Pane with an electrical connection element

1. A pane with at least one electrical connection element, the pane comprising: a substrate;

on a region of the substrate, an electrically conductive structure; and on a region of the electrically conductive structure, a connection element that comprises,

i) at a distal end of the connection element, a crimping region adapted to be crimped around a connection cable, and

ii) a solder region that is connected to the electrically conductive structure via a leadfree solder material, the solder region arranged away from the crimping region,

wherein the connection element comprises at least 66.5 wt.-% to 89.5 wt.-% iron and 10.5 wt.-% to 20 wt.-% chromium, and wherein the connection element is made as a single piece element with a same thickness in the solder region and the crimped region; wherein the connection element has at least a wetting layer that contains nickel, tin, copper, and/or silver.

2. The pane according to claim 1 , wherein an angle between the solder region and the crimping region is from 120° to 180°.

3. The pane according to claim 1 , comprising two to six connection elements disposed in a line.

4. The pane according to claim 1 , wherein a material thickness of the connection element is from 0.1 mm to 2 mm.

5. The pane according to claim 1 , wherein a difference between a coefficient of thermal expansion of the substrate and a coefficient of thermal expansion of the connection element is less than 5×10 −6 /° C.

6. The pane according to claim 1 , wherein the connection element comprises at least 77 wt.-% to 84 wt.-% iron and 16 wt.-% to 18.5 wt.-% chromium.

7. The pane according to claim 1 , wherein the substrate contains glass.

8. The pane according to claim 1 , wherein the electrically conductive structure contains at least silver and has a layer thickness of 5 μm to 40 μm.

9. The pane according to claim 1 , wherein a layer thickness of the solder material is less than or equal to 6.0×10 −4 m.

10. The pane according to claim 1 , wherein the solder material contains tin and bismuth, indium, zinc, copper, silver, or compositions thereof.

11. The pane according to claim 10 , wherein the solder material contains 35 wt.-% to 69 wt.-% bismuth, 30 wt.-% to 50 wt.-% tin, 1 wt.-% to 10 wt.-% silver, and 0 wt.-% to 5 wt.-% copper.

12. A method for production of a pane with at least one electrical connection element, the method comprising: connecting a connection element to a connection cable by crimping in a crimping region of the connection element that is arranged at a distal end of the connection element; applying a leadfree solder material on a bottom of a solder region of the connection element that is arranged away from the crimping region: disposing the connection element with the leadfree solder material on a region of an electrically conductive structure that is applied on a region of a substrate; and connecting the connection element, with energy input, to the electrically conductive structure, wherein the connection element comprises at least 66.5 wt.-% to 89.5 wt.-% iron and 10.5 wt.-% to 20 wt.-% chromium, and wherein the connection element is made as a single piece element with a same thickness in the solder region and the crimped region; wherein the connection element has at least a wetting layer that contains nickel, tin, copper, and/or silver.

13. A method, comprising:

applying the pane with at least one electrical connection element according to claim 1 , in buildings.

14. A method, comprising:

applying the pane with at least one electrical connection element according to claim 1 , in means of transportation for travel on land, in the air, or on water.

15. The method according to claim 14 , further comprising:

applying the pane as a windshield, rear window, side window, and/or glass roof.

16. The method according to claim 14 , further comprising:

applying the pane as a heatable pane.

17. The method according to claim 14 , further comprising:

applying the pane as a pane with an antenna function.