Sensor module with blade insert

1. A sensor module, comprising:

a dual gauge lead frame, the lead frame including:

a die pad,

a plurality of lead fingers spaced around the die pad and extending generally perpendicularly thereto, wherein each of the lead fingers has a proximal end near to the die pad and a distal end farther from the die pad, and

two or more blade-type leads having proximal ends connected to the distal ends of two or more of the plurality of lead fingers, wherein the die pad and the plurality of lead fingers have a first thickness and the blade-type leads have a second thickness that is greater than the first thickness;

a first semiconductor die attached on a top surface of the die pad;

first electrical connections connecting electrodes on an active surface of the first semiconductor die to the proximal ends of respective ones of the plurality of lead fingers;

a plurality of passive devices, each passive device mounted on and connected across respective pairs of the plurality of lead fingers;

a mold compound covering the die pad, the first semiconductor die, the plurality of passive devices, the first electrical connections, and the proximal ends of the plurality of lead fingers and the two or more blade-type leads, wherein the mold compound forms a generally rectangular molded body.

2. The sensor module of claim 1 , wherein the blade-type leads extend only from one side of the molded body.

3. The sensor module of claim 2 , wherein the plurality of lead fingers extend from one other side of the molded body.

4. The sensor module of claim 3 , wherein the blade-type leads transmit and receive functional signals and the plurality of lead fingers transmit and receive test signals.

5. The sensor module of claim 3 , wherein the plurality of lead fingers extend a first distance from the molded body and the blade-type leads extend a second distance from the molded body that is greater than the first distance.

6. The sensor module of claim 5 , wherein the first distance is less than 1 mm and the second distance is less than 10 mm.

7. The sensor module of claim 2 , wherein the plurality of lead fingers extend from at least two other sides of the molded body.

8. The sensor module of claim 1 , wherein the proximal ends of the blade-type leads are integral with the distal ends of the two or more of the plurality of lead fingers.

9. The sensor module of claim 1 , wherein the first thickness is about 0.25 mm and the second thickness is less than 0.64 mm.

10. The sensor module of claim 1 , wherein at least the distal ends of the lead fingers and the blade-type leads are plated with a metal or a metal alloy.

11. The sensor module of claim 1 , further comprising a sensor housing within which the molded body and the distal ends of the plurality of lead fingers are encased.

12. The sensor module of claim 1 , further comprising:

a second semiconductor die attached on a top side of the first semiconductor die; and

second electrical connections connecting the second semiconductor die to at least one of the first semiconductor die and at least one of the lead fingers,

wherein the first semiconductor die comprises an application specific integrated circuit (ASIC) and the second semiconductor die comprises an acceleration sensor.

13. The sensor module of claim 1 , wherein the first and second electrical connections comprise bond wires.

14. A method of assembling a sensor module, the method comprising:

providing a dual gauge lead frame, the lead frame including:

a die pad,

a plurality of lead fingers spaced around the die pad and extending generally perpendicularly thereto, wherein each of the lead fingers has a proximal end near to the die pad and a distal end farther from the die pad, and

two or more blade-type leads connected to the distal ends of two or more of the plurality of lead fingers, wherein the die pad and the plurality of lead fingers have a first thickness and the blade-type leads have a second thickness that is greater than the first thickness;

attaching a first semiconductor die to the die pad;

electrically connecting electrodes on an active surface of the first semiconductor die to the proximal ends of respective ones of the plurality of lead fingers;

mounting and electrically connecting a plurality of passive devices across respective pairs of the plurality of lead fingers; and

covering the die pad, the first semiconductor die, the passive devices, the electrical connections, and the proximal ends of the plurality of lead fingers and the two or more blade-type leads with a mold compound, thereby forming a generally rectangular molded body.

15. The method of claim 14 , wherein the blade-type leads extend only from one side of the molded body.

16. The method of claim 15 , wherein the plurality of lead fingers extend from one other side of the molded body.

17. The method of claim 16 , wherein the plurality of lead fingers extend a first distance from the molded body and the blade-type leads extend a second distance from the molded body that is greater than the first distance.

18. The method of claim 14 , wherein the proximal ends of the blade-type leads are attached to the distal ends of respective ones of the plurality of lead fingers.

19. The method of claim 14 , further comprising encasing the molded body in a housing, thereby forming the sensor module.

20. The method of claim 14 , further comprising:

attaching a second semiconductor die on a top side of the first semiconductor die; and

electrically connecting the second semiconductor die to at least one of the first semiconductor die and at least one of the lead fingers,

wherein the first semiconductor die comprises an application specific integrated circuit (ASIC) and the second semiconductor die comprises an acceleration sensor.