Antenna element structure suitable for 5G CPE devices

1. A radio frequency (RF) antenna, comprising:

a first substrate having a first top surface and a first bottom surface;

a second substrate having a second top surface and a second bottom surface, wherein the first substrate is disposed on top of the second substrate, the second bottom surface including a ground plane disposed thereon;

a low-band (LB) radiation element disposed on the first top surface of the first substrate, wherein the LB radiation element comprises a first electric dipole and a first magnetic dipole, wherein the first electric dipole comprises a first conductive section and a second conductive section, and wherein the LB radiation element is configured to resonate within a first frequency band to transmit and receive RF signals associated with the first frequency band; and

a plurality of high-band (HB) radiation elements disposed between the first bottom surface of the first substrate and the second top surface of the second substrate, wherein each HB radiation element is configured to resonate within a second frequency band to transmit and receive RF signals associated with the second frequency band.

2. The RF antenna of claim 1 , wherein each of the first and second conductive sections comprises a T-shape conductive element.

3. The RF antenna of claim 1 , wherein the first magnetic dipole comprises a first via array connected with the first conductive section and a second via array connected with the second conductive section.

4. The RF antenna of claim 3 , wherein the first via array and the second via array are aligned in parallel to each other.

5. The RF antenna of claim 3 , wherein each via of the first and second via arrays extends through the first substrate, through the second substrate, and contacts with the ground plane disposed on the second bottom surface of the second substrate.

6. The RF antenna of claim 3 , wherein the first conductive section further comprises a first feed via disposed between the first via array and the second via array, wherein the first feed via is to be coupled to a feeder circuit of an RF frontend circuit.

7. The RF antenna of claim 6 , wherein the first feed via extends through the first substrate, through the second substrate, and through a first opening cut out from the ground plane, such that the first feed via does not contact with the ground plane.

8. A radio frequency (RF) antenna, comprising:

a first substrate having a first top surface and a first bottom surface;

a second substrate having a second top surface and a second bottom surface, wherein the first substrate is disposed on top of the second substrate, the second bottom surface including a ground plane disposed thereon;

a low-band (LB) radiation element disposed on the first top surface of the first substrate, wherein the LB radiation element is configured to resonate within a first frequency band to transmit and receive RF signals associated with the first frequency band; and

a plurality of high-band (HB) radiation elements disposed between the first bottom surface of the first substrate and the second top surface of the second substrate, wherein each of the HB radiation elements comprises a second electric dipole and a second magnetic dipole, wherein the second electric dipole comprises a third conductive section and a fourth conductive section, and wherein each HB radiation element is configured to resonate within a second frequency band to transmit and receive RF signals associated with the second frequency band.

9. The RF antenna of claim 8 , wherein the third conductive section is a U-shape conductive element and the fourth conductive section is a rectangular shape conductive element.

10. The RF antenna of claim 8 , wherein the second magnetic dipole comprises a third via array connected with the third conductive section and a fourth via array connected with the fourth conductive section.

11. The RF antenna of claim 10 , wherein the third via array and the fourth via array are aligned in parallel to each other.

12. The RF antenna of claim 10 , wherein each via of the third and fourth via arrays extends through the first substrate, through the second substrate, and contacts with the ground plane disposed on the second bottom surface of the second substrate.

13. The RF antenna of claim 8 , wherein each of the HB radiation elements further comprises a fifth conductive section having a second feed via extended through the first substrate, through the second substrate, and through a second opening cut out from the ground plane disposed on the second bottom surface of the second substrate, such that the second feed via does not contact with the ground plane.

14. The RF antenna of claim 13 , wherein the fifth conductive section is disposed between the third conductive section and the fourth conductive section.

15. The RF antenna of claim 13 , wherein the fifth conductive section is a T-shape conductive element.

16. A radio frequency (RF) frontend circuit, comprising:

one or more transceivers to transmit and receive RF signals within a plurality of frequency bands; and

one or more RF antennas coupled to the transceivers, wherein each of the RF antennas includes

a first substrate having a first top surface and a first bottom surface;

a second substrate having a second top surface and a second bottom surface, wherein the first substrate is disposed on top of the second substrate, the second bottom surface including a ground plane disposed thereon,

a low-band (LB) radiation element disposed on the first top surface of the first substrate, each LB radiation element including a direct feed magneto electric dipole structure, wherein the LB radiation element is configured to resonate within a first frequency band to transmit and receive RF signals associated with the first frequency band, and wherein the LB radiation element comprises a first electric dipole and a first magnetic dipole, wherein the first electric dipole comprises a first conductive section and a second conductive section, and

a plurality of high-band (HB) radiation elements disposed between the first bottom surface of the first substrate and the second top surface of the second substrate, each HB radiation element including a coupling feed magneto electric dipole structure, wherein each HB radiation element is configured to resonate within a second frequency band to transmit and receive RF signals associated with the second frequency band.

17. The RF frontend circuit of claim 16 , wherein the plurality of HB radiation elements are disposed symmetrically with respect to the LB radiation element.

18. The RF frontend circuit of claim 16 , wherein the second frequency band is higher than the first frequency band.