Cooling system for removable non-volatile memory drive
View Patent ↗An information handling system may include a removable non-volatile memory module, including a non-volatile memory drive and a guide rail, and a module cage configured to receive the removable module. The module cage may include a thermal pad and a guide rail mating feature into which the guide rail of the removable module is inserted during installation to maneuver the removable module into an operating position. The guide rail mating feature may prevent the removable module from contacting the thermal pad until the removable module reaches, or nears, its operating position, at which point a wedge feature of the guide rail mating feature may press the removable module downward to contact the thermal pad. The thermal pad may include an abrasion resistance overlay. The module cage may include a metal plate below the thermal pad coupled to a heat pipe that directs heat toward a fan housing.
1. An information handling system, comprising:
a removable non-volatile memory module, the removable non-volatile memory module including:
a non-volatile memory drive; and
a guide rail;
a module cage installed in the information handling system and configured to receive the removable non-volatile memory module; the module cage including:
a thermal pad installed in a fixed position within the module cage;
a guide rail mating feature into which the guide rail of the removable non-volatile memory module is inserted during installation of the removable non-volatile memory module in the module cage to maneuver the removable non-volatile memory module into an operating position, the guide rail mating feature shaped to mate with the guide rail during the installation; and
a flexible tab at an end of the guide rail mating feature opposite the operating position configured to press upward on the removable non-volatile memory module as the removable non-volatile memory module passes over the flexible tab during installation of the removable non-volatile memory module in the module cage;
wherein:
when the guide rail of the removable non-volatile memory module travels over a first portion of the guide rail mating feature prior to the removable non-volatile memory module reaching the operating position, the guide rail mating feature prevents the removable non-volatile memory module from contacting the thermal pad; and
when the removable non-volatile memory module reaches the operating position, the guide rail mating feature causes the removable non-volatile memory module to contact the thermal pad.
2. The information handling system of claim 1 , wherein:
the thermal pad comprises:
a thermally conductive interface layer to conduct heat away from the removable non-volatile memory module when the removable non-volatile memory module is installed in the module cage; and
an abrasion resistance overlay covering the thermally conductive interface layer; and
when the removable non-volatile memory module reaches the operating position, the guide rail mating feature causes the removable non-volatile memory module to contact the abrasion resistance overlay of the thermal pad.
3. The information handling system of claim 2 , wherein the abrasion resistance overlay comprises brass, brass plated steel, beryllium copper, a heat-resistant polyester resin, polytetrafluoroethylene, or copper foil.
4. The information handling system of claim 1 , wherein the module cage further comprises:
a metal plate below and in contact with the thermal pad; and
a heat pipe physically coupled to the metal plate to direct heat away from the thermal pad.
5. The information handling system of claim 4 , wherein:
the information handling system further comprises a fan housing; and
the heat pipe is physically coupled to the fan housing to direct heat from the module cage toward the fan housing.
6. The information handling system of claim 4 , wherein the metal plate comprises an aluminum sheet.
7. The information handling system of claim 1 , wherein:
the guide rail of the removable non-volatile memory module comprises a wedge feature positioned at the leading edge of the guide rail during installation of the removable non-volatile memory module in the module cage;
the guide rail mating feature of the module cage comprises a wedge mating feature at an end of the guide rail mating feature proximate the operating position; and
when the removable non-volatile memory module reaches the operating position, the wedge mating feature of the guide rail mating feature exerts a force on the wedge feature of the guide rail causing the removable non-volatile memory module to be pressed downward and to contact the thermal pad.
8. The information handling system of claim 1 , wherein:
the removable non-volatile memory module further comprises a lip feature positioned opposite the leading edge of the guide rail during installation of the removable non-volatile memory module in the module cage; and
the module cage further comprises a lip mating feature configured to retain the lip feature of the removable non-volatile memory module when the removable non-volatile memory module is in the operating position.
9. A module cage for retaining a removable non-volatile memory module, comprising:
a thermal pad installed in a fixed position within the module cage;
a guide rail mating feature into which a guide rail of the removable non-volatile memory module is inserted during installation of the removable non-volatile memory module in the module cage to maneuver the removable non-volatile memory module into an operating position, the guide rail mating feature shaped to mate with the guide rail during the installation; and
a flexible tab at an end of the guide rail mating feature opposite the operating position configured to press upward on the removable non-volatile memory module as the removable non-volatile memory module passes over the flexible tab during installation of the removable non-volatile memory module in the module cage;
wherein:
when the guide rail of the removable non-volatile memory module travels over a first portion of the guide rail mating feature prior to the removable non-volatile memory module reaching the operating position, the guide rail mating feature prevents the removable non-volatile memory module from contacting the thermal pad; and
when the removable non-volatile memory module reaches the operating position, the guide rail mating feature causes the removable non-volatile memory module to contact the thermal pad.
10. The module cage of claim 9 , wherein:
the thermal pad comprises:
a thermally conductive interface layer to conduct heat away from the removable non-volatile memory module when the removable non-volatile memory module is installed in the module cage; and
an abrasion resistance overlay covering the thermally conductive interface layer; and
when the removable non-volatile memory module reaches the operating position, the guide rail mating feature causes the removable non-volatile memory module to contact the abrasion resistance overlay of the thermal pad.
11. The module cage of claim 10 , wherein the abrasion resistance overlay comprises brass, brass plated steel, beryllium copper, a heat-resistant polyester resin, polytetrafluoroethylene, or copper foil.
12. The module cage of claim 9 , wherein the module cage further comprises:
a metal plate below and in contact with the thermal pad; and
a heat pipe physically coupled to the metal plate to direct heat away from the thermal pad.
13. The module cage of claim 12 , wherein:
the heat pipe is physically coupled to a fan housing to direct heat from the module cage toward the fan housing.
14. The module cage of claim 12 , wherein the metal plate comprises an aluminum sheet.
15. The module cage of claim 9 , wherein:
the guide rail mating feature of the module cage comprises a wedge mating feature at an end of the guide rail mating feature proximate the operating position; and
when the removable non-volatile memory module reaches the operating position, the wedge mating feature of the guide rail mating feature exerts a force on a wedge feature of the guide rail positioned at the leading edge of the guide rail during installation of the removable non-volatile memory module in the module cage causing the removable non-volatile memory module to be pressed downward and to contact the thermal pad.
16. The module cage of claim 9 , wherein:
the module cage further comprises a lip mating feature configured to retain a lip feature of the removable non-volatile memory module positioned opposite the leading edge of the guide rail during installation of the removable non-volatile memory module in the module cage when the removable non-volatile memory module is in the operating position.