comprises a second stress absorption layer that is positioned between the bottom layer and the fixture.
5. A system for bonding components, the system comprising:
a first component;
a second component;
a device comprising:
a chuck including:
a top layer comprising a first material, wherein the top layer includes a first layer and second layer, the first layer of the top layer comprises zirconia, and the second layer of the top layer comprises machinable glass ceramic:
a bottom layer comprising a second material different from the first material wherein the bottom layer comprises a translucent material;
a vacuum hole; and
a fixture for holding the chuck;
a first stress absorption layer positioned between the fixture and an external surface of the chuck;
a pick up tool; and
an assembly heating element,
wherein the pick up tool is configured to:
pick up the first component and place it on the vacuum hole of the chuck,
pick up and bring the second component into contact with the first component,
wherein the assembly heating element is configured to heat the first component to thereby bond the first and second component.
6. The system of claim 1 , wherein the fixture for holding the chuck further comprises at least one alignment feature for adjusting a position of the chuck.
7. The system of claim 1 , wherein the top layer is substantially parallel to the bottom layer.
8. The system of claim 1 , wherein the top layer and bottom layer are each substantially flat.
9. The system of claim 1 further comprising a fastener assembly, the fastener assembly connecting the top layer and the bottom layer.