Nanosheet transistor with dual inner airgap spacers

1. An apparatus comprising:

a substrate structure having a set of nanosheet layers stacked upon a substrate, the substrate structure including a p-channel region and an n-channel region, the substrate structure further including divots within the p-channel region and the n-channel region;

a first liner formed within the divots of the n-channel region, the first liner being formed of a material having a positive charge;

a second liner formed within the divots of the p-channel region, the second liner being formed of a material having a negative charge;

a p-type epitaxy deposited in the p-channel region to form first air gap spacers of the divots in the p-channel region; and

an n-type epitaxy deposited in the n-channel region to form second air gap spacers of the divots in the n-channel region.

2. The apparatus of claim 1 , further comprising:

an isolation layer disposed upon the substrate, wherein the set of nanosheet layers are stacked upon the isolation layer.

3. The apparatus of claim 1 , further comprising:

a first gate material adjacent to the first air gap spacers of p-channel region; and

a second gate material adjacent to the second air gap spacers of the n-channel region.

4. The apparatus of claim 3 , further comprising:

at least one metal contact in contact with the first gate material.

5. The apparatus of claim 1 , wherein the set of nanosheet layers are formed of silicon (Si) material.