Semiconductor device and electronic apparatus
View Patent ↗Provided is a semiconductor device enabling highly accurate adjustment of a mounting height at a time when the semiconductor device is mounted on an assembly board, and an electronic apparatus. A linear lead is extracted from a bottom surface of a cylindrical resin sealing body covering a semiconductor chip, and a plurality of helical leads are arranged so as to wind around the linear lead, to thereby form a multi-helical structure. The plurality of helical leads forming the multi-helical structure has the same pitch.
1. A semiconductor device having a plurality of leads extending from a sealing body covering a semiconductor chip,
the semiconductor device, comprising:
a linear lead extending from one principal surface of the sealing body and in a direction perpendicular to the one principal surface; and
a helical electrical lead connected to an electrode on the semiconductor chip and separated from the linear lead and winding around the linear lead in a helical manner.
2. A semiconductor device according to claim 1 , wherein the helical electrical lead has a lead extending portion on the one principal surface.
3. A semiconductor device according to claim 1 , wherein the helical electrical lead has a lead extending portion on a surface of the sealing body different from the one principal surface.
4. A semiconductor device having a plurality of leads extending from a sealing body covering a semiconductor chip, the semiconductor device comprising:
a linear lead extending from one principal surface of the sealing body in a direction perpendicular to the one principal surface; and
a helical electrical lead separated from the linear lead and winding around the linear lead in a helical manner,
wherein the helical electrical lead extends from a side surface of the sealing body.
5. A semiconductor device according to claim 1 , wherein the helical electrical lead has a constant helical pitch.
6. A semiconductor device according to claim 2 , wherein the helical electrical lead has a constant helical pitch.
7. A semiconductor device according to claim 3 , wherein the helical electrical lead has a constant helical pitch.
8. A semiconductor device according to claim 4 , wherein the helical lead has a constant helical pitch.
9. An electronic apparatus, comprising the semiconductor device of claim 1 mounted on an assembly board,
wherein the helical electrical lead comprises a plurality of helical electrical leads and the assembly board includes through-holes and the plurality of helical electrical leads pass through the through-holes, and
wherein the through-holes each have a shape in conformity with a corresponding one of the plurality of helical electrical leads.
10. An electronic apparatus, comprising the semiconductor device of claim 2 mounted on an assembly board,
wherein the helical electrical lead comprises a plurality of helical electrical leads and the assembly board includes through-holes the plurality of helical electrical leads pass through the through-holes, and
wherein the through-holes each have a shape in conformity with a corresponding one of the plurality of helical electrical leads.
11. An electronic apparatus, comprising the semiconductor device of claim 3 mounted on an assembly board,
wherein the helical electrical lead comprises a plurality of helical electrical leads and the assembly board includes through-holes the plurality of helical electrical leads pass through the through-holes, and
wherein the through-holes each have a shape in conformity with a corresponding one of the plurality of helical electrical leads.
12. A semiconductor device according to claim 1 , wherein the helical electrical lead includes a plurality of helical electrical leads defining a multi-helical structure.
13. A semiconductor device according to claim 12 , wherein the plurality of helical electrical leads each have a same radius in a direction perpendicular to an axis direction of the resin sealing body.
14. A semiconductor device according to claim 12 , wherein the plurality of helical electrical leads each have different radii in a direction perpendicular to an axis direction of the resin sealing body.
15. A semiconductor device according to claim 12 , wherein a lead extending portion of at least one of the plurality of helical electrical leads is on the one principal surface, and a lead extending portion of at least another of the plurality of helical electrical leads is on a surface of the sealing body different from the one principal surface.