Light emitting device
View Patent ↗A light emitting device includes a substrate and a plurality of light emitting cells disposed on the substrate. Each light emitting cell includes a first semiconductor layer and a second semiconductor layer, an active layer between the first and the second semiconductors, a conductive material on the second semiconductor layer, an inclined surface, a first insulation layer overlaps each light emitting cell, an electrically conductive material overlaps the first insulation layer to couple two of the plurality of light emitting cells, and a second insulation layer overlaps the electrically conductive material. A light-transmitting material is used in both the first insulation layer and the second insulation layer. The inclined surface is continuous and has a slope of approximately 20° to approximately 80° from a horizontal plane based on the substrate.
1. A method of forming a light emitting device, the method comprising:
forming a first light emitting cell comprising:
disposing a first lower semiconductor layer on a base substrate;
disposing a first active layer on the first lower semiconductor layer;
disposing a first upper semiconductor layer on the first active layer;
forming a first inclined surface comprising a first surface of the first upper semiconductor layer and a first surface of the first active layer; and
removing a portion of the first upper semiconductor layer and a portion of the first active layer to expose the first lower semiconductor layer;
forming a second light emitting cell comprising:
disposing a second lower semiconductor layer on the base substrate;
disposing a second active layer on the second lower semiconductor layer;
disposing a second upper semiconductor layer on the second active layer;
forming a second inclined surface comprising a first surface of the second upper semiconductor layer and a first surface of the second active layer; and
removing a portion of the second upper semiconductor layer and a portion of the second active layer to expose the second lower semiconductor layer;
disposing a first conductive material on the second upper semiconductor layer;
disposing a first insulation layer on the first lower semiconductor layer, the second lower semiconductor layer, the second active layer, and the second upper semiconductor layer;
disposing a second conductive material on the first insulation layer configured to electrically couple the first light emitting cell and the second light emitting cell; and
disposing a second insulation layer on the second conductive material,
wherein the first inclined surface is continuous and has a slope of approximately 20° to approximately 80° from a horizontal plane of the base substrate,
wherein the second inclined surface is continuous and has a slope of approximately 20° to approximately 80° from the horizontal plane of the base substrate, and
wherein the first insulation layer and the second insulation layer comprise a light transmitting material.
2. The method of claim 1 , further comprising forming a via hole in the first insulation layer for exposing the first lower semiconductor layer.
3. The method of claim 1 , wherein:
forming the first light emitting cell further comprises forming a third inclined surface comprising a second surface of the first upper semiconductor layer and a second surface of the first active layer;
forming the second light emitting cell further comprises forming a fourth inclined surface comprising a second surface of the second upper semiconductor layer and a second surface of the second active layer;
the third inclined surface has a slope of approximately 20° to approximately 80° from the horizontal plane of the base substrate; and
the fourth inclined surface has a slope of approximately 20° to approximately 80° from the horizontal plane of the base substrate.
4. The method of claim 1 , further comprising:
disposing a first bonding pad and a second bonding pad on a submount substrate;
disposing a first metal bump on the first upper semiconductor layer;
disposing a second metal bump on the second upper semiconductor layer; and
disposing the first and second light emitting cells on the submount substrate, such that the first upper semiconductor layer bonds with the first bonding pad using the first metal bump, and the second upper semiconductor layer bonds with the second bonding pad using the second metal bump.
5. The method of claim 4 , wherein the first and second light emitting cells are formed simultaneously.
6. The method of claim 5 , wherein the first lower semiconductor layer and the second lower semiconductor layer is formed as a shared layer.