IP Library Patent Application 15876120
Patent Application
App. No. 15/876,120

COMPOSITION OF MATTER AND USE THEREOF

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Patent No.
US None
App. No.
15/876,120
Abstract

Embodiments of the disclosure pertain to a composition of matter having a matrix, a thickener, a strengthener, and a soluble medium. The matrix may be about 100 parts by weight of a low viscosity cycloaliphatic epoxy resin with an anhydride curing agent. The thickener may be about 10-20 parts by weight of an additive comprising a clay. The strengthener may be about 5-10 parts by weight of a glass. The soluble medium may be about 20-30 parts by weight of a water-soluble fiber.

Claims (45)

1 . A composition of matter comprising:

an epoxy system comprising an epoxy resin and a hardener;

an additive comprising a clay;

a soluble medium; and

a glass.

2 . The composition of claim 1 , wherein the soluble medium comprises a plurality of soluble fibers, wherein the clay comprises modified montmorillonite, wherein the glass comprises high-strength, hollow glass microspheres with an average diameter of about 20 to about 25 microns, and wherein the hardener comprises an anhydride.

3 . The composition of claim 2 , wherein the plurality of soluble fibers comprises sodium polyacrylate fibers, and the length is in the range of about 0.5 mm to about 2 mm.

4 . The composition of claim 1 , wherein the epoxy system comprises about 100 parts by weight, wherein the epoxy resin comprises a low viscosity cycloaliphatic epoxy resin, wherein the hardener comprises an anhydride curing agent, wherein the additive comprises about 10-20 parts by weight, wherein the soluble medium comprises about 20-30 parts by weight, and further comprises a plurality of water-soluble fibers, wherein the glass comprises about 5-10 parts by weight, and wherein the glass comprises hollow glass spheres.

5 . The composition of claim 4 , wherein the clay comprises modified montmorillonite, wherein the hollow glass microspheres comprise an average diameter of about 20 to about 25 microns, wherein the plurality of soluble fibers comprises sodium polyacrylate fibers, and the length is in the range of about 0.5 mm to about 2 mm.

6 . A composition of matter comprising:

100 parts by weight of a low viscosity cycloaliphatic epoxy resin with an anhydride curing agent;

10-20 parts by weight of an additive comprising a clay;

20-30 parts by weight of a plurality of water-soluble fibers; and

5-10 parts by weight of a glass.

6 . The composition of claim 5 , wherein the clay comprises montmorillonite, wherein the glass comprises hollow-glass microspheres, and wherein the plurality of soluble fibers comprise a fiber length of less than 6 mm

7 . The composition of claim 6 , wherein the plurality of soluble fibers comprises sodium polyacrylate fibers.

8 . The composition of claim 5 , wherein the clay comprises montmorillonite, wherein the glass comprises high-strength, hollow glass microspheres with an average diameter of about 20 to about 25 microns, wherein the plurality of soluble fibers comprises sodium polyacrylate fibers, and a length of each of the plurality of soluble fibers is in the range of about 0.5 mm to about 2 mm.

9 . A method of curing a composition, the method comprising:

heating an oven to an inner oven temperature in the range of about 70° F. to about 100° F.;

placing the composition into the oven;

heating the oven with a ramp up about 0.2-2° F./min to a next inner oven temperature in a first predetermined range of about 120° F. to about 200° F.;

holding the oven in the first predetermined range for a first predetermined amount of soak time of about 30 minutes to about 120 minutes;

heating the oven with a ramp up about 0.2-2° F./min to a second inner oven temperature in a second predetermined range of about 160° F. to about 250° F.;

heating the oven with a ramp up about 1-4° F./min to a third inner oven temperature in a third predetermined range of about 250° F. to about 350° F.;

holding the oven in the third predetermined range for about 30 minutes to about 120 minutes; and

cooling the oven with a ramp down at a rate of about 0.2-2° F./min to a temperature in the range of about 70° F. to about 100° F.

10 . The method of claim 9 , wherein the composition comprises:

an epoxy system comprising an epoxy resin and a hardener;

an additive comprising a clay;

a soluble medium; and

a glass.

11 . The method of claim 9 , wherein the method comprises:

100 parts by weight of a low viscosity cycloaliphatic epoxy resin with an anhydride curing agent;

about 10-20 parts by weight of an additive comprising clay;

about 20-30 parts by weight of a water-soluble fiber; and

about 5-10 parts by weight of a glass.

12 . A composition of matter comprising:

100 parts by weight of a low viscosity cycloaliphatic epoxy resin with an anhydride curing agent;

about 10-20 parts by weight of an additive comprising a clay;

about 20-30 parts by weight of a water-soluble fiber; and

about 5-10 parts by weight of a glass.

13 . The composition of claim 12 , wherein the water-soluble fiber comprises sodium polyacrylate fibers having a fiber length in the range of about 0.5 to about 6 mm.

14 . The composition of claim 13 , wherein the glass comprises high-strength, hollow-glass spheres of an average diameter of 22 microns.

15 . The composition of claim 12 , wherein the clay comprises montmorillonite, wherein the glass comprises hollow-glass microspheres, and wherein the water-soluble fiber comprises sodium polyacrylate fibers having a fiber length in the range of about 0.5 to about 6 mm.

16 . The composition of claim 12 , wherein the clay comprises montmorillonite, wherein the glass comprises high-strength, hollow glass microspheres with an average diameter of about 20 to about 25 microns, wherein the water-soluble fiber comprises sodium polyacrylate fibers, and a length of each of the plurality of soluble fibers is in the range of about 0.5 mm to about 2 mm.

Assignments (4)
CHANGE OF NAME Recorded Oct 11, 2019
From: DOWNHOLE TECHNOLOGY, LLC
To: THE WELLBOSS COMPANY, LLC
Reel/Frame 050690/0537 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 21, 2018
From: DAVIES, EVAN LLOYD; VANLUE, DUKE; HOU, YANAN; HUGHES, DAVID; LI, LIGUO
To: DOWNHOLE TECHNOLOGY, LLC
Reel/Frame 044989/0471 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 21, 2018
From: DAVIES, EVAN LLOYD; HOU, YANAN; VANLUE, DUKE
To: DOWNHOLE TECHNOLOGY, LLC
Reel/Frame 044989/0600 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 21, 2018
From: LI, LIGUO; HUGHES, DAVID; HOU, YANAN; DAVIES, EVAN LLOYD; VANLUE, DUKE
To: DOWNHOLE TECHNOLOGY, LLC
Reel/Frame 044990/0165 →