Warpage compensating RF shield frame

1. An integrated circuit package shield comprising:

a frame comprising two or more segments, the segments to interlock with one another along a substrate and the segments comprising electrically conductive material to electrically couple to the substrate; and

a lid to cover the frame, the lid comprising a conductive material to electrically couple to the substrate.

2. The integrated circuit package shield of claim 1 , wherein a first segment comprises a first interlocking section to interface with a second segment and a second interlocking section to interface with a third segment, wherein the first interlocking section is to restrict movement of the first segment in a first direction and the second interlocking section is to restrict movement of the first segment in a second direction that is unaligned with the first direction.

3. The integrated circuit package shield of claim 2 , wherein the first direction and the second direction are substantially orthogonal.

4. The integrated circuit package shield of claim 2 , wherein the second segment comprises a third interlocking section to interface with the first interlocking section, and the third segment comprises a fourth interlocking section to interface with the second interlocking section.

5. The integrated circuit package shield of claim 4 , wherein the first interlocking section comprises one or more protrusions to interdigitate with one or more protrusions of the third interlocking section and the second interlocking section comprises one or more protrusions to interdigitate with one or more protrusions of the fourth interlocking section.

6. The integrated circuit package shield of claim 5 , wherein the interdigitated one or more protrusions of the first interlocking section and the one or more protrusions of the third interlocking section have a meandering boundary, the meandering boundary to extend from an edge of the substrate to a first distance the frame extends over the substrate, wherein the first distance is substantially orthogonal to the first direction.

7. The integrated circuit package shield of claim 6 , wherein the interdigitated one or more protrusions of the second interlocking section and one or more protrusions of the fourth interlocking section have a second meandering boundary, the second meandering boundary to extend from the edge of the substrate to a second distance the frame extends over the substrate, wherein the second distance is substantially orthogonal to the second direction.

8. The integrated circuit package shield of claim 1 , wherein the one or more protrusions have a rounded profile or a pointed profile.

9. The integrated circuit package shield of claim 1 , wherein the frame further comprises a fourth segment, wherein the fourth segment comprises a fifth interlocking section to interface with the second segment, and a sixth interlocking section to interface with the third segment, and wherein the fifth interlocking section is to restrict movement of the fourth segment in a first direction and the sixth interlocking section is to restrict movement of the fourth segment in a second direction that is unaligned with the first direction.

10. The integrated circuit package shield of claim 1 , wherein the two or more segments comprise two or more elongate members that extend over the substrate, and wherein the two or more elongate members intersect.

11. The integrated circuit package shield of claim 1 , wherein the frame comprises any of copper, nickel or beryllium.

12. A system comprising:

an integrated circuit die on a substrate;

a shield surrounding the integrated circuit die, the shield comprising:

a frame laterally surrounding the integrated circuit die, the frame comprising two or more interlocking segments, the interlocking segments comprising electrically conductive material electrically coupled to the substrate; and

a lid over the integrated circuit die and the frame, the lid comprising a conductive material electrically coupled to the substrate.

13. The system of claim 12 , wherein the substrate comprises a ground plane, and wherein the segments are electrically coupled to the ground plane.

14. The system of claim 13 , wherein the segments are electrically coupled to the ground plane by solder joints.

15. The system of claim 12 , wherein the frame comprises one or more embossments along at least one edge of the frame, wherein the lid comprises at least one edge and one or more perforations proximal to the at least one edge, and wherein the one or more perforations are to align with the one or more embossments, such that the movement of the lid relative to the frame is restricted in two orthogonal directions.

16. The system of claim 12 , wherein the lid is solder-bonded to the frame.

17. The system of claim 12 , wherein the lid comprises any of copper, nickel or beryllium.

18. A method comprising:

forming an integrated circuit package substrate;

placing a first shield frame segment over the substrate, wherein the first shield frame segment comprises a first interlocking section and a second interlocking section, wherein the first interlocking comprises one or more protrusions, and the second interlocking section comprises one or more protrusions, and wherein the first interlocking section is to restrict movement of the first shield frame segment in a first direction and the second interlocking section is to restrict movement of the first shield frame segment in a second direction that is unaligned with the first direction;

placing a second shield frame segment over the substrate, wherein the second shield frame segment comprises a third interlocking section, wherein the third interlocking section comprises protrusions, and wherein the third interlocking section is interfaced with the first interlocking section of the first shield frame segment;

placing a third shield frame segment over the substrate, wherein the third shield frame segment comprises a fourth interlocking section, wherein the fourth interlocking section comprises protrusions, and wherein the fourth interlocking section is interfaced with the second interlocking section of the first shield frame segment; and

placing a fourth shield frame segment over the substrate, wherein the fourth shield frame segment is interfaced with the second shield frame segment and the third shield frame segment.

19. The method of claim 18 , wherein placing a second shield frame segment over the substrate, wherein the second shield frame segment comprises a third interlocking section, and wherein the third interlocking section is interfaced with the first interlocking section of the first shield frame segment comprises interdigitating the one or more protrusions of the first interlocking section with the one or more protrusions of the third interlocking section.

20. The method of claim 18 , further comprising:

placing solder on the substrate; and

reflowing the solder to bond the first, second third and fourth shield frame segments to the substrate.