Power module with cooling system for electronic cards
View Patent ↗The application relates to a power module ( 10 ) including: pieces of electrical equipment ( 12 ), at least first ( 14 ) and second ( 16 ) electronic cards, and a cooling device ( 20 ), able to discharge the heat given off by the pieces of electrical equipment and electronic cards. The cooling devices include first ( 34 ) and second ( 36 ) surfaces thermally insulated from one another, the pieces of electrical equipment ( 12 ) being in thermal contact with the first surface and separated from the second surface. The first electronic card ( 14 ) is fastened to a piece of electrical equipment ( 12 ) and thermally connected to the second surface ( 36 ) of the cooling device by a heat sink ( 42 ). The second electronic card ( 16 ) is positioned close to the second surface ( 36 ), or in contact with the second surface.
1. A power module, comprising:
pieces of electrical equipment,
at least first and second electronic cards, and
a cooling device, able to discharge heat given off by said pieces of electrical equipment and electronic cards;
wherein:
the cooling devices include first and second surfaces thermally insulated from one another, the pieces of electrical equipment being in thermal contact with the first surface and separated from the second surface;
the first electronic card is fastened to a piece of electrical equipment, said first electronic card being thermally connected to the second surface of the cooling device by a heat sink; and
the second electronic card is positioned close to the second surface of the cooling device or in contact with said second surface.
2. The power module according to claim 1 , wherein the first and second surfaces of the cooling device are substantially coplanar.
3. The power module according to claim 2 , wherein the cooling device includes:
a cooling panel, a first face of said panel forming the first and second surfaces of the cooling device; and
ventilation fins, fastened to a second face of the cooling panel.
4. The power module according to claim 3 , wherein each of the first and second surfaces is made from a thermally conducting material, the cooling panel further including a strip of thermally insulating material, separating said first and second surfaces.
5. The power module according to claim 3 , wherein the cooling panel includes at least one slit separating the first and second surfaces, said first and second surfaces being connected to one another at the ends of said slit.
6. The power module according to claim 1 , wherein the heat sink includes a strip of a thermally conducting material, first and second ends of said strip being in thermal contact, respectively with the first electronic card and with the second surface.
7. The power module according to claim 6 , wherein a thermal contact between the first electronic card and the first end of the heat sink is provided by a layer of thermally conductive paste or foam.
8. The power module according to claim 1 , including at least one thermally insulating wall positioned between the second electronic card and a piece of electrical equipment.
9. The power module according to claim 8 , wherein a face of the thermally insulating wall, oriented toward the piece of electrical equipment, is covered by a layer of material deflecting infrared radiation.