Integrated silicon controlled rectifier (SCR) and a low leakage SCR supply clamp for electrostatic discharge (ESP) protection

1. An electrostatic discharge (ESD) protection circuit, comprising:

a first power supply line;

a second power supply line;

a functional circuit electrically coupled for power supply to the first and second power supply lines;

an input/output pad coupled to the functional circuit;

a first protection diode connected between the input/output pad and the first power supply line;

a second protection diode connected between the input/output pad and the second power supply line;

a trigger circuit configured to generate, in response to detection of an ESD event at one or more of the first and second power supply lines, at least one trigger signal; and

a silicon controlled rectifier (SCR) having an anode terminal connected to the first power supply line and a cathode terminal connected to the second power supply line;

wherein the SCR further includes an embedded field effect transistor (FET) having an insulated gate which forms a control gate terminal coupled to receive said at least one trigger signal.

2. The ESD protection circuit of claim 1 , wherein a conduction terminal of the embedded FET forms the cathode terminal of the SCR.

3. The circuit of claim 1 , wherein the trigger circuit comprises:

a resistive-capacitive ESD detection circuit configured to generate an ESD detection signal;

a first inverter circuit having an input coupled to receive the ESD detection signal and an output configured to generate a first trigger signal; and

a second inverter circuit having an input coupled to the output of the first inverter circuit and an output configured to generate a second trigger signal;

wherein the first trigger signal is applied to the insulated gate of the embedded FET at the control gate terminal of the SCR.

4. The circuit of claim 3 ,

wherein the SCR is formed in a semiconductor substrate of a first conductivity type and includes a first region within the semiconductor substrate of the first conductivity type and having a higher doping level than the semiconductor substrate, and

wherein the second trigger signal is applied to the first region.

5. The circuit of claim 4 , wherein the semiconductor substrate further includes a second region of a second conductivity type opposite the first conductivity type, said second region forming a conduction terminal of the embedded FET.

6. The circuit of claim 5 , wherein the second region further forms the cathode terminal of the SCR.

7. The circuit of claim 1 , wherein the trigger circuit comprises:

a resistive-capacitive ESD detection circuit configured to generate an ESD detection signal;

an inverter circuit having an input coupled to receive the ESD detection signal and an output configured to generate the trigger signal.

8. The circuit of claim 1 , wherein the SCR is formed in a semiconductor substrate of a first conductivity type and includes a well of a second conductivity type opposite the first conductivity type, said well including a first region of the first conductivity type and having a higher doping level than the semiconductor substrate, said first region forming the anode terminal of the SCR.

9. The circuit of claim 8 , wherein the well further includes a second region of the second conductivity type having higher doping level than the well, and wherein the second region is a floating region.

10. The circuit of claim 1 , wherein the at least one trigger signal comprises a first trigger signal and a second trigger signal, and wherein the SCR is formed in a semiconductor substrate of a first conductivity type and includes a first region within the semiconductor substrate of the first conductivity type and having a higher doping level than the semiconductor substrate, and

wherein the first trigger signal is applied to the insulated gate of the embedded FET at the control gate terminal of the SCR and the second trigger signal is applied to the first region.

11. The circuit of claim 10 , wherein the first and second trigger signals are logical inversions.

12. The circuit of claim 10 , wherein the semiconductor substrate further includes a second region of a second conductivity type opposite the first conductivity type, said second region forming a conduction terminal of the embedded FET.

13. The circuit of claim 12 , wherein the second region further forms the cathode terminal of the SCR.

14. An electrostatic discharge (ESD) protection circuit, comprising:

a first power supply line;

a second power supply line;

a functional circuit electrically coupled for power supply to the first and second power supply lines;

an input/output pad coupled to the functional circuit;

a first protection diode connected between the input/output pad and the first power supply line;

a second protection diode connected between the input/output pad and the second power supply line;

a trigger circuit configured to generate, in response to detection of an ESD event at one or more of the first and second power supply lines, at least one trigger signal; and

a silicon controlled rectifier (SCR) having an anode terminal connected to the first power supply line and a cathode terminal connected to the second power supply line;

wherein the SCR further includes an embedded variable substrate resistor having an insulated gate which forms a control gate terminal coupled to receive said at least one trigger signal.

