Socket receiving an electronic component having a plurality of contact pads

1. A socket, comprising:

(a) a housing made of an insulating board and having:

(1) a plurality of passageways arranged over the housing, each of the passageways extending through the housing from a first surface of the housing to an opposite second surface of the housing and having an inner wall surface plated with a conductive material; and

(2) a first conductive pad formed on the first surface of the housing so as to correspond to one of the passageways, the first conductive pad being electrically continuous with the conductive material of the inner wall surface of the passageway and extending from the passageway; and

(b) a plurality of first contacts arranged on the first surface of the housing and each corresponding to one of the plurality of passageways, each of the first contacts includes:

(1) a first contact portion positioned above the first surface of the housing and configured to be elastically deformed by a first contact pad electrically connected with the first contact;

(2) a first insertion portion inserted into one of the passageways and configured to be elastically deformed and pressed by the inner wall surface of the passageway;

(3) a first joint portion joined to the first conductive pad; and

(4) a raised portion extending from the first joint portion in a direction perpendicular to the first joint portion, the raised portion is disposed on a side of the first joint portion opposite the first contact portion.

2. The socket of claim 1 , wherein the raised portion is offset from the first contact portion in a direction extending along a length of the first joint portion.

3. The socket of claim 1 , wherein the first joint portion is surface-mounted and soldered to the first conductive pad.

4. The socket of claim 3 , wherein the first joint portion is soldered to a first soldering region of the first conductive pad spaced apart from the passageway.

5. The socket of claim 4 , wherein a region of the first conductive pad between the first soldering region and the passageway is covered with a solder resist.

6. The socket of claim 1 , wherein the housing has a second conductive pad formed on the second surface of the housing and corresponding with the passageway, the second conductive pad is electrically continuous with the conductive material of the inner wall surface of the passageway and extends from the passageway.

7. The socket of claim 6 , wherein a plurality of second contacts are arranged on the second surface of the housing and each correspond to one of the plurality of passageways.

8. The socket of claim 7 , wherein each of the second contacts includes:

(a) a second contact portion positioned above the second surface of the housing and configured to be elastically deformed by a second contact pad electrically connected with the second contact;

(b) a second insertion portion inserted into one of the passageways and configured to be elastically deformed and pressed by the inner wall surface of the passageway; and

(c) a second joint portion joined to the second conductive pad.

9. The socket of claim 8 , wherein the first contact pad is a contact pad formed on an electrical component and the second contact pad is a contact pad formed on a circuit board.

10. The socket of claim 8 , wherein the second joint portion is surface-mounted and soldered to the second conductive pad.

11. The socket of claim 10 , wherein the second joint portion is soldered to a second soldering region of the second conductive pad spaced apart from the passageway.

12. The socket of claim 11 , wherein a region of the second conductive pad between the second soldering region and the passageway is covered with a solder resist.