Flexible semiconductor package and method for fabricating the same

1. A semiconductor package attached to a curved display panel, comprising:

a semiconductor chip, having a top surface and a side surface, disposed on a curved flexible film, wherein the curved flexible film is disposed on the curved display panel;

a flexible cover layer attached to the top surface and the side surface of the semiconductor chip; and

an underfill material formed between the semiconductor chip and the curved flexible film, and overlapping a solder resist,

wherein the flexible cover layer is in direct contact with the underfill material, the solder resist, and the top and side surfaces of the semiconductor chip, and

wherein the top surface of the semiconductor chip on the curved flexible film remains flat.

2. The semiconductor package of claim 1 , wherein the flexible cover layer is formed to cover the top surface and the side surface of the semiconductor chip.

3. The semiconductor package of claim 1 , wherein the semiconductor chip has a thickness of 50 to 250 μm.

4. The semiconductor package of claim 1 , wherein the flexible cover layer has a thickness of 0.1 to 0.8 mm.

5. The semiconductor package of claim 1 , wherein the flexible cover layer comprises a mixture of a non-conductive silicon-based material and a conductive filler material.

6. The semiconductor package of claim 5 , wherein the flexible cover layer further comprises resin material.

7. The semiconductor package of claim 5 , wherein a percentage of the non-conductive silicon-based material in the flexible cover layer is greater than a percentage of the conductive filler material in the flexible cover layer.

8. The semiconductor package of claim 5 , wherein the filler material is any one or any combination of any two or more of alumina, aluminum nitride, boron nitride, carbon nitride, graphene, and diamond.

9. The semiconductor package of claim 1 , further comprising metal wires formed on the flexible film comprising terminals configured to accept the semiconductor chip.

10. The semiconductor package of claim 9 , further comprising bumps formed on the metal wires, wherein the bumps connect the metal wires to the semiconductor chip.

11. The semiconductor package of claim 9 , wherein the solder resist is formed on the metal wires to cover a complete area, except for the terminals, of the metal wires.

12. The semiconductor package of claim 1 , wherein the semiconductor chip comprises a source driver IC or a gate driver IC.

13. The semiconductor package of claim 1 , wherein the underfill material has a higher viscosity than the flexible cover layer.

14. The semiconductor package of claim 1 , wherein the underfill material comprises non-conductive silicon-based materials and conductive filler materials.

15. The semiconductor package of claim 1 , wherein the flexible cover layer has a shape of a tape.

16. The semiconductor package of claim 1 , wherein the underfill material and the flexible cover layer comprise a same material.

17. A semiconductor package attached to a curved display panel having front, rear and side surfaces, comprising:

a semiconductor chip having a top surface, a side surface and a bottom surface disposed on a curved flexible film, wherein the curved flexible film is disposed on the curved display panel;

an underfill material formed between the semiconductor chip and the curved flexible film and overlapping a solder resist; and

a flexible cover layer formed on the top surface and the side surface of the semiconductor chip and being in direct contact with the underfill material, the solder resist, the top surface and the side surface of the semiconductor chip,

wherein the semiconductor chip on the curved flexible film is attached to the side surface of the curved display panel, and

wherein the bottom surface of the semiconductor chip on the curved flexible film is curved.

18. The semiconductor package of claim 17 , wherein the underfill material and the flexible cover layer comprise a same material.

19. The semiconductor package of claim 17 , wherein the underfill material and the flexible cover layer comprise non-conductive silicon-based materials and conductive filler materials, and

wherein a percentage of the non-conductive silicon-based materials is greater than a percentage of the conductive filler materials.

20. The semiconductor package of claim 1 , wherein the flexible cover layer is in direct contact with the semiconductor chip.

21. The semiconductor package of claim 17 , wherein a central portion of the flexible cover layer disposed on the semiconductor chip is thicker than an edge portion of the flexible cover layer.

22. The semiconductor package of claim 17 , wherein the flexible cover layer has a thickness in a range of 0.1 to 0.8 mm.

23. A semiconductor package attached to a curved display panel, comprising:

a semiconductor chip attached to a curved flexible film to be disposed on the curved display panel;

a flexible tape attached to an upper surface of the semiconductor chip; and

an underfill material overlapping a solder resist and formed between a lower surface of the semiconductor chip and the curved flexible film,

wherein the flexible tape comprises either one or both of heat conductive filler and a curable material.

24. The semiconductor package of claim 23 , wherein the flexible tape is made of a non-conductive silicon-based material.

25. The semiconductor package of claim 23 , wherein the flexible tape has a thickness in a range of 10 to 50 μm.

26. The semiconductor package of claim 23 , further comprising a flexible cover layer having a thickness larger than that of the flexible tape.

27. The semiconductor package of claim 23 , wherein both edges of the flexible tape attached to the upper surface of the semiconductor chip coincide with both edges of the semiconductor chip.