Printhead having heated shield plate
An inkjet printhead includes: a manifold having a plurality of ink outlets defined in a manifold surface; a plurality of printhead chips mounted to the manifold surface and aligned with the ink outlets; a PCB mounted to the manifold surface and offset from the ink outlets, the PCB being electrically connected to the printhead chips; and a shield plate covering the PCB. The shield plate has one face in thermal contact with the PCB and an exposed opposite face defining a lower surface of the printhead.
1. An inkjet printhead comprising:
a manifold having a plurality of ink outlets defined in a manifold surface;
a plurality of printhead chips mounted to the manifold surface and aligned with the ink outlets;
a PCB mounted to the manifold surface and offset from the ink outlets, the PCB being electrically connected to the printhead chips; and
a shield plate covering the PCB,
wherein the shield plate has one face in thermal contact with the PCB and an exposed opposite face defining a lower surface of the printhead.
2. The inkjet printhead of claim 1 , wherein the shield plate is electrically insulating.
3. The inkjet printhead of claim 1 , wherein the printhead chips are mounted to the manifold surface via a shim.
4. The inkjet printhead of claim 3 , wherein the shield plate intimately contacts a lower surface of the PCB.
5. The inkjet printhead of claim 1 , wherein the PCB is a rigid PCB.
6. The inkjet printhead of claim 1 , wherein the lower surface of the PCB is coplanar with a lower surface of the shim.
7. The inkjet printhead of claim 6 , wherein the PCB is thicker than the shim and the manifold surface is stepped to accommodate the PCB and the shim having respective coplanar lower surfaces.
8. The inkjet printhead of claim 6 , wherein the shield plate is bonded to the PCB and part of the shim.
9. The inkjet printhead of claim 6 , wherein the shim has at least one void region offset from the printhead chips, the void region thermally isolating part of the shield plate from the manifold.
10. The inkjet printhead of claim 1 comprising a row of printhead chips, wherein the PCB extends longitudinally adjacent the row of printhead chips.
11. The inkjet printhead of claim 10 comprising first and second rows of printhead chips, the first row of printhead chips having a respective first PCB and the second row of printhead chips having a respective second PCB, wherein the first and second PCBs are positioned at opposite distal longitudinal sides of the first and second rows of printhead chips.
12. The inkjet printhead of claim 11 , wherein the first and second PCBs wrap at least partially around ends of the first and second rows of printhead chips.
13. The inkjet printhead of claim 11 , wherein a central longitudinal region is defined between the first and second rows of printhead chips.
14. The inkjet printhead of claim 13 , wherein the shield plate is a perimeter shield plate covering the first and second PCBs, the perimeter shield plate having a central leg covering the central longitudinal region.
15. The inkjet printhead of claim 14 , wherein the first and second rows of printhead chips are mounted to the manifold via a shim, and wherein the shim has at least one void region coincident with the central longitudinal region, the void region thermally isolating the central leg of the shield plate from the manifold.
16. The inkjet printhead of claim 1 , wherein the shim has a thickness in the range of 100 to 1000 microns.