IP Library Granted Patent US 10,217,906
Granted Patent B2
US 10,217,906 · App. 15/880,067 · Granted Feb 26, 2019

Light-emitting device

Inventors: Chao-Hsing Chen (Hsinchu, TW); Jia-Kuen Wang (Hsinchu, TW); Tzu-Yao Tseng (Hsinchu, TW); Wen-Hung Chuang (Hsinchu, TW); Cheng-Lin Lu (Hsinchu, TW)
Assignee: EPISTAR CORPORATION
H01L33/405H01L33/22H01L33/42H01L33/46H01L33/62F21K9/23F21K9/232F21K9/69F21Y2115/10H01L33/0075H01L33/06H01L33/12H01L33/32H01L2933/0016H01L2933/0025
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Quick Facts
Patent No.
US 10,217,906
App. No.
15/880,067
Granted
Feb 26, 2019
Kind
B2
Abstract

A light-emitting device includes a semiconductor structure including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a surrounding part surrounding the semiconductor structure and exposing a surface of the first semiconductor layer; a first insulating structure formed on the semiconductor structure, including a plurality of protrusions covering the surface of the first semiconductor layer and a plurality of recesses exposing the surface of the first semiconductor layer; a first contact portion formed on the surrounding part and contacting the surface of the first semiconductor layer by the plurality of recesses; a first pad formed on the semiconductor structure; and a second pad formed on the semiconductor structure.

Claims (32)

1. A light-emitting device, comprising:

a semiconductor structure comprising a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer;

a surrounding part surrounding the semiconductor structure and exposing a surface of the first semiconductor layer;

a first insulating structure formed on the semiconductor structure, including a plurality of protrusions covering portions of the surface of the first semiconductor layer and a plurality of recesses exposing other portions of the surface of the first semiconductor layer;

a first contact portion formed on the surrounding part and contacting the other portions of the surface of the first semiconductor layer by the plurality of recesses;

a first pad formed on the semiconductor structure; and

a second pad formed on the semiconductor structure.

2. The light-emitting device according to claim 1 , further comprising a second contact portion formed at a geometric center of the semiconductor structure in a top view of the light-emitting device.

3. The light-emitting device according to claim 1 , further comprising a third contact portion formed on the semiconductor structure, wherein the third contact portion is surrounded by the first contact portion.

4. The light-emitting device according to claim 1 , further comprising a second contact portion formed at a geometric center of the semiconductor structure, wherein the second contact portion is connected to the first contact portion, and/or further comprising a third contact portion formed on the semiconductor structure, wherein the third contact portion is surrounded by the first contact portion and connected to the second contact portion.

5. The light-emitting device according to claim 1 , further comprising one or a plurality of vias penetrating the second semiconductor layer and the active layer to expose the first semiconductor layer.

6. The light-emitting device according to claim 1 , wherein the first insulating structure covers corners of the surface of the first semiconductor layer.

7. The light-emitting device according to claim 1 , wherein the plurality of protrusions and the plurality of recesses are alternately arranged.

8. The light-emitting device according to claim 1 , further comprising a second insulating structure formed on the surrounding part and covering the first insulating structure, wherein the second insulating structure comprises a shape corresponding to a shape of the first insulating structure.

9. The light-emitting device according to claim 1 , further comprising a third insulating structure formed on the semiconductor structure, wherein the third insulating structure comprises a first opening and a second opening, and the first pad is formed in the first opening and the second pad is formed in the second opening.

10. The light-emitting device according to claim 1 , wherein the first contact portion comprises a concave-convex top surface disposed along a periphery of the first insulating structure.

11. A light-emitting device, comprising:

a semiconductor structure comprising a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer;

a surrounding part surrounding the semiconductor structure and exposing a surface of the first semiconductor layer;

a first insulating structure formed on the semiconductor structure, covering corners of the surface of the first semiconductor layer and exposing portions at edges of the surface of the first semiconductor layer;

a first contact portion formed on the surrounding part and contacting the portions at edges of the surface of the first semiconductor layer;

a first pad formed on the semiconductor structure; and

a second pad formed on the semiconductor structure.

12. The light-emitting device according to claim 11 , further comprising a second contact portion formed at a geometric center of the semiconductor structure in a top view of the light-emitting device.

13. The light-emitting device according to claim 11 , further comprising a third contact portion formed on the semiconductor structure, wherein the third contact portion is surrounded by the first contact portion.

14. The light-emitting device according to claim 11 , further comprising a second contact portion formed at a geometric center of the semiconductor structure, wherein the second contact portion is connected to the first contact portion.

15. The light-emitting device according to claim 11 , further comprising one or a plurality of vias penetrating the second semiconductor layer and the active layer to expose the first semiconductor layer.

16. The light-emitting device according to claim 11 , wherein the first insulating structure comprises a plurality of protrusions covering the surface of the first semiconductor layer and a plurality of recesses exposing the surface of the first semiconductor layer.

17. The light-emitting device according to claim 16 , wherein the plurality of protrusions and the plurality of recesses are alternately arranged.

18. The light-emitting device according to claim 16 , further comprising a second insulating structure formed on the surrounding part and covering the first insulating structure, wherein the second insulating structure comprises a shape corresponding to a shape of the first insulating structure.

19. The light-emitting device according to claim 11 , further comprising a third insulating structure formed on the semiconductor structure, wherein the third insulating structure comprises a first opening and a second opening, and the first pad is formed in the first opening and the second pad is formed in the second opening.

20. The light-emitting device according to claim 11 , wherein the first contact portion comprises a concave-convex top surface disposed along a periphery of the first insulating structure.

Assignments (3)
CHANGE OF NAME Recorded Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSINGNEE ADDRESS PREVIOUSLY RECORDED AT REEL: 044788 FRAME: 0600. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 18, 2018
From: CHEN, CHAO-HSING; WANG, JIA-KUEN; TSENG, TZU-YAO; CHUANG, WEN-HUNG; LU, CHENG-LIN
To: EPISTAR CORPORATION
Reel/Frame 046890/0732 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2018
From: CHEN, CHAO-HSING; WANG, JIA-KUEN; CHUANG, WEN-HUNG; TSENG, TZU-YAO; LU, CHENG-LIN
To: EPISTAR CORPORATION
Reel/Frame 044788/0600 →
Continuity (2)
Provisional Application 62450860 · Jan 26, 2017
Related Publication 20180212125A1 · Jul 26, 2018
Cited By (1)
US 12,230,744