Low cost package warpage solution
Embodiments of the invention include device packages and methods of forming such packages. In an embodiment, the method of forming a device package may comprise forming a reinforcement layer over a substrate. One or more openings may be formed through the reinforcement layer. In an embodiment, a device die may be placed into one of the openings. The device die may be bonded to the substrate by reflowing one or more solder bumps positioned between the device die and the substrate. Embodiments of the invention may include a molded reinforcement layer. Alternative embodiments include a reinforcement layer that is adhered to the surface of the substrate with an adhesive layer.
1. A device package comprising:
a substrate having one or more conductive traces formed over a first surface of the substrate;
one or more conductive through vias formed from the first surface of the substrate to a second surface of the substrate that is opposite from the first surface of the substrate, wherein one or more of the conductive vias are electrically coupled to a conductive trace;
a reinforcement layer formed over the substrate, wherein the reinforcement layer has one or more openings that expose portions of the conductive traces; and
a device die electrically coupled to the one or more conductive traces by one or more solder bumps, the device die in one of the one or more openings of the reinforcement layer.
2. The device package of claim 1 , wherein the reinforcement layer is an epoxy material.
3. The device package of claim 1 , wherein the reinforcement layer is coupled to the substrate by an adhesive layer.
4. The device package of claim 3 , wherein the reinforcement layer is steel, stainless steel, or aluminum.
5. The device package of claim 1 , further comprising:
a solder resist layer formed over portions of the substrate and over portions of the conductive traces; and
one or more solder resist openings formed through portions of the solder resist layer exposed by the opening in the reinforcement layer.
6. The device package of claim 1 , wherein a first gap between a first edge of the device die and a first sidewall of the opening is larger than a second gap between a second edge of the device die and a second sidewall of the opening.
7. The device package of claim 1 , further comprising, a second die mechanically and electrically coupled to a top surface of the device die, wherein a width of the second die is wider than a width of the opening, and wherein a portion of the second die is supported by the reinforcement layer.
8. A device package comprising:
a substrate having one or more conductive traces formed over a first surface of the substrate, wherein a thickness of the substrate is less than 100 μm;
one or more conductive through vias formed from the first surface of the substrate to a second surface of the substrate that is opposite from the first surface of the substrate, wherein each of the one or more conductive vias are electrically coupled to a conductive trace;
a reinforcement layer formed over the substrate, wherein the reinforcement layer has one or more openings that expose portions of the conductive traces;
a device die electrically coupled to the one or more conductive traces by one or more solder bumps;
an underfill material disposed between the device die and the substrate and around the one or more solder bumps;
a second die mechanically and electrically coupled to a top surface of the device die, wherein a width of the second die is wider than a width of the opening, and wherein a portion of the second die is supported by the reinforcement layer; and one or more second level interconnects formed on the second side of the substrate.
9. The device package of claim 8 , further comprising: an adhesive layer formed between the reinforcement layer and the substrate, wherein the reinforcement layer is steel, stainless steel, or aluminum.
10. The device package of claim 8 , wherein a first gap between a first edge of the device die and a first sidewall of the opening is larger than a second gap between a second edge of the device die and a second sidewall of the opening.
11. A device package comprising:
a substrate having one or more conductive traces formed over a first surface of the substrate;
one or more conductive through vias formed from the first surface of the substrate to a second surface of the substrate that is opposite from the first surface of the substrate, wherein one or more of the conductive vias are electrically coupled to a conductive trace;
a reinforcement layer formed over the substrate, wherein the reinforcement layer has one or more openings that expose portions of the conductive traces;
a device die electrically coupled to the one or more conductive traces by one or more solder bumps; and
a second die mechanically and electrically coupled to a top surface of the device die, wherein a width of the second die is wider than a width of the opening, and wherein a portion of the second die is supported by the reinforcement layer.
12. The device package of claim 11 , wherein the reinforcement layer is an epoxy material.
13. The device package of claim 11 , wherein the reinforcement layer is coupled to the substrate by an adhesive layer.
14. The device package of claim 13 , wherein the reinforcement layer is steel, stainless steel, or aluminum.
15. The device package of claim 11 , further comprising:
a solder resist layer formed over portions of the substrate and over portions of the conductive traces; and
one or more solder resist openings formed through portions of the solder resist layer exposed by the opening in the reinforcement layer.
16. The device package of claim 11 , wherein a first gap between a first edge of the device die and a first sidewall of the opening is larger than a second gap between a second edge of the device die and a second sidewall of the opening.