IP Library Granted Patent US 10,807,776
Granted Patent B2
US 10,807,776 · App. 15/909,385 · Granted Oct 20, 2020

Resin film and process for its production

Inventors: Daisuke Taguchi (Chiyoda-ku, JP); Wataru Kasai (Chiyoda-ku, JP); Yoshiaki Higuchi (Chiyoda-ku, JP)
Assignee: AGC Inc.
B65D59/02B65D39/0005C08F210/02C08F214/262C08F214/265C08J5/18C08L23/0892C08L27/18C09D123/0892B65D2539/008C08F2500/13C08F2800/10C08J2327/18C08L2203/16G01N25/4866Y10T428/1352
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Quick Facts
Patent No.
US 10,807,776
App. No.
15/909,385
Granted
Oct 20, 2020
Kind
B2
Abstract

To provide a resin film which comprises an ethylene/tetrafluoroethylene copolymer and which is to be used as, for example, a rubber plug lamination film to prevent breakage at the time of producing a laminated rubber plug. The resin film comprises an ethylene/tetrafluoroethylene copolymer and is characterized in that the product of the value of the endothermic peak height ΔH (mW/mg) obtained by its DSC-analysis and the haze (%) measured at a thickness of 100 μm, is from 0.1 to 0.2 (mW/mg·%).

Claims (18)

1. A resin film comprising a polymer comprising tetrafluoroethylene (TFE), ethylene (E), and CH 2 ═CH(CF 2 ) 4 F (PFBE), wherein a content of PFBE is from 4 to 7 mol % with respect to all units in the polymer, and

wherein the product of the value of the endothennic peak height ΔH (mW/mg) obtained by its DSC-analysis, and the haze value (%) at a thickness of 100 μm, is from 0.1 to 0.2 (mW/mg-%).

2. The resin film according to claim 1 , wherein the endothermic peak height ΔH is at most 0.15 mW/mg, and the melting point is at least 200° C.

3. The resin film according to claim 1 , wherein the haze value at a thickness of 100 μm is at most 1.8%.

4. The resin film according to claim 1 , wherein the tensile elongation at break in each of the MD direction and the TD direction at 180° C. is at least 850%.

5. The resin film according to claim 1 , wherein in the polymer, the molar ratio of units derived from tetrafluoroethylene to units derived from ethylene is from 40/60 to 60/40.

6. The resin film according to claim 1 , which is used as a surface coating film for a laminated rubber plug.

7. The resin film according to claim 1 , which is a film material for membrane structure facilities, a film material for agricultural horticultural houses, or a release film for the production of semiconductor devices or LED chips.

8. A process for producing a resin film according to claim 1 , comprising:

melt extrusion molding the polymer comprising tetrafluoroethylene (TFE), ethylene (E), and CH 2 ═CH(CF 2 ) 4 F (PFBE) held in a hopper section in the presence of inert gas or under reduced pressure, at a molding temperature of at least 330° C.,

wherein a content of PFBE is from 4 to 7 mol % with respect to all units in the polymer, and

wherein the product of the value of the endothermic peak height ΔH (mW/mg) obtained by its DSC-analysis, and the haze value (%) at a thickness of 100 μm, is from 0.1 to 0.2 (mW/mg·%).

9. The process for producing a resin film according to claim 8 , wherein the resin film has a tensile elongation at break of at least 850% in each of the MD direction and the TD direction at 180° C.

10. The process for producing a resin film according to claim 8 , wherein in the polymer, the molar ratio of units derived from tetrafluoroethylene to units derived from ethylene is from 40/60 to 60/40.

11. A process for producing a laminated rubber plug, comprising:

press-heating a resin film according to claim 1 and a rubber material comprising a crosslinking agent, laminated on a cavity in a mold having a predetermined rubber plug shape, at a temperature of at least 150° C.

12. A laminated rubber plug for sealing a container opening of a container, comprising a top plate portion having an outer diameter larger than an inner diameter of said container opening, and a leg portion in a cylindrical shape projecting from a lower surface of the top plate portion, to be in contact with the container opening, and forming a hollow interior space, and characterized in that the lower surface of the top plate portion and the leg portion are coated with a resin film according to claim 1 .

13. The resin film according to claim 1 , wherein a melting point of the polymer is from 200 to 250° C.

Assignments (2)
CHANGE OF NAME Recorded Aug 7, 2018
From: ASAHI GLASS COMPANY, LIMITED
To: AGC INC.
Reel/Frame 046730/0786 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2018
From: TAGUCHI, DAISUKE; KASAI, WATARU; HIGUCHI, YOSHIAKI
To: ASAHI GLASS COMPANY, LIMITED
Reel/Frame 045079/0677 →