Packaging of a directly modulated laser chip in photonics module
A package structure of a directly modulated laser in a photonics module includes a thermoelectric cooler including multiple conductor traces formed in a cool surface. The package structure further includes a directly modulated laser (DML) chip having a first electrode being attached with the cool surface and a second electrode at a distance away from the cool surface. Additionally, the package structure includes an interposer having a plurality of through-holes formed between a first surface to a second surface. The first surface is mounted to the cool surface such that each through-hole is aligned with one of the multiple conductor traces and the second surface being leveled with the second electrode. Moreover, the package structure includes a driver disposed on the second surface of the interposer with at least a galvanically coupled output port coupled directly to the second electrode of the DML chip.
1. A package structure of a directly modulated laser in a photonics module, the package structure comprising:
a thermoelectric cooler having a cool surface and including multiple conductor traces formed in the cool surface;
a directly modulated laser (DML) chip having a common electrode attached to the cool surface and one or more separate electrodes at a distance away from the cool surface;
an interposer having a plurality of through-holes formed from a first surface of the interposer to a second surface of the interposer, the first surface being mounted to the cool surface such that each through-hole is aligned with one of the multiple conductor traces and the second surface being level with a first separate electrode of the one or more separate electrodes; and
a driver chip disposed on the second surface of the interposer, the driver chip having a first galvanically coupled output port coupled directly to the first separate electrode of the DML chip.
2. The package structure of claim 1 , wherein the DML chip comprises multiple laser diodes having respective first electrodes being formed as the common electrode attached to the cool surface.
3. The package structure of claim 1 , further comprising a thermal conductive pad inserted between the common electrode and the cool surface.
4. The package structure of claim 1 ,
wherein the DML chip includes a first laser diode having the first separate electrode and a second laser diode having a second separate electrode, and
wherein the driver chip comprises a second galvanically coupled output port coupled directly to the second separate electrode.
5. The package structure of claim 1 wherein each of the multiple conductor traces in the cool surface is configured as an electrical input of the thermoelectric cooler to couple with a conductor material filled in one of the plurality of through-holes at the first surface.
6. The package structure of claim 5 wherein the driver chip comprises a plurality of electrodes, each electrode being configured to couple with the conductor material filled in one of the plurality of through-holes at the second surface.
7. The package structure of claim 1 wherein the interposer comprises silicon material and silicon oxide material, each of the plurality of through-holes is a through-silicon via.