IP Library Granted Patent US 10,254,793
Granted Patent B1
US 10,254,793 · App. 15/951,101 · Granted Apr 9, 2019

Adaptable graphics board form factor with adjacent orientation to a motherboard for use with plural external I/O requirements in information handling systems

Inventors: Arnold Thomas Schnell (Hutto, TX); Ivan Guerra (Round Rock, TX); Gurpreet Sahota (Austin, TX)
Assignee: Dell Products, LP
G06F1/1633G06F1/185G06T1/20
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Quick Facts
Patent No.
US 10,254,793
App. No.
15/951,101
Granted
Apr 9, 2019
Kind
B1
Abstract

A system and method of implementing an adaptable graphics board form factor design comprising an adaptable graphics board including a reconfigurable zone subset of components including a reconfigurable I/O module having display data ports disposed along a first edge of the adaptable graphics board, the adaptable graphics board including a set of core components including the graphics processor and graphics memory, wherein the reconfigurable zone subset of components are orientable relative to the set of core components to interface with an information handling system chassis of a first model specification selected from a plurality of model specifications for information handling systems in which the adaptable graphics board may be used, and the adaptable graphics board including a connector pad interface area for receiving an array of compressible electrical spring contacts of a compression jumper pad for a flexible compression jumper connector, wherein the connector pad interface area is disposed along a second edge of the adaptable graphics board for alignment adjacent to a motherboard to be operatively coupled via the flexible compression jumper connector in the information handling system.

Claims (42)

1. An adaptable graphics board form factor design comprising:

an adaptable graphics board including a reconfigurable zone subset of components including a reconfigurable I/O module having external display data ports disposed along a first edge of the adaptable graphics board;

the adaptable graphics board including a set of core components including a graphics processor and graphics memory;

the reconfigurable zone subset of components orientable relative to the set of core components to interface with an information handling system chassis of a first model specification selected from a plurality of model specifications for information handling systems in which the adaptable graphics board may be used; and

the adaptable graphics board including an array of electrical contacts at a connector pad interface area for receiving an array of compressible electrical spring contacts of a compression jumper pad for a flexible compression jumper connector, wherein the connector pad interface area is disposed along a second edge of the adaptable graphics board for alignment adjacent to a motherboard to be operatively coupled via the flexible compression jumper connector in the information handling system.

2. The adaptable graphics board form factor of claim 1 wherein the external display data ports interface with a side of the chassis of the first model specification of the information handling system.

3. The adaptable graphics board form factor of claim 1 , further comprising:

the reconfigurable zone subset of components re-oriented relative to the set of core components to dispose external display data ports along a third edge of the adaptable graphics board to interface with an information handling system chassis of a second model specification.

4. The adaptable graphics board form factor of claim 1 wherein the set of core components includes the first connector pad area of the graphics board.

5. The adaptable graphics board form factor of claim 1 wherein the set of core components further comprises a graphics processor pin break out, and data routing between the graphics processor and graphics memory.

6. The adaptable graphics board form factor of claim 1 , further comprising:

an I/O connection point between the graphics processor and the reconfigurable I/O module to provide coupling to the reconfigurable I/O module in any orientation without reconfiguration of the set of core components.

7. The adaptable graphics board form factor of claim 1 wherein the set of core components further comprises power planes supplying the graphics processor and graphics memory.

8. An information handling system comprising:

a chassis supporting a motherboard and a graphics board, wherein the motherboard and graphics board are adjacently aligned;

the graphics board including a reconfigurable zone subset of components and a set of core components including a graphics processor and graphics memory, wherein the reconfigurable zone subset of components are configured to interface with the information handling system chassis of a particular model specification;

a flexible compression jumper connector having a first compression jumper pad with a first array of compressible communication contacts operatively coupled to a first connector pad area of the graphics board;

the flexible compression jumper connector having a second compression jumper pad operatively coupled to the motherboard;

a first clamping mechanism to compress the first array of compressible communication contacts to a plurality of electrical contacts at the first connector pad interface area; and

the flexible compression jumper connector having a flexible jumper trace array cable between the first compression jumper pad and the second compression jumper pad adjustable as to relative height between the graphics board and the adjacent motherboard and providing lanes of data communication between a central processor on the motherboard and the graphics processor.

