Signal handling device including a surface integrated waveguide and a resonating cavity formed in multiple substrate layers
A signal handling device includes a first substrate. A plurality of first conductors in the first substrate are arranged to form a substrate integrated waveguide. A second substrate includes a plurality of second conductors arranged to form a resonating cavity near one end of the substrate integrated waveguide. A signal carrier is aligned with the one end of the substrate integrated waveguide.
1. A signal handling device, comprising:
a first substrate;
a plurality of first conductors in the first substrate, the plurality of first conductors being arranged to form a substrate integrated waveguide;
a second substrate;
a plurality of second conductors in the second substrate, the plurality of second conductors being arranged to form a resonating cavity near one end of the substrate integrated waveguide;
a signal carrier aligned with the one end of the substrate integrated waveguide; and
a pressure sensitive adhesive aligned with one side of the first substrate and wherein at least a portion of one end of the signal carrier is secured to the pressure sensitive adhesive.
2. The signal handling device of claim 1 , wherein
the first substrate comprises a dielectric material;
the plurality of first conductors comprise vias;
the second substrate comprises a dielectric material;
the plurality of second conductors comprise vias; and
the signal carrier comprises a waveguide.
3. The signal handling device of claim 2 , wherein the waveguide comprises an air-filled waveguide.
4. The signal handling device of claim 1 , wherein
the first substrate is planar;
the second substrate is planar and parallel with the first substrate;
the signal carrier is at least partially transverse to the first substrate.
5. The signal handling device of claim 4 , wherein the signal carrier is at least partially perpendicular to the first substrate.
6. A signal handling device, comprising:
a first substrate;
a plurality of first conductors in the first substrate, the plurality of first conductors being arranged to form a substrate integrated waveguide;
a second substrate;
a plurality of second conductors in the second substrate, the plurality of second conductors being arranged to form a resonating cavity near one end of the substrate integrated waveguide;
a signal carrier aligned with the one end of the substrate integrated waveguide;
a first conductive layer on one side of the first substrate, the first conductive layer being in conductive contact with the plurality of first conductors, the first conductive layer including a first opening aligned with the one end of the substrate integrated waveguide;
a second conductive layer on an oppositely facing side of the first substrate, the second conductive layer being in conductive contact with the plurality of first conductors, the second conductive layer including a second opening aligned with the first opening;
an adhesive in contact with the second conductive layer, the adhesive securing the second substrate and the second conductive layer together; and
a third conductive layer on a side of the second substrate that faces away from the first substrate, the third conductive layer being in conductive contact with the plurality of second conductors.
7. The signal handling device of claim 6 , comprising a pressure sensitive adhesive aligned with one side of the first substrate and wherein at least a portion of one end of the signal carrier is secured to the pressure sensitive adhesive.
8. The signal handling device of claim 6 , comprising a conductive ribbon layer in contact with the adhesive layer and the second substrate, the conductive ribbon layer being aligned with and in conductive contact with the plurality of second conductors.
9. The signal handling device of claim 8 , wherein the conductive ribbon layer establishes a barrier to prevent signal leakage from the plurality of second conductors through the adhesive layer.
10. The signal handling device of claim 8 , wherein
the conductive ribbon layer establishes a frame corresponding to a perimeter of the resonating cavity formed by the second conductors; and
the conductive ribbon layer has an opening aligned with the first and second openings.
11. The signal handling device of claim 6 , wherein the adhesive in contact with the second conductive layer comprises a fibrous material impregnated with a resin.
12. The signal handling device of claim 6 , wherein each of the first, second and third conductive layers comprises metal.
13. The signal handling device of claim 6 , wherein
the first opening is generally rectangular;
the first opening has four sides;
three of the four sides of the first opening are bordered by at least some of the plurality of first conductors;
the second opening is generally rectangular; and
the second opening is bordered by at least some of the plurality of second conductors.
14. The signal handling device of claim 13 , wherein the at least some of the plurality of first conductors that border the three of the four sides of the first opening are coaxial with respective ones of the at least some of the plurality of second conductors.
15. The signal handling device of claim 13 , wherein
others of the plurality of first conductors are arranged in two parallel lines; and
the others of the plurality of first conductors establish a fence of the substrate integrated waveguide.