Light-emitting device
View Patent ↗A light-emitting device includes a semiconductor structure including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a via penetrating the second semiconductor layer and the active layer to expose a surface of the first semiconductor layer; a first electrode formed in the via and on the second semiconductor layer; a second electrode formed on the second semiconductor layer; and an insulating structure covering the first electrode, the second electrode and the semiconductor structure and including a first opening to expose the first electrode and a second opening to expose the second electrode, wherein the first electrode and the second electrode respectively include a metal layer contacting the insulating layer, the metal layer includes a material including a surface tension value larger than 1500 dyne/cm and a standard reduction potential larger than 0.3 V.
1. A light-emitting device, comprising:
a semiconductor structure comprising a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer;
a part penetrating the second semiconductor layer and the active layer to expose a surface of the first semiconductor layer;
a first electrode formed in the part and on the second semiconductor layer;
a second electrode formed on the second semiconductor layer;
a third insulating structure covering the first electrode, the second electrode and the semiconductor structure, the third insulating structure comprising a first opening to expose the first electrode and a second opening to expose the second electrode, wherein the first electrode and the second electrode respectively comprises a metal layer contacting the third insulating structure, the metal layer comprises a material comprising a surface tension value larger than 1500 dyne/cm and a standard reduction potential larger than 0.3 V;
a first thin pad formed in the first opening, the first thin pad having a thickness smaller than a thickness of the third insulating structure; and
a second thin pad formed in the second opening, and the second thin pad having a thickness smaller than the thickness of the third insulating structure,
wherein the third insulating structure comprises a top surface, the first thin pad extends onto the top surface of the third insulating structure or the second thin pad extends onto the top surface of the third insulating structure.
2. The light-emitting device according to claim 1 , wherein the second electrode is surrounded by the first electrode in a top view of the light-emitting device.
3. The light-emitting device according to claim 1 , wherein the part is at an outer periphery of the semiconductor structure and surrounds the outer periphery of the semiconductor structure.
4. The light-emitting device according to claim 3 , wherein the first electrode surrounds the outer periphery of the semiconductor structure.
5. The light-emitting device according to claim 1 , wherein the first electrode and the second electrode occupy 10˜20% of a light-emitting area of the light-emitting device.
6. The light-emitting device according to claim 1 , wherein the first electrode and the second electrode are separated apart by a distance smaller than 50 μm.
7. A light-emitting device, comprising:
a semiconductor structure comprising a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer;
a surrounding part exposing the first semiconductor layer, wherein the surrounding part is at an outer periphery of the semiconductor structure and surrounds the outer periphery of the semiconductor structure;
a first electrode formed at the surrounding part and on the second semiconductor layer;
a second electrode formed on the second semiconductor layer;
a third insulating structure covering the first electrode, the second electrode and the semiconductor structure, the third insulating structure comprising a first opening to expose the first electrode and a second opening to expose the second electrode;
a first thin pad formed in the first opening, the first thin pad having a thickness smaller than a thickness of the third insulating structure; and
a second thin pad formed in the second opening, and the second thin pad having a thickness smaller than the thickness of the third insulating structure,
wherein the third insulating structure comprises a top surface, the first thin pad extends onto the top surface of the third insulating structure or the second thin pad extends onto the top surface of the third insulating structure.
8. The light-emitting device according to claim 7 , wherein the second electrode is surrounded by the first electrode in a top view of the light-emitting device.
9. The light-emitting device according to claim 7 , wherein the semiconductor structure comprises a via penetrating the second semiconductor layer and the active layer to expose a surface of the first semiconductor layer.
10. The light-emitting device according to claim 7 , wherein the first electrode and the second electrode occupy 40% above of a light-emitting area of the light-emitting device.
11. The light-emitting device according to claim 7 , further comprising a second insulating structure formed under the second electrode, wherein the second insulating structure comprises multiple sidewalls covered by the second electrode.
12. The light-emitting device according to claim 7 , wherein the first electrode and the second electrode are separated apart by a distance smaller than 50 μm.
13. A light-emitting device, comprising:
a semiconductor structure comprising a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer;
a first electrode formed on the first semiconductor layer and electrically connected to the first semiconductor layer;
a second electrode formed on the second semiconductor layer and electrically connected to the second semiconductor layer;
a third insulating structure covering the first electrode, the second electrode and the semiconductor structure, the third insulating structure comprising a first opening to expose the first electrode and a second opening to expose the second electrode;
a first thin pad formed in the first opening, the first thin pad having a thickness smaller than a thickness of the third insulating structure; and
a second thin pad formed in the second opening, and the second thin pad having a thickness smaller than the thickness of the third insulating structure,
wherein the third insulating structure comprises a top surface, the first thin pad extends onto the top surface of the third insulating structure or the second thin pad extends onto the top surface of the third insulating structure.
14. The light-emitting device according to claim 13 , wherein the second electrode is surrounded by the first electrode in a top view of the light-emitting device.
15. The light-emitting device according to claim 13 , wherein the semiconductor structure comprises a part penetrating the second semiconductor layer and the active layer to expose a surface of the first semiconductor layer.
16. The light-emitting device according to claim 15 , wherein the part is at an outer periphery of the semiconductor structure and surrounds the outer periphery of the semiconductor structure.
17. The light-emitting device according to claim 16 , wherein the first electrode is formed at the part.
18. The light-emitting device according to claim 15 , wherein the first electrode is formed at the part.
19. The light-emitting device according to claim 13 , wherein the first electrode and the second electrode occupy 40% above of a light-emitting area of the light-emitting device.