IP Library Granted Patent US 10,490,710
Granted Patent B2
US 10,490,710 · App. 15/887,603 · Granted Nov 26, 2019

Hybrid chip-on-board LED module with patterned encapsulation

Inventors: Wouter Anthon Soer (Palo Alto, CA); Rene Helbing (Palo Alto, CA); Guan Huang (Santa Clara, CA)
Assignee: Lumileds LLC
H01L33/508H01L25/0753H01L33/54H05B33/0845H05B37/0209H01L33/50H01L33/502H01L33/52H01L2924/0002H01L2933/005H01L2933/0041H01L2933/0091
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Quick Facts
Patent No.
US 10,490,710
App. No.
15/887,603
Granted
Nov 26, 2019
Kind
B2
Abstract

Different wavelength conversion materials, or different concentrations of a wavelength conversion material are used to encapsulate the light emitting elements of different colors of a hybrid light emitting module. In an embodiment of this invention, the light emitting elements of a particular color are encapsulated with a transparent encapsulant, while the light emitting elements of a different color are encapsulated with a wavelength conversion encapsulant. In another embodiment of this invention, a particular set of light emitting elements of different colors is encapsulated with a different encapsulant than another set of light emitting elements.

Claims (28)

1. A lighting module comprising:

a first plurality of light emitting elements that emit a first color;

a second plurality of light emitting elements that emit a second color;

a substrate upon which the first and second pluralities of light emitting elements are arranged; and

an encapsulation layer that includes a first encapsulant positioned over each of the light emitting elements of the first plurality of light emitting elements and a second encapsulant positioned over each of the light emitting elements of the second plurality of light emitting elements and comprising a plurality of domes, the first encapsulant further includes a concentration of wavelength conversion material that is substantially greater than a concentration of wavelength conversion material in the second encapsulant and fills regions between the domes.

2. The lighting module of claim 1 , wherein the first color and the second color are the same.

3. The lighting module of claim 1 , further comprising a controller that controls a ratio of light output of the light emitting elements of the first plurality of light emitting elements and the light emitting elements of the second plurality of light emitting elements.

4. The lighting module of claim 1 , wherein the wavelength conversion material in the first encapsulant comprises phosphor.

5. The lighting module of claim 4 , wherein the wavelength conversion material in the second encapsulant comprises phosphor.

6. The lighting module of claim 1 , further including a third plurality of light emitting elements of the first color, wherein the second encapsulant is positioned over each of the light emitting elements of the third plurality of light emitting elements.

7. The lighting module of claim 1 , wherein the second encapsulant includes a scattering agent that is not included in the first encapsulant.

8. The lighting module of claim 1 , wherein the second encapsulant is shaped to enhance light extraction from the second encapsulant.

9. The lighting module of claim 1 , wherein a profile shape of the first encapsulant differs from a profile shape of the second encapsulant.

10. The lighting module of claim 1 , wherein the light emitting elements of the first color emit blue light and the light emitting elements of the second color emit red light.

11. The lighting module of claim 1 , wherein the light emitting elements of the first color emit blue light and the light emitting elements of the second color emit violet light.

12. The lighting module of claim 1 , wherein the first encapsulant and the second encapsulant are contained in an enclosure that is situated on the substrate.

13. A method for producing a lighting module comprising:

situating a first plurality of light emitting elements that emit a first color and a second plurality of light emitting elements that emit a second color upon a substrate; and

situating over the first and second pluralities of light emitting elements an encapsulation layer that includes a first encapsulant positioned over each of the light emitting elements of the first plurality of light emitting elements and a second encapsulant positioned over each of the light emitting elements of the second plurality of light emitting elements and comprising a plurality of domes, the first encapsulant including a concentration of wavelength conversion material that is substantially greater than a concentration of wavelength conversion material in the second encapsulant and fills regions between the domes.

14. The method of claim 13 , further comprising controlling, via a controller, a ratio of light output of the light emitting elements of the first plurality of light emitting elements and the light emitting elements of the second plurality of light emitting elements.

15. The method of claim 13 , wherein the first color and the second color are the same.

16. The method of claim 13 , wherein the light emitting elements of the first color emit blue light and the light emitting elements of the second color emit violet light.

17. The method of claim 13 , wherein situating the encapsulation layer that includes the first encapsulant and a second encapsulant comprises laminating a partially cured silicone sheet.

18. The method of claim 13 , wherein situating the encapsulation layer that includes the first encapsulant and a second encapsulant comprises:

laminating a first preformed sheet comprising the first encapsulant over the first plurality of light emitting elements; and

laminating a second preformed sheet comprising the second encapsulant over the second plurality of light emitting elements.

19. The method of claim 13 , wherein the second encapsulant includes a scattering agent that is not included in the first encapsulant.

20. The method of claim 13 , wherein the second encapsulant is shaped to enhance light extraction from the second encapsulant.

Assignments (6)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
PATENT SECURITY AGREEMENT Recorded Dec 9, 2022
From: LUMILEDS, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 062114/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2019
From: SOER, WOUTER ANTHON; HELBING, RENE; HUANG, GUAN
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 050866/0848 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2019
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 050866/0865 →
Continuity (3)
Continuation 15106667
Provisional Application 61929530 · Jan 21, 2014
Related Publication 20180175256A1 · Jun 21, 2018