Semiconductor device comprising PN junction diode and schottky barrier diode
A semiconductor device includes a MOSFET including a PN junction diode. A unipolar device is connected in parallel to the MOSFET and has two terminals. A first wire connects the PN junction diode to one of the two terminals of the unipolar device. A second wire connects the one of the two terminals of the unipolar device to an output line, so that the output line is connected to the MOSFET and the unipolar device via the first wire and the second wire. In one embodiment the connection of the first wire to the diode is with its anode, and in another the connection is with the cathode.
1. A semiconductor device comprising:
an SiC-MOSFET which is a semiconductor device made of a semiconducting material that chiefly includes SiC;
a Schottky barrier diode;
a die pad to which a drain of the SiC-MOSFET and a cathode of the Schottky barrier diode are bonded;
an outside terminal to which the SiC-MOSFET and the Schottky barrier diode are connected; and
a metal member entirely made of and integrally formed of a same material, the metal member being connected to a source of the SiC-MOSFET, an anode of the Schottky barrier diode, and the outside terminal, wherein
an inductance of the metal member from the Schottky barrier diode to the outside terminal is smaller than an inductance of the metal member from the SiC-MOSFET to the outside terminal.
2. The semiconductor device according to claim 1 , wherein
the SiC-MOSFET includes a PN junction diode, and
the metal member connects the anode of the Schottky barrier diode and an anode of the PN junction diode.
3. The semiconductor device according to claim 2 , wherein the metal member is chiefly made of copper.
4. The semiconductor device according to claim 3 , wherein the metal member is a ribbon which is a flexible belt-like connection member or a frame which is a less flexible plate-like metallic member.
5. The semiconductor device according to claim 3 , wherein the SiC-MOSFET and the Schottky barrier diode are arranged along a predetermined one direction with a distance therebetween on the die pad, a source terminal which is the outside terminal is arranged at a position separated toward a direction perpendicular to the predetermined one direction when viewed in plan.
6. The semiconductor device according to claim 5 , wherein the source terminal is arranged closer to the Schottky barrier diode than to the SiC-MOSFET.
7. The semiconductor device according to claim 6 , wherein a gate terminal is arranged with a distance from the source terminal in a direction parallel to the predetermined one direction and approaching to the SiC-MOSFET, and the SiC-MOSFET has a gate at a position close to the gate terminal on a surface thereof having a source.
8. A module, comprising:
an upper arm including a semiconductor device according to claim 1 ; and
a lower arm including a semiconductor device according to claim 1 , wherein
a source of the SiC-MOSFET in the upper arm is connected to a drain of the SiC-MOSFET in the lower arm.
9. An inverter circuit, comprising:
a first module including a module according to claim 8 , and
a second module including a module according to claim 8 , wherein
a load is to be connected between a connection point of the upper and lower arms in the first module and another connection point of the upper and lower arms in the second module.
10. A converter, comprising the module according to claim 8 .
11. A driving method of the module according to claim 8 , wherein
the SiC-MOSFETs included in the first and second arms have respective PN junction diodes,
the SiC-MOSFET in the upper arm and the SiC-MOSFET in the lower arm are alternately turned on with a dead time period being intervened, no current flows through the PN junction diode during the dead time period.
12. A semiconductor device, comprising:
a bipolar device made of a semiconducting material including SiC, and including a PN junction diode,
a unipolar device including a Schottky barrier diode;
a die pad to which the bipolar device and the unipolar device are bonded;
an outside terminal to which a cathode side surface of the PN junction diode in the bipolar device and a cathode side surface of the Schottky barrier diode in the unipolar device are connected; and
a metal member entirely made of and integrally formed of a same material, the metal member being connected to an anode side surface of the PN junction diode in the bipolar device, an anode side surface of the Schottky barrier diode in the unipolar device, and the outside terminal, wherein
an inductance of the metal member from the bipolar device to the outside terminal is larger than an inductance of the metal member from the unipolar device to the outside terminal.