Methods of forming interdigitated back contact solar cells

1. A method comprising:

depositing a patterned Zn layer to cover first areas of an n-type emitter region, wherein the n-type emitter region includes an emitter layer, a minority carrier confinement layer, and a contact layer;

wherein the n-type emitter region is doped with at least one of Si, Se, S, or Te;

wherein the depositing of the patterned Zn layer comprises electroplating a Zn layer on the emitter region;

forming a mask on the first areas of the Zn layer corresponding to the first areas of the emitter region;

wherein the mask is formed by nanoimprinting or microlithography; and

removing Zn from second areas of the emitter region that are not covered by the mask;

wherein the emitter region comprises a III-V material; and

forming a passivated back contact region by counter-doping the first areas of the emitter region by diffusing Zn from the patterned Zn layer into the first areas of the emitter region, such that the first areas of the emitter region become p-type;

wherein the passivated back contact region forms a back surface field.

2. The method according to claim 1 , wherein the Zn is diffused such that a concentration of the Zn within the passivated back contact region decreases from an interface with the patterned Zn layer to an interface with a base layer on a side of the passivated back contact region opposite to the patterned Zn layer.

3. The method according to claim 1 , further comprising depositing a metal layer on at least a portion of the patterned Zn layer and at least a portion of the second areas of the emitter region.