SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

1 . A method of manufacturing a semiconductor device by connecting a semiconductor chip to a lead frame using a jig,

the semiconductor chip comprising a main electrode provided at a surface of the semiconductor chip,

the lead frame comprising a connection projecting portion and a positioning portion, the positioning portion including at least one of a convex shape and a concave shape provided around the connection projecting portion,

the method comprising:

engaging the jig to the positioning portion in a state where a clearance is provided between the connection projecting portion and the jig;

engaging the jig to the semiconductor chip; and

connecting the connection projecting portion to the main electrode of the semiconductor chip via solder in a state where the jig is engaged to the positioning portion and the semiconductor chip.

2 . The method of claim 1 , wherein

the positioning portion includes the convex shape, and

in the engaging of the jig to the positioning portion, a lateral surface of the jig is brought into contact with a lateral surface of the convex shape.

3 . The method of claim 1 , wherein

the positioning portion includes the concave shape, and

in the engaging of the jig to the positioning portion, a lateral surface of the jig is brought into contact with a lateral surface of the concave shape.

4 . The method of claim 1 , wherein in the state where the jig is engaged to the positioning portion and the semiconductor chip, in a view along a direction in which the semiconductor chip and the lead frame are stacked, an entirety of a region of the connection projecting portion to which the solder is connected is located inside a contour of the main electrode.

5 . The method of claim 1 , wherein the engaging of the jig to the semiconductor chip is performed after the engaging of the jig to the positioning portion.

6 . The method of claim 1 , wherein

the main electrode is an emitter electrode,

the semiconductor chip comprises a signal electrode provided at the surface at which the emitter electrode is provided, and a collector electrode provided at a rear surface located on an opposite side to the emitter electrode,

the lead frame comprises a main body and a signal terminal, the main body includes the connection projecting portion and the positioning portion, and the signal terminal extends from the main body,

the method further comprises:

connecting the signal terminal to the signal electrode;

connecting a collector terminal to the collector electrode;

forming an insulating resin layer covering the semiconductor chip after the connection projecting portion, the signal terminal and the collector terminal are connected to the semiconductor chip; and

cutting off the signal terminal from the main body after the insulating resin layer is formed.

7 . A semiconductor device, comprising:

a semiconductor chip including a main electrode provided at a surface of the semiconductor chip; and

a lead frame including a connection projecting portion and a positioning portion, the positioning portion including at least one of a convex shape and a concave shape provided around the connection projecting portion,

wherein

the connection projecting portion is connected to the main electrode via solder.