Semiconductor pressure sensor
View Patent ↗A semiconductor pressure sensor includes: a first semiconductor substrate having a plurality of recesses formed thereon; an intermediate semiconductor substrate joined to the first semiconductor substrate with a first oxide film interposed therebetween; a second semiconductor substrate joined to the intermediate semiconductor substrate with a second oxide film interposed therebetween; a first reference pressure chamber formed as a space surrounded by a first recess of the first semiconductor substrate and the intermediate semiconductor substrate; a second reference pressure chamber formed as a space surrounded by a second recess formed on the first semiconductor substrate, the intermediate semiconductor substrate, and the second semiconductor substrate, the intermediate semiconductor substrate having a through hole communicating with the second recess of the first semiconductor substrate; and piezoresistors formed on a surface of the second semiconductor substrate that receives pressure, along outer peripheries of the first and second reference pressure chambers.
1. A semiconductor pressure sensor comprising:
a first semiconductor substrate having a plurality of recesses formed thereon;
an intermediate semiconductor substrate joined to the first semiconductor substrate with a first oxide film interposed therebetween;
a second semiconductor substrate joined to the intermediate semiconductor substrate with a second oxide film interposed therebetween;
a first reference pressure chamber formed as a first space surrounded by a first recess of the first semiconductor substrate and the intermediate semiconductor substrate;
a second reference pressure chamber formed as a second space surrounded by a second recess formed on the first semiconductor substrate, the intermediate semiconductor substrate, and the second semiconductor substrate, the intermediate semiconductor substrate having a through hole communicating with the second recess of the first semiconductor substrate, the second semiconductor substrate being exposed to the second space without being exposed to the first space; and
piezoresistors formed on a surface of the second semiconductor substrate that receives pressure, along outer peripheries of the first reference pressure chamber and the second reference pressure chamber.
2. The semiconductor pressure sensor according to claim 1 , further comprising a protective film formed on the surface of the second semiconductor substrate that receives pressure.
3. The semiconductor pressure sensor according to claim 1 , further comprising a protective film formed on the surface of the second semiconductor substrate that receives pressure, on a side surface of the second semiconductor substrate, on a side surface of the intermediate semiconductor substrate, on a side surface of the first oxide film, and on a side surface of the second oxide film.
4. A semiconductor pressure sensor comprising:
a first semiconductor substrate having a plurality of recesses formed thereon;
a first intermediate semiconductor substrate joined to the first semiconductor substrate with a first oxide film interposed therebetween;
a second intermediate semiconductor substrate joined to the first intermediate semiconductor substrate with a second oxide film interposed therebetween;
a second semiconductor substrate joined to the second intermediate semiconductor substrate with a third oxide film interposed therebetween;
a first reference pressure chamber formed as a space surrounded by a first recess of the first semiconductor substrate and the first intermediate semiconductor substrate;
a second reference pressure chamber formed as a space surrounded by a second recess formed on the first semiconductor substrate, the first intermediate semiconductor substrate, and the second intermediate semiconductor substrate, the first intermediate semiconductor substrate having a through hole communicating with the second recess of the first semiconductor substrate;
a third reference pressure chamber formed as a space surrounded by a third recess formed on the first semiconductor substrate, the first intermediate semiconductor substrate, the second intermediate semiconductor substrate, and the second semiconductor substrate, the first intermediate semiconductor substrate having a through hole communicating with the third recess of the first semiconductor substrate, the second intermediate semiconductor substrate having a through hole communicating with the third recess of the first semiconductor substrate; and
piezoresistors formed on a surface of the second semiconductor substrate that receives pressure, along outer peripheries of the first reference pressure chamber, the second reference pressure chamber, and the third reference pressure chamber.
5. The semiconductor pressure sensor according to claim 4 , further comprising a protective film formed on the surface of the second semiconductor substrate that receives pressure.
6. The semiconductor pressure sensor according to claim 5 , wherein the protective film is a multilayer film obtained by laminating silicon nitride films SiNx that satisfy 1≤x≤4/3 and that do not contain hydrogen and oxygen.
7. The semiconductor pressure sensor according to claim 4 , further comprising a protective film formed on the surface of the second semiconductor substrate that receives pressure, on a side surface of the second semiconductor substrate, on a side surface of the first intermediate semiconductor substrate, on a side surface of the second intermediate semiconductor substrate, on a side surface of the first oxide film, on a side surface of the second oxide film, and on a side surface of the third oxide film.
8. The semiconductor pressure sensor according to claim 7 , wherein the protective film is a multilayer film obtained by laminating silicon nitride films SiNx that satisfy 1≤x≤4/3 and that do not contain hydrogen and oxygen.
9. A semiconductor pressure sensor comprising:
a first semiconductor substrate having a plurality of recesses formed thereon;
an intermediate semiconductor substrate joined to the first semiconductor substrate with a first oxide film interposed therebetween;
a second semiconductor substrate joined to the intermediate semiconductor substrate with a second oxide film interposed therebetween;
a first reference pressure chamber formed as a space surrounded by a first recess of the first semiconductor substrate and the intermediate semiconductor substrate;
a second reference pressure chamber formed as a space surrounded by a second recess formed on the first semiconductor substrate, the intermediate semiconductor substrate, and the second semiconductor substrate, the intermediate semiconductor substrate having a through hole communicating with the second recess of the first semiconductor substrate;
piezoresistors formed on a surface of the second semiconductor substrate that receives pressure, along outer peripheries of the first reference pressure chamber and the second reference pressure chamber; and
a protective film formed on the surface of the second semiconductor substrate that receives pressure,
wherein the protective film is a multilayer film obtained by laminating silicon nitride films SiNx that satisfy 1≤x≤4/3 and that do not contain hydrogen and oxygen.
10. A semiconductor pressure sensor comprising,
a first semiconductor substrate having a plurality of recesses formed thereon;
an intermediate semiconductor substrate joined to the first semiconductor substrate with a first oxide film interposed therebetween;
a second semiconductor substrate joined to the intermediate semiconductor substrate with a second oxide film interposed therebetween,
a first reference pressure chamber formed as a space surround by a first recess of the first semiconductor substrate and the intermediate semiconductor substrate;
a second reference pressure chamber formed as a space surrounded by a second recess formed on the first semiconductor substrate, the intermediate semiconductor substrate, and the second semiconductor substrate, the intermediate semiconductor substrate having a through hole communicating with the second recess of the first semiconductor substrate;
piezoresistors formed on a surface of the second semiconductor substrate that receives pressure, along outer peripheries of the first reference pressure chamber and the second reference pressure chamber; and
a protective film formed on the surface of the second semiconductor substrate that receives pressure, on a side surface of the second semiconductor substrate, on a side surface of the intermediate semiconductor substrate, on a side surface of the first oxide film, and on a side surface of the second oxide film,
wherein the protective film is a multilayer film obtained by laminating silicon nitride films SiNx that satisfy, 1≤x≤4/3 and that do not contain hydrogen and oxygen.