IP Library Granted Patent US 10,499,545
Granted Patent B2
US 10,499,545 · App. 15/892,712 · Granted Dec 3, 2019

Stacked module, stacking method, cooling/feeding mechanism, and stacked module mounting board

Inventor: Takaaki Nedachi (Tokyo, JP)
Assignee: NEC CORPORATION
H05K7/20509G06F1/20H05K1/0203H05K1/144H05K1/181H05K3/368H05K7/1417H05K2201/042H05K2201/10159H05K2201/10189H05K2201/10378H05K2201/10545H05K2201/10734
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Quick Facts
Patent No.
US 10,499,545
App. No.
15/892,712
Granted
Dec 3, 2019
Kind
B2
Abstract

A stacked module includes stacked multiple boards having components mounted thereon, a connection component electrically connecting the stacked boards, and a feeding/cooling mechanism configured to feed the boards and to cool the components mounted on the boards. The feeding/cooling mechanism includes a cooling member that is inserted between the stacked, electrically connected boards and that is in contact with and cools the components mounted on the boards and a feeding member that is in contact with and feeds the boards.

Claims (42)

1. A stacked module comprising:

a plurality of stacked boards having components mounted thereon;

a connector, which is a connection component electrically connecting the stacked boards and configured to transmit a signal; and

a feeding/cooling mechanism configured to feed the stacked boards and to cool the components mounted on the stacked boards, wherein:

the feeding/cooling mechanism includes a cooling member that is in contact with and configured to cool the components mounted on the stacked boards and a feeding member that is in contact with and feeds the stacked boards;

the feeding member includes sandwiching members that are disposed in positions corresponding to the stacked boards so as to sandwich the stacked boards by spring mechanisms;

the feeding member sandwiches the stacked boards by the sandwiching members and feeds the sandwiched stacked boards;

the stacked boards are rectangular in shape, and

the connector that is the connection component is disposed on an end portion of one short side of the stacked boards, and the feeding/cooling mechanism is disposed on an end portion of another short side of the stacked boards.

2. The stacked module according to claim 1 , wherein

the feeding member feeds the stacked boards through the sandwiching members between which the stacked boards are sandwiched.

3. The stacked module according to claim 1 , wherein the feeding member supplies a power supply voltage and a ground voltage to the stacked boards in contact with the feeding member.

4. The stacked module according to claim 1 , wherein

the stacked boards are double-sided mounting boards having the components mounted on one side and another side thereof, and

the cooling member comprises a cooling plate that is inserted between the stacked boards and that is in contact with and cools the components opposed to the cooling member.

5. The stacked module according to claim 1 , wherein

the connector that is the connection component disposed on edges of the stacked boards, and at least a signal including a main signal transmitted from outside is transmitted through the connector that is the connection component.

6. The stacked module according to claim 1 , wherein

the connector that is the connection component electrically connects the stacked boards at edges of the stacked boards, and

the feeding/cooling mechanism feeds the stacked boards and cools the components mounted on the stacked boards from sides opposite to sides having the connector that is the connection component disposed thereon, of the stacked boards.

7. A stacking method comprising:

electrically connecting a plurality of stacked boards having components mounted thereon, using a connection component such that the connection component is configured to transmit a signal; and

inserting a feeding/cooling mechanism between the stacked boards, the feeding/cooling mechanism being configured to feed the stacked boards and to cool the components mounted on the stacked boards, wherein

the feeding/cooling mechanism includes a cooling member that is in contact with and configured to cool the components mounted on the stacked boards and a feeding member that is in contact with and feeds the stacked boards;

the feeding member includes sandwiching members that are disposed in positions corresponding to the stacked boards so as to sandwich the stacked boards by spring mechanisms;

the feeding member sandwiches the stacked boards by the sandwiching members and feeds the sandwiched stacked boards;

the stacked boards are rectangular in shape, and

the connector that is the connection component is disposed on an end portion of one short side of the stacked boards, and the feeding/cooling mechanism is disposed on an end portion of another short side of the stacked boards.

8. A cooling/feeding mechanism comprising:

a cooling member that is inserted between a plurality of stacked, electrically connected boards and is in contact with and cools components mounted on the boards; and

a feeding member that is in contact with and feeds the stacked boards, wherein

the feeding member includes sandwiching members that are disposed in positions corresponding to the stacked boards so as to sandwich the stacked boards by spring mechanisms;

the feeding member sandwiches the stacked boards by the sandwiching members and feeds the sandwiched stacked boards;

the stacked boards are rectangular in shape,

the stacked boards are electrically connected by way of a connector which is a connection component electrically connecting the stacked boards and configured to transmit a signal, and

the connector that is the connection component is disposed on an end portion of one short side of the stacked boards, and the feeding/cooling mechanism is disposed on an end portion of another short side of the stacked boards.

9. The cooling/feeding mechanism according to claim 8 , wherein

the feeding member feeds the stacked boards through the sandwiching members between which the stacked boards are sandwiched.

10. The cooling/feeding mechanism according to claim 8 , wherein the feeding member supplies a power supply voltage and a ground voltage to the stacked boards in contact with the feeding member.

11. The cooling/feeding mechanism according to claim 8 , wherein the cooling member comprises a cooling plate that is inserted between the stacked boards and that is in contact with and cools the components opposed to the cooling member.

12. The cooling/feeding mechanism according to claim 8 , wherein

the cooling/feeding mechanism feeds the stacked boards and cools the components mounted on the stacked boards from sides opposite to sides having the connector that is the connection component disposed thereon, of the stacked boards.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 27, 2024
From: IP WAVE PTE LTD.
To: CLOUD BYTE LLC.
Reel/Frame 067944/0332 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 27, 2024
From: NEC ASIA PACIFIC PTE LTD.
To: IP WAVE PTE LTD.
Reel/Frame 066376/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2023
From: NEC CORPORATION
To: NEC ASIA PACIFIC PTE LTD.
Reel/Frame 063349/0459 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 9, 2018
From: NEDACHI, TAKAAKI
To: NEC CORPORATION
Reel/Frame 044882/0146 →
Priority Claims (1)
JP 2017-049683 · Mar 15, 2017 · national
Continuity (1)
Related Publication 20180270992A1 · Sep 20, 2018