IP Library Granted Patent US 11,209,923
Granted Patent B2
US 11,209,923 · App. 15/929,435 · Granted Dec 28, 2021

Protective film for metal mesh touch sensor

Inventors: Robert Routh (Latham, NY); Michael Morrione (Jackson, CA)
Assignee: FUTURETECH CAPITAL, INC.
G06F3/0412H05K3/287G06F2203/04103G06F2203/04112
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,209,923
App. No.
15/929,435
Granted
Dec 28, 2021
Kind
B2
Abstract

Touchscreen, comprising: a display device; a touch sensor over the display device; and, a cover lens; wherein the touch sensor comprises: a transparent substrate; a layer of catalytic photoresist patterns of a catalytic photoresist composition, the catalytic photoresist composition including a photoresist and catalytic nanoparticles; a metal conductive layer with conductive patterns over the layer of catalytic photoresist patterns; a metal passivation layer over the metal layer; and a transparent protective layer over the metal passivation layer.

Claims (45)

1. A method of manufacturing a touch sensor with a conductive micro-mesh comprising:

applying the catalytic photoresist composition onto a transparent substrate of the touch sensor;

photo patterning the catalytic photoresist composition to have a layer of catalytic photoresist pattern;

plating a metal layer on the layer of catalytic photoresist pattern thereby forming the conductive micro-mesh;

applying a metal passivation layer over the metal layer;

degassing a clear protective coating solution;

applying the clear protective coating over the metal passivation layer; and

curing the protective coating prior to attaching a flex cable to the touch sensor.

2. The method of claim 1 , wherein applying a protective coating comprises applying a solution comprising: 70%-80% monofunctional acrylic oligomers and 20%-30% solvent.

3. The method of claim 2 , wherein the curing is performed by baking the protective coating.

4. The method of claim 3 , wherein the baking is performed at a temperature of from about 100 to about 120 degrees Celsius, for a period of from 30 to about 40 seconds.

5. The method of claim 2 , further comprising including 1-6% photoinitiators in the solution and wherein the curing is performed by irradiating the protective coating with UV radiation.

6. The method of claim 1 , wherein applying the protective coating comprises applying coating solution over the conductive micro-mesh and a bond pad area of the touch sensor.

7. The method of claim 6 , further comprising adhering the flex cable to the bond pad area.

8. The method of claim 7 , wherein adhering the flex cable comprises causing solder particle suspended in an adhesive to penetrate the protective coating.

9. The method of claim 1 , wherein applying the protective coating comprises applying a protective solution to a thickness of 1-2 microns.

10. The method of claim 1 , wherein curing the protective coating comprises applying one of thermal partial curing and irradiation partial curing.

11. A conductive mesh touch sensor comprising:

a transparent substrate;

a layer of catalytic photoresist patterns made of a catalytic photoresist composition, the catalytic photoresist composition including a photoresist and catalytic nanoparticles;

a metal conductive layer with conductive patterns forming a conductive mesh over the layer of catalytic photoresist patterns;

a metal passivation layer over the metal layer;

a clear protective coating over the metal passivation layer; and

a flex cable provided over the clear protective coating.

12. The touch sensor of claim 11 , wherein the metal conductive layer includes copper and the metal passivation layer includes palladium.

13. The touch sensor of claim 12 , wherein the clear protective coating covers the conductive mesh and a bond pad area of the touch sensor.

14. The touch sensor of claim 13 , wherein the flex cable is attached to the bond pad with adhesive, the adhesive comprising a plurality of solder particles that penetrate the clear protective coating.

15. The touch sensor of claim 11 , wherein the clear protective coating includes monofunctional acrylic oligomers.

16. The touch sensor of claim 12 , wherein the clear protective coating has a thickness of between 1 to 3 micrometers.

17. A touchscreen, comprising:

a display device;

a touch sensor over the display device;

a cover lens; and,

an optically clear adhesive or resin between the touch sensor and the cover lens;

wherein the touch sensor comprises: a transparent substrate; a layer of catalytic photoresist patterns of a catalytic photoresist composition, the catalytic photoresist composition including a photoresist and catalytic nanoparticles; a metal conductive layer with conductive patterns over the layer of catalytic photoresist patterns; a metal passivation layer over the metal layer; and a transparent protective layer over the metal passivation layer.

18. The touchscreen of claim 17 , wherein the clear protective coating includes monofunctional acrylic oligomers.

19. The touchscreen of claim 17 , wherein the transparent protective layer covers the metal passivation layer and a bond pad area of the touch sensor.

20. The touchscreen of claim 19 , further comprising a flex cable attached to the bond pad with adhesive, the adhesive comprising a plurality of solder particles that penetrate the transparent protective layer.

21. The touchscreen of claim 17 , wherein transparent protective layer comprises partially cured monofunctional acrylic oligomers.

22. A touch sensor, comprising:

a transparent substrate;

a metal conductive layer with conductive patterns and bond pads formed over the transparent substrate;

a metal passivation layer over the metal layer;

a transparent protective layer over the metal passivation layer and the bond pads;

a flex cable attached to the bond pad and having a plurality of solder particles that penetrate the transparent protective layer and contact the bond pads.

Assignments (2)
CHANGE OF NAME Recorded Jul 22, 2020
From: FUTURE TECH CAPITAL, LLC
To: FUTURETECH CAPITAL, INC
Reel/Frame 054085/0521 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 5, 2020
From: ROUTH, ROBERT; MORRIONE, MICHAEL
To: FUTURE TECH CAPITAL, LLC
Reel/Frame 052574/0516 →
Continuity (1)
Related Publication 20210342026A1 · Nov 4, 2021