IP Library Granted Patent US 10,836,922
Granted Patent B2
US 10,836,922 · App. 15/898,335 · Granted Nov 17, 2020

Ink compositions with improved conductivity

Inventors: Hong Jiang (Irvine, CA); Himal Khatri (Irvine, CA); Bo Xia (Irvine, CA); Aziz Shaikh (San Diego, CA)
Assignee: Henkel IP & Holding GmbH
C09D11/52C08K3/10C09D5/24C09D11/03C09D11/102C09D11/104H01B1/22C08K5/02C08K5/03C08K5/09C08K2003/0806C08K2201/005C08K2201/011
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Quick Facts
Patent No.
US 10,836,922
App. No.
15/898,335
Granted
Nov 17, 2020
Kind
B2
Abstract

Provided herein are ink compositions with improved conductivity. The improved conductivity is attributable to the addition of organohalogen compounds to the composition.

Claims (20)

1. A conductive ink composition comprising:

a silver component, where at least about 50% of the silver component is made up of silver having a particle size of greater than about 100 nm and less than about 1 um;

a carrier; and

an organohalogen compound.

2. The ink composition of claim 1 , wherein the organohalogen compound is a liquid at room temperature.

3. The ink composition of claim 1 , wherein the halogen is an iodide.

4. The ink composition of claim 1 , wherein the organohalogen compound is a lower alkane halide.

5. The ink composition of claim 1 , wherein the organohalogen compound is represented by halogenated compounds having up to twelve carbon atoms.

6. The ink composition of claim 1 , wherein the organohalogen compound has a boiling point of less than about 150° C.

7. The ink composition of claim 1 , wherein the organohalogen compound contacts the silver component to improve electrical conductivity.

8. The ink composition of claim 1 , wherein the carrier is a thermoplastic resin.

9. The ink composition of claim 1 , wherein the carrier is a thermoset resin.

10. The ink composition of claim 1 , further comprising a solvent.

11. A substrate on which is disposed the ink composition of claim 1 .

12. A method of improving electrical conductivity of an ink composition, steps of which comprise

providing an ink composition comprising

a silver component, where at least about 50% of the silver component is made up of silver having a particle size of greater than about 100 nm and less than about 1 um; and

a carrier; and

combining an organohalogen compound to with the silver component and the carrier,

wherein the organohalogen compound contacts the silver component to improve electrical conductivity when an electric current is passed through the ink composition.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2022
From: HENKEL IP & HOLDING GMBH
To: HENKEL AG & CO. KGAA
Reel/Frame 059357/0267 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2018
From: JIANG, HONG; KHATRI, HIMAL; XIA, BO; SHAIKH, AZIZ
To: HENKEL IP & HOLDING GMBH
Reel/Frame 044971/0655 →