Thermal management coolant valves and pumps modular combination
A thermal management device for use in a vehicular or other thermal management circuit utilizes a pump, one or more valves, and one or more pressure/temperature sensors to route coolant through different desired flow paths and maintain components within the thermal circuit at appropriate temperatures.
1. A thermal management device, comprising:
a pump;
a four-way valve comprising a first port configured for attachment to a first coolant flow path external to the thermal management device, the four-way valve configured to receive liquid coolant from the pump and selectively route the liquid coolant through the first port;
a three-way valve comprising a second port configured for attachment to an output of the first coolant flow path, the three-way valve configured to receive liquid coolant through the second port and selectively route the liquid coolant to the pump via a third port, wherein the three-way valve comprises a fourth port configured for attachment to a second coolant flow path external to the thermal management device, the three-way valve configured to selectively route liquid coolant through the third port, wherein liquid coolant routed to the pump via the third port flows through a T-joint, wherein the T-joint comprises an inlet configured for attachment to the second coolant flow path and an outlet, the T-joint configured to receive liquid coolant through the inlet and route the liquid coolant to the pump via the outlet;
a second three-way valve comprising a fifth port and a sixth port, the sixth port configured for attachment to a third coolant flow path external to the thermal management device, wherein the second three-way valve is configured to receive liquid coolant from the four-way valve and route the liquid coolant through the sixth port; and
a sensor configured to measure at least one of a temperature and a pressure of the liquid coolant flowing into the second port,
wherein the thermal management device is installable in a thermal circuit as a single unit.
2. The thermal management device of claim 1 , further comprising a third three-way valve comprising a seventh port configured for attachment to the third coolant flow path, wherein the third three-way valve is configured to receive liquid coolant via the seventh port and selectively route the liquid coolant to the second three-way valve.
3. The thermal management device of claim 2 , wherein the third three-way valve comprises an eighth port configured for attachment to a fourth coolant flow path external to the thermal management device, wherein the third three-way valve is configured to selectively route the liquid coolant through the eighth port or to the second three-way valve.
4. The thermal management device of claim 3 , wherein the four-way valve comprises a ninth port configured for attachment to the fourth coolant flow path, wherein the four-way valve is configured to receive liquid coolant via the ninth port and selectively route the liquid coolant to the first coolant flow path or to the second three-way valve.
5. The thermal management device of claim 1 , further comprising a second sensor configured to measure at least one of a temperature and a pressure of the liquid coolant flowing into the inlet.
6. A modular thermal management device, comprising:
a first module comprising:
a coolant pump;
a three-way valve defining a first outlet; and
a T-joint defining a first inlet, the T-joint being separate from the three-way valve and positioned between the coolant pump and the three-way valve;
wherein the first module is configured to pump coolant through a first fluid path external to the modular thermal management device via the first outlet and the first inlet, and
wherein the modular thermal management device is installable in a thermal circuit as a single unit;
a second module detachably connected to the first module, the second module comprising a four-way valve defining a second outlet;
wherein the three-way valve defines a second inlet, and the second module is configured to enable the coolant pump to pump coolant through a second fluid path external to the modular thermal management device via the second outlet and the second inlet; and
a third module detachably connected to the second module, the third module comprising a second three-way valve defining a third inlet;
wherein the four-way valve defines a third outlet, and the third module is configured to enable the coolant pump to pump coolant through a third fluid path external to the modular thermal management device via the third outlet and the third inlet.
7. The modular thermal management device of claim 6 , further comprising:
a fourth module detachably connected to the third module, the third module comprising a third three-way valve defining a fourth outlet;
wherein the second three-way valve defines a fourth inlet, and the fourth module is configured to enable the coolant pump to pump coolant through a fourth fluid path external to the modular thermal management device via the fourth outlet and the fourth inlet.
8. The modular thermal management device of claim 6 , further comprising:
a sensor for measuring at least one of a coolant temperature and a coolant pressure within the first module.