Process for producing wiring substrate

1. A process for producing a wiring substrate comprising:

a layer (A) which is made of a fluororesin material containing a melt-moldable fluororesin (a) having at least one type of functional groups selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups, and a reinforcing fiber substrate made of woven fabric or non-woven fabric, and which has a dielectric constant of from 2.0 to 3.5;

a first conductor layer formed on a first surface side of the layer (A);

a second conductor layer formed on a second surface side opposite from the first surface of the layer (A); and

at least one layer (B) made of a cured product of a thermosetting resin formed between any two of the layer (A) and the two conductor layers or outside of either of the two conductor layers; and

the wiring substrate having a hole which opens at least from the first conductor layer through the second conductor layer and having a plating layer formed on an inner wall surface of the hole;

the process comprising forming the hole in a laminate comprising the first conductor layer, the layer (A), the second conductor layer and the layer (B); and

applying, to an inner wall surface of the hole formed, at least one of a treatment with a permanganic acid solution and a plasma treatment without conducting an etching treatment using metal sodium, and then forming the plating layer on the inner wall surface of the hole.

2. The process for producing a wiring substrate according to claim 1 , wherein the wiring substrate has a layer structure of first conductor layer/layer (A)/second conductor layer/layer (B) or first conductor layer/layer (A)/layer (B)/second conductor layer.

3. The process for producing a wiring substrate according to claim 1 , wherein the wiring substrate further has, as layers constituting the wiring substrate, a third conductor layer and a fourth conductor layer and has a layer structure of first conductor layer/layer (A)/second conductor layer/layer (B)/third conductor layer/layer (B)/fourth conductor layer.

4. The process for producing a wiring substrate according to claim 1 , wherein the wiring substrate further has, as layers constituting the wiring substrate, an adhesive layer made of a resin material other than a cured product of a thermosetting resin, a third conductor layer and a fourth conductor layer and has a layer structure of first conductor layer/layer (A)/second conductor layer/adhesive layer/third conductor layer/layer (B)/fourth conductor layer.

5. The process for producing a wiring substrate according to claim 1 , wherein the functional groups contain at least carbonyl group-containing groups, and the carbonyl group-containing groups are at least one member selected from the group consisting of groups having a carbonyl group between carbon atoms in a hydrocarbon group, carbonate groups, carboxy groups, haloformyl groups, alkoxycarbonyl groups and acid anhydride residues.

6. The process for producing a wiring substrate according to claim 1 , wherein the content of the functional groups in the fluororesin (a) is from 10 to 60,000 groups per 1×10 6 carbon atoms in the main chain of the fluororesin (a).

7. The process for producing a wiring substrate according to claim 1 , wherein the layer (A) has a dielectric constant of from 2.0 to 3.0.

8. The process for producing a wiring substrate according to claim 1 , wherein the layer (A) has a linear expansion coefficient of from 0 to 35 ppm/° C.

9. The process for producing a wiring substrate according to claim 1 , wherein the layer (B) contains glass fibers.

10. A process for producing a wiring substrate comprising:

a layer (A) which is made of a fluororesin material containing a melt-moldable fluororesin (a) having at least one type of functional groups selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups, and a reinforcing fiber substrate made of woven fabric or non-woven fabric, and which has a dielectric constant of from 2.0 to 3.5;

a first conductor layer formed on a first surface side of the layer (A);

a second conductor layer formed on a second surface side opposite from the first surface of the layer (A); and

at least one layer (B) made of a cured product of a thermosetting resin formed between the layer (A) and the second conductor layer or outside of the second conductor layer; and

the wiring substrate having a hole which opens at least from the first conductor layer through the second conductor layer and having a plating layer formed on an inner wall surface of the hole;

the process comprising forming, in a laminate comprising the layer (A), the second conductor layer and the layer (B), a hole which opens at least from the first surface of the layer (A) through the second conductor layer;

applying, to an inner wall surface of the hole formed, at least one of a treatment with a permanganic acid solution and a plasma treatment without conducting an etching treatment using metal sodium, and then forming the plating layer on the inner wall surface of the hole; and then

forming the first conductor layer on the first surface side of the layer (A).

11. A wiring substrate comprising:

a layer (A) which is made of a fluororesin material containing a melt-moldable fluororesin (a) having at least one type of functional groups selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups, and a reinforcing fiber substrate made of woven fabric or non-woven fabric, and which has a dielectric constant of from 2.0 to 3.5;

a first conductor layer formed on a first surface side of the layer (A);

a second conductor layer formed on a second surface side opposite from the first surface of the layer (A); and

at least one layer (B) made of a cured product of a thermosetting resin formed between any two of the layer (A) and the two conductor layers or outside of either of the two conductor layers; and

having a hole which opens at least from the first conductor layer through the second conductor layer and having a plating layer formed on an inner wall surface of the hole.

12. The wiring substrate according to claim 11 , which has a layer structure of first conductor layer/layer (A)/second conductor layer/layer (B) or first conductor layer/layer (A)/layer (B)/second conductor layer.

13. The wiring substrate according to claim 11 , which further has, as layers constituting the wiring substrate, a third conductor layer and a fourth conductor layer and has a layer structure of first conductor layer/layer (A)/second conductor layer/layer (B)/third conductor layer/layer (B)/fourth conductor layer.

14. The wiring substrate according to claim 11 , which further has, as layers constituting the wiring substrate, an adhesive layer made of a resin material other than a cured product of a thermosetting resin, a third conductor layer and a fourth conductor layer and has a layer structure of first conductor layer/layer (A)/second conductor layer/adhesive layer/third conductor layer/layer (B)/fourth conductor layer.

15. An antenna, which comprises the wiring substrate as defined in claim 11 , wherein at least one of the first conductor layer and the second conductor layer is a conductor layer having an antenna pattern.