IP Library Granted Patent US 10,128,954
Granted Patent B2
US 10,128,954 · App. 15/900,357 · Granted Nov 13, 2018

Integrated transceiver with lightpipe coupler

Inventors: Peter DeDobbelaere (San Diego, CA); Thierry Pinguet (Arlington, WA); Mark Peterson (San Diego, CA); Mark Harrison (Escondido, CA); Alexander G. Dickinson (Laguna Beach, CA); Lawrence C. Gunn (Encinitas, CA)
Assignee: Luxtera, Inc.
H04B10/40G02B6/12004G02B6/4214G02B6/4246G02B6/4295G02B6/3885G02B2006/12121
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Quick Facts
Patent No.
US 10,128,954
App. No.
15/900,357
Granted
Nov 13, 2018
Kind
B2
Abstract

A transceiver comprising a chip, a semiconductor laser, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronic circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via a light pipe with a sloped reflective surface coupled to the chip, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip. The light pipe may be a planar lightwave circuit (PLC).

Claims (49)

1. A communication system comprising:

a transceiver comprising a photonic chip, a semiconductor laser, and one or more photodetectors;

wherein said semiconductor laser communicates an optical source signal into said photonic chip, said optical source signal for generating first optical signals that are transmitted from said photonic chip via a light pipe coupled to said photonic chip, said light pipe having a sloped reflective surface; and

wherein second optical signals are received via said light pipe and converted to electrical signals via said one or more photodetectors.

2. The system of claim 1 , wherein said photonic chip comprises waveguides, optical couplers, and modulators.

3. The system of claim 2 , wherein said optical couplers comprise grating couplers.

4. The system of claim 1 , wherein said one or more photodetectors are integrated in said photonic chip.

5. The system of claim 1 , wherein said one or more photodetectors are mounted on said photonic chip.

6. The system of claim 1 , wherein said first optical signals, and said optical source signal and said second optical signals are communicated out of and in to, respectively, a top surface of said photonic chip.

7. The system of claim 1 , wherein the light pipe comprises a planar lightwave circuit (PLC).

8. A communication system comprising a photonic chip, a semiconductor laser coupled with said photonic chip, and one or more photodetectors;

wherein said semiconductor laser communicates an optical source signal into said photonic chip, said optical source signal for generation of first optical signals that are transmitted from said photonic chip via a light pipe coupled to said photonic chip, said light pipe having a sloped reflective surface; and

wherein second optical signals are received via said light pipe and converted to electrical signals utilizing said one or more photodetectors.

9. The system of claim 8 , wherein said first optical signals, and said optical source signal and said second optical signals are communicated out of and in to, respectively, a top surface of said photonic chip.

10. The system of claim 8 , wherein said one or more photodetectors are integrated in said photonic chip.

11. The system of claim 10 , wherein said one or more photodetectors are mounted on said photonic chip.

12. A method for communicating optical signals, the method comprising:

in a transceiver comprising a photonic chip, a semiconductor laser coupled with said photonic chip, and one or more photodetectors:

communicating, utilizing said semiconductor laser, an optical source signal into said chip;

generating first optical signals in said photonic chip based on said optical source signal;

transmitting said first optical signals from said photonic chip via a light pipe coupled to said photonic chip, said light pipe having a sloped reflective surface; and

receiving second optical signals from said light pipe and converting said second optical signals to electrical signals utilizing said one or more photodetectors.

13. The method according to claim 12 , wherein said photonic chip comprises waveguides, optical couplers, and modulators.

14. The method according to claim 12 , wherein said one or more photodetectors are integrated in said photonic chip.

15. The method according to claim 13 , wherein said optical couplers comprise grating couplers.

16. The method according to claim 12 , wherein said one or more photodetectors are mounted on said photonic chip.

17. The method according to claim 12 , comprising communicating said first optical signals, and said optical source signal and said second optical signals, respectively, out of and in to a top surface of said photonic chip.

18. The method according to claim 12 , wherein the light pipe comprises a planar lightwave circuit (PLC).

19. A method for communicating optical signals, the method comprising:

in a transceiver comprising a photonic chip, a semiconductor laser, and one or more photodetectors:

communicating, utilizing said semiconductor laser, an optical source signal into said photonic chip;

generating first optical signals in said photonic chip based on said optical source signal;

transmitting said first optical signals from said photonic chip via a light pipe coupled to said photonic chip, said light pipe having a sloped reflective surface; and

receiving second optical signals from said light pipe and converting said second optical signals to electrical signals via said one or more photodetectors.

20. The method according to claim 19 , comprising communicating said first and second optical signals and said optical source signal out of and in to a top surface of said photonic chip.

21. The method according to claim 19 , wherein said one or more photodetectors are integrated in said photonic chip.

22. The method according to claim 19 , wherein said photonic chip comprises one or more grating couplers for coupling optical signals into and/or out of said photonic chip.

23. The method according to claim 19 , wherein the light pipe comprises a planar lightwave circuit (PLC).

24. A system for two-way communication of optical signals comprising:

a photonic chip;

a semiconductor laser; and

one or more photodetectors; wherein:

an optical source signal is communicated, utilizing said semiconductor laser, into said photonic chip;

optical signals representative of electronic signals received from the electronic circuitry of said photonic chip are communicated from said photonic chip via a light pipe coupled to said photonic chip, said light pipe having a sloped reflective surface; and

electronic signals representative of optical signals received via said light pipe are generated in said photonic chip using said one or more photodetectors.

25. The system of claim 24 , wherein said one or more photodetectors are integrated in said photonic chip.

26. The system of claim 24 , wherein said photonic chip comprises grating couplers for communicating optical signals into and/or out of said photonic chip.

27. The system of claim 24 , wherein said photonic chip comprises waveguides, couplers, and modulators.

28. The system of claim 24 , wherein the light pipe comprises a planar lightwave circuit (PLC).

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE THE ASSIGNOR'S NAME PREVIOUSLY RECORDED AT REEL: 058979 FRAME: 0027. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 24, 2022
From: LUXTERA LLC
To: CISCO TECHNOLOGY, INC.
Reel/Frame 059496/0803 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 8, 2022
From: CISCO SYSTEMS, INC.
To: CISCO TECHNOLOGY, INC.
Reel/Frame 058979/0027 →
CHANGE OF NAME Recorded Feb 6, 2020
From: LUXTERA, INC.
To: LUXTERA LLC
Reel/Frame 052019/0811 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2019
From: GUNN, LAWRENCE C., III; DICKINSON, ALEXANDER G.; DEDOBBELAERE, PETER; PINGUET, THIERRY; PETERSON, MARK; HARRISON, MARK
To: LUXTERA, INC.
Reel/Frame 048234/0733 →
Continuity (12)
Continuation 15651952 · Jul 17, 2017
Continuation 14854909 · Sep 15, 2015
Continuation 13422635 · Mar 16, 2012
Continuation 13156979 · Jun 9, 2011
Continuation 12483699 · Jun 12, 2009
Division 11611084 · Dec 14, 2006
Continuation In Part 10758561 · Jan 14, 2004
Continuation In Part 10799040 · Mar 11, 2004
Continuation In Part 10917204 · Aug 11, 2004
Continuation In Part 11384019 · Mar 17, 2006
Provisional Application 60750488 · Dec 14, 2005
Related Publication 20180175940A1 · Jun 21, 2018