IP Library Granted Patent US 10,681,845
Granted Patent B2
US 10,681,845 · App. 15/935,481 · Granted Jun 9, 2020

Systems and methods that use thermal energy transfer devices to reduce thermal energy within environments

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Quick Facts
Patent No.
US 10,681,845
App. No.
15/935,481
Granted
Jun 9, 2020
Kind
B2
Abstract

Systems and methods that use thermal energy transfer devices to reduce thermal energy within environments are disclosed. According to an aspect, a method includes using a cool sink to transfer thermal energy from an environment. The method also includes using a thermal energy transfer device to transfer the thermal energy to liquid within a conduit. Further, the method includes transporting the liquid containing the transferred thermal energy away from the environment such that the thermal energy within the environment is reduced.

Claims (39)

1. A method comprising:

transferring a first portion of thermal energy from an environment within a computing device, wherein the computing device includes a cold sink and a thermal energy transfer device;

transferring the first portion of thermal energy to a liquid within a conduit using the thermal energy transfer device that is physically positioned between the cold sink and the conduit such that a first surface of the thermal energy transfer device is outside a surface of the conduit and a second surface of the thermal energy transfer device is in contact with the cold sink;

capturing, using the thermal energy transfer device, a second portion of thermal energy still present within the environment while the thermal energy transfer device transfers the first portion of the thermal energy to the liquid within the conduit;

transporting the first portion thermal energy into the liquid;

and

transporting the liquid containing the first portion of thermal energy away from the environment such that the thermal energy within the environment is reduced.

2. The method of claim 1 , wherein the temperature of the liquid after transfer of the first portion of thermal energy is greater than the temperature of the environment.

3. The method of claim 1 , wherein the thermal energy transfer device comprises a thermoelectric cooler.

4. The method of claim 1 , wherein transporting the liquid comprises using a pump to transport the liquid.

5. The method of claim 1 , wherein the liquid comprises water.

6. The method of claim 1 , further comprising moving air within the environment via convection.

7. The method of claim 1 , further comprising moving air within the environment via an air transport device.

8. The method of claim 1 , wherein the environment comprises at least one server component.

9. The method of claim 1 , wherein the environment is contained within an insulated housing for one or more electronic components.

10. A method comprising:

providing a computing device having an interior space that is substantially sealed, wherein the interior space contains one or more electronic components;

transfer transferring a first portion of thermal energy from the interior space within the computing device, wherein the computing device includes a cold sink and a thermal energy transfer device;

transferring the first portion of thermal energy to a liquid within a conduit using the thermal energy transfer device that is physically positioned between the cold sink and the conduit such that a first surface of the one thermal energy transfer device is outside a surface of the conduit and a second surface of the one thermal energy transfer device is in contact with the cold sink;

capturing, using the thermal energy transfer device, a second portion of thermal energy still present within the interior space while the one thermal energy transfer device transfers the first portion of the thermal energy to the liquid within the conduit;

transporting the first portion thermal energy into the liquid;

and

transporting the liquid containing the first portion of thermal energy away from the interior space such that the thermal energy within the interior space is reduced.

11. The method of claim 10 , wherein the computing device comprises a server.

12. The method of claim 10 , wherein the temperature of the liquid after transfer of the first portion of thermal energy is greater than the temperature of the interior space.

13. The method of claim 10 , wherein the thermal energy transfer device comprises a thermoelectric cooler.

14. A system comprising:

a computing device having an interior space that is substantially sealed, wherein the interior space contains one or more electronic components;

a cool sink positioned within the interior space for transfer of a first portion of thermal energy from the interior space;

a conduit containing a liquid and thermal-conductively connected to the cold sink;

a thermal energy transfer device that is positioned between the cold sink and the conduit such that a first surface of the thermal energy transfer device is outside a surface of the conduit and a second surface of the thermal energy transfer device is in contact with the cold sink,

wherein the thermal energy transfer device is configured to capture a second portion of thermal energy still present within the interior space while the thermal energy transfer device transfers the first portion of the thermal energy to the liquid within the conduit; and

a pump configured to move liquid containing the first portion of thermal energy away from the interior space.

15. The system of claim 14 , wherein the computing device comprises a server.

16. The system of claim 14 , wherein the thermal energy transfer device comprises a thermoelectric cooler.

17. The system of claim 14 , wherein the liquid comprises water.

18. The system of claim 14 , further comprising a housing that defines the interior space.

19. The system of claim 18 , wherein the housing substantially seals the interior space.

20. The system of claim 18 , wherein the one or more electronic components are contained within the housing.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2025
From: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LIMITED
To: LENOVO GLOBAL TECHNOLOGIES SWITZERLAND INTERNATIONAL GMBH
Reel/Frame 069869/0614 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 26, 2021
From: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE LTD
To: LENOVO GLOBAL TECHNOLOGIES INTERNATIONAL LTD
Reel/Frame 055029/0215 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2018
From: HELLER, MATTHEW AARON; HOLLAND, JEFFREY SCOTT
To: LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
Reel/Frame 045749/0210 →