Sputtering target having RFID information
A method for affixing an RFID tag to sputtering targets is disclosed. A cavity is formed on the back of the backing plate adjacent to the outer edge. Within the cavity, an RFID tag is secured with an encapsulant. The encapsulant is cured with the RFID tag capable of communicating with an associated reader through the encapsulant.
1. A sputtering target, comprising:
a backing plate including a cavity;
an RFID tag positioned within the cavity; and
radio frequency transparent ultraviolet curable epoxy or a radio frequency transparent ultraviolet curable silicone encapsulant substantially encapsulating the RFID tag within the cavity.
2. The sputtering target of claim 1 , wherein the cavity is located adjacent an outer circumference of a bottom of the backing plate, and wherein the RFID tag is centered with the cavity.
3. The sputtering target of claim 2 , wherein the RFID tag is positioned on a bottom of the cavity.
4. The sputtering target of claim 2 , wherein the RFID tag is positioned within the cavity having an air gap in an X direction in the range of 2 to 3 mm, and positioned within the cavity having an air gap in a Y direction in the range of 2 to 3 mm.
5. A backing plate for a sputtering target, comprising:
a cavity formed adjacent an outer circumference of a bottom of the backing plate;
an RFID tag positioned on a bottom of the cavity, wherein the RFID tag is centered within the cavity; and
a radio frequency transparent ultraviolet curable epoxy or a radio frequency transparent ultraviolet curable silicone encapsulant substantially encapsulating the RFID tag within the cavity.
6. The backing plate of claim 5 , wherein a top of the encapsulant is flush with the bottom of the backing plate.
7. The backing plate of claim 6 , wherein the RFID tag is positioned within the cavity having an air gap in an X direction in the range of 2 to 3 mm, and an air gap in a Y direction in the range of 2 to 3 mm.
8. A sputtering target backing plate comprising an RFID tag substantially encapsulated within a cavity formed thereon, wherein the RFID tag is substantially encapsulated via radio frequency transparent encapsulant allowing bidirectional wireless communications between an external device and the RFID tag, wherein the radio frequency transparent encapsulant is selected from the group comprising an ultraviolet curable epoxy, an ultraviolet curable silicone, a heat curable epoxy, a heat curable silicone, or a two stage curable epoxy.