15. The ESD protection circuit of claim 14 , wherein a conduction terminal of the variable substrate resistor forms the cathode terminal of the SCR.

16. The circuit of claim 14 , wherein the trigger circuit comprises:

a resistive-capacitive ESD detection circuit configured to generate an ESD detection signal;

a first inverter circuit having an input coupled to receive the ESD detection signal and an output configured to generate a first trigger signal; and

a second inverter circuit having an input coupled to the output of the first inverter circuit and an output configured to generate a second trigger signal;

wherein the first trigger signal is applied to the insulated gate of the embedded variable substrate resistor at the control gate terminal of the SCR.

17. The circuit of claim 16 ,

wherein the SCR is formed in a semiconductor substrate of a first conductivity type and includes a first region within the semiconductor substrate of the first conductivity type and having a higher doping level than the semiconductor substrate, and

wherein the second trigger signal is applied to the first region.

18. The circuit of claim 17 , wherein the semiconductor substrate further includes a second region of a second conductivity type opposite the first conductivity type, said second region forming a conduction terminal of the variable substrate resistor.

19. The circuit of claim 18 , wherein the second region further forms the cathode terminal of the SCR.

20. The circuit of claim 14 , wherein the trigger circuit comprises:

a resistive-capacitive ESD detection circuit configured to generate an ESD detection signal;

an inverter circuit having an input coupled to receive the ESD detection signal and an output configured to generate the trigger signal.

21. The circuit of claim 14 , wherein the SCR is formed in a semiconductor substrate of a first conductivity type and includes a well of a second conductivity type opposite the first conductivity type, said well including a first region of the first conductivity type and having a higher doping level than the semiconductor substrate, said first region forming the anode terminal of the SCR.

22. The circuit of claim 21 , wherein the well further includes a second region of the second conductivity type having higher doping level than the well, and wherein the second region is a floating region.

23. The circuit of claim 14 , wherein the at least one trigger signal comprises a first trigger signal and a second trigger signal, and wherein the SCR is formed in a semiconductor substrate of a first conductivity type and includes a first region within the semiconductor substrate of the first conductivity type and having a higher doping level than the semiconductor substrate, and

wherein the first trigger signal is applied to the insulated gate of the variable substrate resistor at the control gate terminal of the SCR and the second trigger signal is applied to the first region.

24. The circuit of claim 23 , wherein the first and second trigger signals are logical inversions.

25. The circuit of claim 23 , wherein the semiconductor substrate further includes a second region of a second conductivity type opposite the first conductivity type, said second region forming a conduction terminal of the variable substrate resistor.

26. The circuit of claim 25 , wherein the second region further forms the cathode terminal of the SCR.

27. An integrated circuit silicon controlled rectifier (SCR), comprising:

a semiconductor substrate of a first conductivity type;

an embedded field effect transistor (FET) having an insulated gate which forms a control gate terminal;

a well of a second conductivity type opposite the first conductivity type within the semiconductor substrate;

a first region of the first conductivity type located within the well and having a higher doping level than the semiconductor substrate, said first well forming an anode terminal of the SCR;

a second region of the second conductivity type located within the semiconductor substrate, said second region forming a cathode terminal of the SCR and a first conduction terminal of the embedded FET; and

a third region of the second conductivity type located within the semiconductor substrate, said third region forming a second conduction terminal of the embedded FET.

28. An integrated circuit silicon controlled rectifier SCR comprising:

a semiconductor substrate of a first conductivity type;

an embedded variable substrate resistor having an insulated gate which forms a control gate terminal;

a well of a second conductivity type opposite the first conductivity type within the semiconductor substrate;

a first region of the first conductivity type located within the well and having a higher doping level than the semiconductor substrate, said first well forming an anode terminal of the SCR;

a second region of the second conductivity type located within the semiconductor substrate, said second region forming a cathode terminal of the SCR and a first conduction terminal of the embedded variable substrate resistor; and

a third region of the first conductivity type located within the semiconductor substrate and having a higher doping level than the semiconductor substrate, said third region forming a second conduction terminal of the embedded variable substrate resistor.

