Micro device transfer head

1. A micro device transfer head, comprising:

a first base arm including a first surface and a second surface;

a second base arm disposed on the second surface of the first base arm and including one or multiple sensing elements;

a first side arm including one or multiple first electrodes and disposed on the first surface of the first base arm at a first end of the first base arm;

a second side arm including one or multiple second electrodes and disposed on the first surface of the first base arm at a second end of the first base arm;

an isolation layer disposed on the first surface of the first base arm and covering a surface of the first side arm and a surface of the second side arm;

a first adjusting arm disposed on the second surface of the first base arm at a location corresponding to a space between the first side arm and the second side arm;

a second adjusting arm disposed on the second surface of the first base arm at the first end of the first base arm; and

a third adjusting arm disposed on the second surface of the first base arm at the second end of the first base arm.

2. The micro device transfer head of claim 1 , wherein the first base arm further includes one or multiple third electrodes.

3. The micro device transfer head of claim 1 , wherein the one or multiple sensing elements are one or multiple electrodes or electromagnetic coils.

4. The micro device transfer head of claim 1 , wherein:

the first side arm includes a first hook-shaped structure at an end which is farthest away from the first base arm; and

the second side arm includes a second hook-shaped structure at an end which is farthest away from the first base arm.