Power electronics assembly including a circuit carrier
A circuit carrier for holding at least one electrical power component is disclosed. The circuit carrier including a heat sink for holding and for cooling the power component. The heat sink having a surface. The circuit carrier includes a copper layer for mechanically connecting the heat sink to at least one copper plate, where the copper layer includes copper or a copper alloy and is cold-gas-sprayed or sintered on the surface of the heat sink. The circuit carrier also includes at least one copper plate for mechanically and electrically connecting the power component to the copper layer. The copper plate includes copper or a copper alloy and is arranged directly on a surface of the copper layer facing away from the heat sink and is areally, mechanically and electrically conductively connected to the copper layer.
1. A circuit carrier for holding at least one electrical power component, the circuit carrier comprising:
at least one electrical power component;
a heat sink for holding and for cooling the at least one electrical power component, the heat sink having a surface;
a copper layer comprising copper or a copper alloy, the copper layer being cold-gas-sprayed or sintered on the surface of the heat sink; and
a plurality of copper plates, at least one of the plurality of copper plates for mechanically and electrically connecting the at least one electrical power component to the copper layer, wherein each of the plurality of copper plates consists of copper or a copper alloy and is arranged directly on a surface of the copper layer facing away from the heat sink and is areally, mechanically and electrically conductively connected to the copper layer;
a sealing layer arranged on the surfaces of the copper layer and the surfaces of the plurality of copper plates, such that each of the plurality of copper plates extends into the sealing layer, the copper layer is disposed between the sealing layer and the heat sink, and all of the sealing layer is on one side of the copper layer, and all of the heat sink is on the opposite side of the copper layer;
wherein the copper layer mechanically connects the heat sink to the plurality of copper plates.
2. The circuit carrier of claim 1 , wherein the copper layer has a thickness of at least 45 micrometers.
3. The circuit carrier of claim 1 , wherein each of the plurality of copper plates are soldered on the surface of the copper layer and serves for electrically and mechanically connecting the copper layer to at least one power component.
4. The circuit carrier of claim 1 , wherein at least one of the plurality of copper plates has a thickness of at least 0.9 millimeter.
5. The circuit carrier of claim 1 , furthermore comprising an insulation layer which is arranged between the surface of the heat sink and the copper layer and mechanically connects the heat sink to, and electrically insulates it from, the copper layer.
6. The circuit carrier of claim 5 , wherein the insulation layer is cold-gas-sprayed or sintered on the surface of the heat sink.
7. A power electronics arrangement, comprising:
at least one electrical power component; and
at least one circuit carrier for holding the at least one electrical power component, the at least one circuit carrier comprising:
a heat sink for holding and for cooling the power component, the heat sink having a surface;
a copper layer consisting of copper or a copper alloy, the copper layer being cold-gas-sprayed or sintered on the surface of the heat sink; and
a plurality of copper plates, at least one of the plurality of copper plates for mechanically and electrically connecting the electrical power component to the copper layer, wherein each of the plurality of copper plates consists of copper or a copper alloy and is arranged directly on a surface of the copper layer facing away from the heat sink and is areally, mechanically and electrically conductively connected to the copper layer;
a sealing layer arranged on the surfaces of the copper layer and the surfaces of the plurality of copper plates, such that each of the plurality of copper plates extend into the sealing layer, the copper layer is disposed between the sealing layer and the heat sink, and all of the sealing layer is on one side of the copper layer, and all of the heat sink is on the opposite side of the copper layer;
wherein the copper layer mechanically connects the heat sink to each of the plurality of copper plates; and
wherein the electrical power component is arranged on a surface of one of the plurality of copper plates facing away from the heat sink and is areally mechanically and electrically conductively connected to the one of the plurality of copper plates.
8. The power electronics arrangement of claim 7 , wherein the copper layer has a thickness of at least 45 micrometers.
9. The power electronics arrangement of claim 7 , wherein each of the plurality of copper plates is soldered on the surface of the copper layer and serves for electrically and mechanically connecting the copper layer to at least one power component.
10. The power electronics arrangement of claim 7 , wherein at least one the plurality of copper plates has a thickness of at least 0.9 millimeter.
11. The power electronics arrangement of claim 7 , furthermore comprising an insulation layer which is arranged between the surface of the heat sink and the copper layer and mechanically connects the heat sink to, and electrically insulates it from, the copper layer.
12. The power electronics arrangement of claim 11 , wherein the insulation layer is cold-gas-sprayed or sintered on the surface of the heat sink.