29. An electrostatic discharge (ESD) protection circuit, comprising:

a first power supply line;

a second power supply line;

a trigger circuit configured to detect an ESD event at one or more of the first and second power supply lines comprising:

a resistive-capacitive ESD detection circuit configured to generate an ESD detection signal in response to said ESD event;

a first inverter circuit having an input coupled to receive the ESD detection signal and an output configured to generate a trigger signal; and

a silicon controlled rectifier (SCR) having an anode terminal connected to the first power supply line and a cathode terminal connected to the second power supply line;

wherein the SCR further includes an embedded field effect transistor (FET) having an insulated gate which forms a control gate terminal coupled to receive said trigger signal.

30. The ESD protection circuit of claim 29 , wherein a conduction terminal of the embedded FET forms the cathode terminal of the SCR.

31. The circuit of claim 29 , wherein the trigger circuit further comprises:

a second inverter circuit having an input coupled to the output of the first inverter circuit and an output configured to generate a second trigger signal;

wherein the SCR is formed in a semiconductor substrate of a first conductivity type and includes a first region within the semiconductor substrate of the first conductivity type and having a higher doping level than the semiconductor substrate; and

wherein the second trigger signal is applied to the first region.

32. The circuit of claim 31 , wherein the semiconductor substrate further includes a second region of a second conductivity type opposite the first conductivity type, said second region forming a conduction terminal of the embedded FET.

33. The circuit of claim 32 , wherein the second region further forms the cathode terminal of the SCR.

34. The circuit of claim 29 , wherein the SCR is formed in a semiconductor substrate of a first conductivity type and includes a well of a second conductivity type opposite the first conductivity type, said well including a first region of the first conductivity type and having a higher doping level than the semiconductor substrate, said first region forming the anode terminal of the SCR.

35. The circuit of claim 34 , wherein the well further includes a second region of the second conductivity type having higher doping level than the well, and wherein the second region is a floating region.

36. The circuit of claim 34 , wherein the semiconductor substrate further includes a second region of a second conductivity type opposite the first conductivity type, said second region forming a conduction terminal of the embedded FET.

37. The circuit of claim 36 , wherein the second region further forms the cathode terminal of the SCR.

38. An electrostatic discharge (ESD) protection circuit, comprising:

a first power supply line;

a second power supply line;

a trigger circuit configured to detect an ESD event at one or more of the first and second power supply lines comprising:

a resistive-capacitive ESD detection circuit configured to generate an ESD detection signal in response to said ESD event;

a first inverter circuit having an input coupled to receive the ESD detection signal and an output configured to generate a trigger signal; and

a silicon controlled rectifier (SCR) having an anode terminal connected to the first power supply line and a cathode terminal connected to the second power supply line;

wherein the SCR further includes an embedded variable substrate resistor having an insulated gate which forms a control gate terminal coupled to receive said trigger signal.

39. The ESD protection circuit of claim 38 , wherein a conduction terminal of the embedded variable substrate resistor forms the cathode terminal of the SCR.

40. The circuit of claim 38 , wherein the trigger circuit further comprises:

a second inverter circuit having an input coupled to the output of the first inverter circuit and an output configured to generate a second trigger signal;

wherein the SCR is formed in a semiconductor substrate of a first conductivity type and includes a first region within the semiconductor substrate of the first conductivity type and having a higher doping level than the semiconductor substrate; and

wherein the second trigger signal is applied to the first region.

41. The circuit of claim 40 , wherein the semiconductor substrate further includes a second region of a second conductivity type opposite the first conductivity type, said second region forming a conduction terminal of the embedded variable substrate resistor.

42. The circuit of claim 41 , wherein the second region further forms the cathode terminal of the SCR.

43. The circuit of claim 38 , wherein the SCR is formed in a semiconductor substrate of a first conductivity type and includes a well of a second conductivity type opposite the first conductivity type, said well including a first region of the first conductivity type and having a higher doping level than the semiconductor substrate, said first region forming the anode terminal of the SCR.

44. The circuit of claim 43 , wherein the well further includes a second region of the second conductivity type having higher doping level than the well, and wherein the second region is a floating region.

45. The circuit of claim 43 , wherein the semiconductor substrate further includes a second region of a second conductivity type opposite the first conductivity type, said second region forming a conduction terminal of the embedded variable substrate resistor.

46. The circuit of claim 45 , wherein the second region further forms the cathode terminal of the SCR.