Circuit board pad resonance control system
A circuit board pad resonance control system includes a board. A signal transmission line is included on the board. A plurality of connector pads are positioned on the board. A first connector pad receives the signal transmission line adjacent a first end of that connector pad. The first connector pad includes a mounting surface that mounts directly to a coupling element that is configured to couple a subsystem to the board, and reduces a resonance that is produced by an open portion of a signal transmission path that is created when the coupling element is directly mounted to the mounting surface of the first connector pad in a first orientation. In a specific example, the mounting surface may include a plurality of protrusions, a plated surface, and/or a mask that reduces the conductivity of the connector pad which reduces signal integrity issues due to resonance.
1. A circuit board pad resonance dampening system, comprising:
a board;
a signal transmission line included on the board; and
a plurality of connector pads that are positioned on the board and that include:
a first connector pad that receives the signal transmission line adjacent a first end of the first connector pad, wherein the first connector pad includes a mounting surface that includes a plurality of protrusions each having a height that provides a variation in the mounting surface between 20 micrometers and 50 micrometers and that is configured to mount directly to a coupling element that is configured to couple a subsystem to the board such that an open portion of a signal transmission path is created when the coupling element is directly mounted to the mounting surface of the first connector pad in a first orientation.
2. The system of claim 1 , wherein the plurality of connector pads include a second connector pad that is located adjacent the first connector pad such that no other connector pads are positioned between the first connector pad and the second connector pad, wherein a first conductivity of the mounting surface being less than a second conductivity of the at least the portion of the first connector pad reduces crosstalk coupling between the first connector pad and the second connector pad when a signal is transmitted to the first connector pad via the signal transmission line.
3. The system of claim 1 , further comprising:
the coupling element mounted to the first connector pad in the first orientation such that a connector lead portion included on the coupling element is positioned adjacent the first end of the first connector pad and a mounting portion of the coupling element extends away from the first end of the first connector pad and mounts to the mounting surface.
4. The system of claim 3 , wherein the mounting surface includes a mask over at least a portion of the first connector pad and the mounting portion.
5. The system of claim 1 , wherein the mounting surface has a first conductivity that is less than a second conductivity of at least a portion of the first connector pad.
6. An Information Handling System (IHS), comprising:
a circuit board;
a processing system mounted to the circuit board;
a memory system mounted to the circuit board and coupled to the processing system through the circuit board;
a signal transmission line included on the circuit board and coupled to the processing system; and
a plurality of connector pads that are positioned on the circuit board and that include:
a first connector pad that receives the signal transmission line adjacent a first end of the first connector pad, wherein the first connector pad includes a mounting surface that includes a plurality of protrusions each having a height that provides a variation in the mounting surface between 20 micrometers and 50 micrometers and that is configured to mount directly to a coupling element that is configured to couple a subsystem to the circuit board such that an open portion of a signal transmission path is created when the coupling element is directly mounted to the mounting surface of the first connector pad in a first orientation.
7. The IHS of claim 6 , wherein the plurality of connector pads include a second connector pad that is located adjacent the first connector pad such that no other connector pads are positioned between the first connector pad and the second connector pad, wherein a first conductivity of the mounting surface being less than a second conductivity of the at least the portion of the first connector pad reduces crosstalk coupling between the first connector pad and the second connector pad when a signal is transmitted to the first connector pad via the signal transmission line.
8. The IHS of claim 6 , further comprising:
the coupling element mounted to the first connector pad in the first orientation such that a connector lead portion included on the coupling element is positioned adjacent the first end of the first connector pad and a mounting portion of the coupling element extends away from the first end of the first connector pad and mounts to the mounting surface.
9. The IHS of claim 8 , wherein the mounting surface includes a mask over at least a portion of the first connector pad and the mounting portion.
10. The IHS of claim 6 , wherein the mounting surface has a first conductivity that is less than a second conductivity of at least a portion of the first connector pad.
11. A method for controlling resonance on a circuit board connector pad, comprising:
providing, on a board, a first connector pad that includes a first end;
routing, on the board, a signal transmission line such that the signal transmission line is received adjacent the first end of the first connector pad; and
forming a plurality of protrusions on a mounting surface on the first connector pad that is configured to mount directly to a coupling element that is configured to couple a subsystem to the board such that an open portion of a signal transmission path is created when the coupling element is directly mounted to the mounting surface of the first connector pad in a first orientation, wherein each of the plurality of protrusions has a height that provides a variation in the mounting surface between 20 micrometers and 50 micrometers.
12. The method of claim 11 , further comprising: forming a plated mounting surface on the mounting surface, wherein the plated mounting surface includes a conductivity that is less than a conductivity of the first connector pad.
13. The method of claim 11 , further comprising:
coupling the coupling element to the first connector pad in the first orientation such that a connector lead portion included on the coupling element is positioned adjacent the first end of the first connector pad and a mounting portion of the coupling element extends away from the first end of the first connector pad and mounts to the mounting surface.
14. The method of claim 13 , further comprising:
forming a mask over at least a portion of the first connector pad and the mounting portion.
15. The method of claim 11 , wherein the mounting surface has a first conductivity that is less than a second conductivity of at least a portion of the first connector pad.