Systems and methods for robotic arm sensing
In an embodiment, a robotic arm includes: a base; at least one link secured to the base; a gripper secured to the at least one link, wherein: the gripper comprises a finger, the gripper is configured to secure a wafer while the at least one link is in motion, and the gripper is configured to release the wafer while the at least one link is stopped, a sensor disposed on the finger, the sensor configured to collect sensor data characterizing the robotic arm's interaction with a semiconductor processing chamber while the wafer is secured using the finger.
1. A robotic arm, comprising:
a base;
at least one link secured to the base;
a gripper secured to the at least one link, wherein:
the gripper comprises a finger,
the gripper is configured to secure a wafer while the at least one link is in motion,
and the gripper is configured to release the wafer while the at least one link is stopped; and
a first sensor disposed on the finger, the first sensor configured to collect first sensor data characterizing a condition within a semiconductor processing chamber while the wafer is secured using the finger, wherein the first sensor comprises an electronic nose configured to measure a concentration of a gas molecule around the gripper.
2. The robotic arm of claim 1 , further comprising a second sensor configured to collect second sensor data, wherein the second sensor data indicates a weight of the wafer.
3. The robotic arm of claim 1 , further comprising a second sensor configured to collect second sensor data, wherein the second sensor data characterizes a spatial relationship between the gripper and a surface of the semiconductor processing chamber.
4. The robotic arm of claim 1 , further comprising a second sensor, wherein the second sensor is at least one of: a frequency modulated continuous wave (FMCW) device, a charge coupled device (CCD), a weight sensor, an infrared range finder, and an infrared thermometer.
5. The robotic arm of claim 1 , the gripper is configured to reach within the semiconductor processing chamber.
6. The robotic arm of claim 1 , wherein the at least one link is configured to move the gripper between multiple semiconductor processing chambers.
7. A system, comprising:
a stabilization base;
a link secured to the stabilization base;
a gripper hand secured to the link, wherein:
the gripper hand is configured to secure a wafer while the link is in motion,
the gripper hand is configured to release the wafer while the link is stopped; and
a first sensor is disposed on the gripper hand, wherein the first sensor comprises an electronic nose configured to measure a concentration of a gas molecule around the gripper.
8. The system of claim 7 , wherein the gripper hand comprises a set of fingers configured to secure the wafer or to release the wafer.
9. The system of claim 8 , wherein the first sensor is disposed on a finger of the set of fingers.
10. The system of claim 9 , the finger comprises articulated joints and the first sensor is part of one of the articulated joints.
11. The system of claim 8 , wherein the first sensor is disposed on the gripper hand apart from the set of fingers.
12. The system of claim 7 , further comprising a second sensor configured to collect data indicating a weight of the wafer.
13. The system of claim 7 , further comprising a second sensor configured to collect data indicating a spatial relationship between the gripper hand and a semiconductor processing chamber surface.
14. The system of claim 7 , further comprising a second sensor, wherein the second sensor is at least one of: a frequency modulated continuous wave (FMCW) sensor, a charge coupled device (CCD), a weight sensor, an infrared range finder, and an infrared thermometer.
15. A robotic arm, comprising:
a base;
at least one link secured to the base;
a gripper secured to the at least one link, wherein:
the gripper is configured to secure a wafer while the at least one link is in motion,
and the gripper is configured to release the wafer while the at least one link is stopped; and
a first sensor disposed on the gripper, the first sensor configured to collect first sensor data that indicates a weight of the wafer.
16. The robotic arm of claim 15 , further comprising a second sensor configured to collect second sensor data that indicates a concentration of a gas molecule around the gripper.
17. The robotic arm of claim 15 , further comprising a second sensor configured to collect second sensor data that characterizes a spatial relationship between the gripper and a surface of the semiconductor processing chamber.
18. The robotic arm of claim 15 , further comprising a second sensor, wherein the second sensor is at least one of: a frequency modulated continuous wave (FMCW) device, a charge coupled device (CCD), an electronic nose sensor, an infrared range finder, and an infrared thermometer.
19. The robotic arm of claim 15 , the gripper is configured to reach within the semiconductor processing chamber.
20. The robotic arm of claim 15 , wherein the at least one link is configured to move the gripper between multiple semiconductor processing chambers.