Layered cooling structure including insulative layer and multiple metallization layers

1. An assembly comprising:

at least one heat emitting device; and

a continuous conformal cooling structure adhering directly to and conforming to surfaces of at least a portion of the at least one heat emitting device, the cooling structure including:

a thermally-conductive, electrically-insulative layer adhering directly to surfaces of the at least one heat emitting device to provide an electrically nonconductive, continuous, conformal layer covering all such surfaces;

an inner metallization layer adhered directly to surfaces of at least a portion of the insulative layer; and

an outer metallization layer adhered directly to surfaces of the inner metallization layer to provide a thermally conductive layer covering such surfaces, wherein the outer metallization layer is exposed directly to an environment exterior of the assembly,

wherein the at least one heat emitting device is physically attached to a substrate, wherein at least a portion of the heat emitting device is positioned along a first side of the substrate, and wherein a portion of the insulative layer extends from the first side of the substrate to completely cover the at least a portion of the heat emitting device positioned along the first side of the substrate.

2. The assembly of claim 1 wherein the outer metallization layer is also adhered directly to any surfaces of the insulative layer not adhered to by the inner metallization layer.

3. The assembly of claim 1 wherein at least a portion of the outer metallization layer is selectively adhered directly to a portion of the insulative layer not covered by the inner metallization layer.

4. The assembly of claim 1 wherein the insulative layer is structured to completely cover the at least one heat emitting device so as to prevent physical contact between the portions of the at least one heat emitting device covered by the insulative layer, and a coolant medium surrounding the assembly.

5. The assembly of claim 1 wherein the outer metallization layer is formed from a different material than the inner metallization layer.

6. The assembly of claim 1 including a first heat generating device and a second heat generating device connected to the first heat generating device.

7. The assembly of claim 1 wherein the inner metallization layer is formed from at least one of titanium, gold, and copper.

8. The assembly of claim 1 wherein the outer metallization layer is formed from at least one of Aluminum, Copper, Nickel, and Titanium.

9. The assembly of claim 1 wherein at least a portion of at least one additional heat emitting device is attached to the substrate along a second side of the substrate opposite the first side of the substrate, and wherein a portion of the insulative layer extends from the second side of the substrate to completely cover the at least a portion of the heat emitting device positioned along the second side of the substrate.

10. The assembly of claim 1 wherein the portion of the insulative layer extending from the substrate to completely cover the at least a portion of the heat emitting device positioned along the first side of the substrate, is at least partially covered by the inner metallization layer.

11. The assembly of claim 1 wherein the portion of the insulative layer extending from the substrate to completely cover the at least a portion of the heat emitting device positioned along the first side of the substrate, is at least partially covered by the outer metallization layer.

12. The assembly of claim 11 wherein the portion of the insulative layer extending from the substrate to completely cover the at least a portion of the heat emitting device positioned along the first side of the substrate, is completely covered by the outer metallization layer.

13. The assembly of claim 1 , wherein the insulative layer has properties that enable it to be applied to a surface of the heat emitting device using vacuum deposition polymerization techniques.

14. The assembly of claim 1 , wherein the insulative layer has properties that enable it to be applied to a surface of the heat emitting device using plasma-enhanced chemical vapor deposition techniques.

15. An assembly comprising:

at least one heat emitting device; and

a continuous conformal cooling structure adhering directly to and conforming to surfaces of at least a portion of the at least one heat emitting device, the cooling structure including:

a thermally-conductive, electrically-insulative layer adhering directly to surfaces of the at least one heat emitting device to provide an electrically nonconductive, continuous, conformal layer covering all such surfaces;

an inner metallization layer adhered directly to surfaces of at least a portion of the insulative layer; and

an outer metallization layer adhered directly to surfaces of the inner metallization layer to provide a thermally conductive layer covering such surfaces, wherein the outer metallization layer is exposed directly to an environment exterior of the assembly,

wherein at least one intersection is formed between a first exterior surface of the insulative layer and a second exterior surface of the insulative layer, and wherein the inner metallization layer conformally covers the at least one intersection and portions of the first and second exterior surfaces of the insulative layer adjacent the at least one intersection.

16. An assembly comprising:

at least one heat emitting device; and

a continuous conformal cooling structure adhering directly to and conforming to surfaces of at least a portion of the at least one heat emitting device, the cooling structure including:

a thermally-conductive, electrically-insulative layer adhering directly to surfaces of the at least one heat emitting device to provide an electrically nonconductive, continuous, conformal layer covering all such surfaces;

an inner metallization layer adhered directly to surfaces of at least a portion of the insulative layer; and

an outer metallization layer adhered directly to surfaces of the inner metallization layer to provide a thermally conductive layer covering such surfaces, wherein the outer metallization layer is exposed directly to an environment exterior of the assembly, and

wherein the inner metallization layer is applied along surfaces of the insulative layer opposite the at least one heat emitting device and opposite an element with which the at least one heat emitting device is in physical contact, adjacent a location where the surfaces of the at least one heat emitting device and the element approach closest to each other.

17. An assembly comprising:

at least one heat emitting device; and

a continuous conformal cooling structure adhering directly to and conforming to surfaces of at least a portion of the at least one heat emitting device, the cooling structure including:

a thermally-conductive, electrically-insulative layer adhering directly to surfaces of the at least one heat emitting device to provide an electrically nonconductive, continuous, conformal layer covering all such surfaces;

an inner metallization layer adhered directly to surfaces of at least a portion of the insulative layer; and

an outer metallization layer adhered directly to surfaces of the inner metallization layer to provide a thermally conductive layer covering such surfaces, wherein the outer metallization layer is exposed directly to an environment exterior of the assembly,

wherein the assembly further comprises at least one fin extending from the outer metallization layer, so as to facilitate heat transfer from the outer metallization layer to the at least one fin.

18. The assembly of claim 17 wherein the at least one fin is formed integrally with the outer metallization layer.

19. An assembly comprising:

at least one heat emitting device physically attached to a substrate, at least a portion of the at least one heat emitting device being positioned along a first side of the substrate;

a continuous conformal cooling structure including:

a thermally-conductive, electrically-insulative layer extending from the first side of the substrate to completely cover the at least a portion of the heat emitting device positioned along the first side of the substrate, the insulative layer adhering directly to surfaces of the at least one heat emitting device to provide an electrically nonconductive, continuous, conformal layer covering the at least a portion of the at least one heat emitting device; and

an inner metallization layer adhered directly to surfaces of at least a portion of the insulative layer directly opposite a location where the at least one heat emitting device is physically attached to the substrate; and

an outer metallization layer adhered directly to surfaces of the inner metallization layer to provide a thermally conductive layer covering such surfaces.