IP Library Granted Patent US 10,431,609
Granted Patent B2
US 10,431,609 · App. 15/890,054 · Granted Oct 1, 2019

Array substrate, display panel with frit at cutting edge for narrow bezel

Inventor: Yu Xin (Shanghai, CN)
Assignee: SHANGHAI TIANMA AM-OLED CO., LTD.
H01L27/1262G02F1/136227H01L23/3121H01L27/124H01L27/3244H01L27/3258H01L51/5246H01L51/56H01L27/1214
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,431,609
App. No.
15/890,054
Granted
Oct 1, 2019
Kind
B2
Abstract

An array substrate, a display panel, an encapsulation method for the display panel, and a display apparatus are provided. The array substrate comprises a display region and an encapsulation region divided into a first region away from the display region and a second region adjacent to the display region. The encapsulation region includes a metal layer configured only in the second region, a frit solution layer configured in both the first region and the second region, and a cutting edge configured in the first region. The array substrate which has been aligned and bonded with an encapsulation cover is cut along the cutting edge.

Claims (40)

1. An array substrate, comprising:

a display region; and

an encapsulation region divided into a first region away from the display region and a second region adjacent to the display region,

wherein:

the encapsulation region includes a metal layer configured only in the second region, a frit solution layer configured in both the first region and the second region, and a cutting edge configured in the first region, the cutting edge disposed along a part of the frit solution layer in the first region and having a distance from a border line of the first region away from the second region; and

the array substrate is cut along the cutting edge.

2. The array substrate according to claim 1 , wherein:

a distance from the cutting edge to a border line between the second region and the first region is shorter than one half of a width of the first region.

3. The array substrate according to claim 1 , wherein:

the frit solution layer in the first region and the frit solution layer in the second region have an integrated structure; and

the frit solution layer in the second region covers the metal layer.

4. The array substrate according to claim 3 , wherein:

a width of the first region is smaller than a width of the second region; and

a thickness of the frit solution layer in the first region is smaller than a thickness of the frit solution layer in the second region.

5. The array substrate according to claim 4 , wherein:

the width of the first region is approximately between 20 μm and 50 μm; and

the width of the second region is approximately between 100 μm and 250 μm.

6. The array substrate according to claim 5 , wherein:

the thickness of the frit solution layer in the first region is approximately between 1 μm and 5 μm; and

the thickness of the frit solution layer in the second region is approximately between 5 μm and 10 μm.

7. The array substrate according to claim 6 , wherein:

a width of the metal layer is approximately between 100 μm and 400 μm.

8. The array substrate according to claim 7 , wherein:

the metal layer is formed with a plurality of holes;

a ratio of a sum of areas of the plurality of the holes over an area of the metal layer is configured to be approximately between 15% and 30%; and

a diameter of a hole is configured to be approximately between 40 μm and 45 μm.

9. The array substrate according to claim 8 , wherein:

the metal layer is configured with a rough surface in an area excluding the plurality of holes.

10. The array substrate according to claim 1 , further including:

a gate electrode layer; and

a source-drain electrode layer, wherein the metal layer is formed coplanar with either the gate electrode layer or the source-drain electrode layer.

11. The array substrate according to claim 1 , wherein:

a material of the frit solution layer includes at least one of Bi 2 O 3 , ZnO, Al 2 O 3 , and MnO 2 .

12. A display panel, comprising an array substrate including:

a display region; and

an encapsulation region divided into a first region away from the display region and a second region adjacent to the display region,

wherein:

the encapsulation region includes a metal layer configured only in the second region, a frit solution layer configured in both the first region and the second region, and a cutting edge configured in the first region, the cutting edge disposed along a part of the frit solution layer in the first region and having a distance from a border line of the first region away from the second region; and

the array substrate is cut along the cutting edge.

13. A display apparatus, comprising the display panel according to claim 12 .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2022
From: SHANGHAI TIANMA AM-OLED CO.,LTD.
To: WUHAN TIANMA MICRO-ELECTRONICS CO., LTD.; WUHAN TIANMA MICROELECTRONICS CO., LTD. SHANGHAI BRANCH
Reel/Frame 059498/0307 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2018
From: XIN, YU
To: SHANGHAI TIANMA AM-OLED CO., LTD.
Reel/Frame 044859/0128 →
Priority Claims (1)
CN 2017 1 0822202 · Sep 13, 2017 · national
Continuity (1)
Related Publication 20190081091A1 · Mar 14, 2019