9. The system of claim 8 , further comprising:

a second clamping mechanism to compress the second array of compressible communication contacts of the second compression jumper pad to a plurality of electrical contacts on the motherboard.

10. The system of claim 8 , wherein the first array of compressible communication contacts is an array of electrical spring contacts making electrical contact when compressed to the first connector pad interface area.

11. The system of claim 8 , wherein the reconfigurable zone subset of components includes at least one external display data port customized for interface with the chassis of the particular model specification of the information handling system.

12. The system of claim 8 , wherein the set of core components includes the first connector pad area of the graphics board.

13. The system of claim 8 , wherein the first clamping mechanism includes a compression screw.

14. The system of claim 13 , wherein the compression screw is threaded into a compression screw receiver mounted on or in the graphics board.

15. A method of assembling an information handling system with an adaptable graphics board form factor in comprising:

selecting a first model specification selected from a plurality of model specifications for information handling systems in which an adaptable graphics board may be used;

choosing an orientation for a reconfigurable zone subset of components relative to a set of core components of the adaptable graphics board adapted to the first model specification, wherein the set of core components includes the graphics processor and graphics memory;

providing the adaptable graphics board with the reconfigurable zone subset of components orientation adapted to the first model specification;

supporting the adaptable graphics board adjacent to a motherboard on a chassis, wherein the motherboard and the graphics board have aligned edges;

clamping a first compression jumper pad of a flexible compression jumper connector to compress an array of compressible communication contacts to a first connector pad interface area of the graphics board;

operatively coupling the second compression jumper pad of the flexible compression jumper connector to the motherboard to provide lanes of data communication between the central processor and the graphics processor; and

operatively coupling the reconfigurable zone subset of components to external components of the first model specification of the information handling system.

16. The method of claim 15 , further comprising:

selecting a second model specification selected from a plurality of model specifications for information handling systems in which the adaptable graphics board may be used; and

orienting the reconfigurable zone subset of components relative to a set of core components to a second orientation adapted to interface with the second model specification along a different edge of the adaptable graphics board than the first orientation for the first model specification.

17. The method of claim 15 , wherein the reconfigurable zone subset of components includes an I/O module with an external display data port adapted to interface with an edge of an information handling system chassis of the first model specification include along.

18. The method of claim 15 , wherein choosing an orientation for reconfigurable zone subset of components relative to a set of core components may include selecting from a rotation of the reconfigurable zone subset of components along either a first edge or a second edge of the adaptable graphics board to fit within either the first model specification or a second model specification depending on the orientation selected.

19. The method of claim 15 , wherein choosing an orientation for reconfigurable zone subset of components includes orienting an I/O module relative to a set of core components to interface with chassis mountings for external display data ports aligned with either the first edge or the second edge of the adaptable graphics board depending on orientation for a plurality of model specifications without modification to the set of core components.

20. The method of claim 15 , wherein the wherein the set of core components further comprises a graphics processor pin break out, data routing between the graphics processor and graphics memory, and power planes supplying the graphics processor and graphics memory.

Assignments (10)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (050724/0466) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO WYSE TECHNOLOGY L.L.C.)
Reel/Frame 060753/0486 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (046366/0014) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060450/0306 →
RELEASE OF SECURITY INTEREST AT REEL 046286 FRAME 0653 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 058298/0093 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Oct 15, 2019
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 050724/0466 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Jun 1, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 046366/0014 →
PATENT SECURITY AGREEMENT (CREDIT) Recorded Jun 1, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 046286/0653 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 11, 2018
From: SCHNELL, ARNOLD THOMAS; GUERRA, IVAN; SAHOTA, GURPREET
To: DELL PRODUCTS, LP
Reel/Frame 045511/0849 →
Cited By (1)
US 12,575,071