IP Library Granted Patent US 11,079,253
Granted Patent B2
US 11,079,253 · App. 15/953,977 · Granted Aug 3, 2021

Wiegand module and methods of forming the same

Inventors: Choon Aun Chong (Bayan Lepas, MY); Weng Fei Wong (Bayan Lepas, MY); Yik Foong Soo (Bayan Lepas, MY)
Assignee: Avago Technologies International Sales Pte. Limited
G01D5/14H01F27/24H01F27/28H01F27/40H05K1/111H05K1/181H05K2201/10151
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,079,253
App. No.
15/953,977
Granted
Aug 3, 2021
Kind
B2
Abstract

A package comprises a body having a mounting surface so as to be mounted to an external surface, and a coil having at least 100 turns around a coil axis. A first end of the coil is oriented in a first direction substantially parallel to the mounting surface such that the first end is attachable to the external surface. The package includes a ferromagnetic element that extends along the coil axis such that the ferromagnetic element is magnetically coupled to the coil. The body is configured to house the coil and the ferromagnetic element.

Claims (39)

1. A package comprising:

a body having a mounting surface so as to be mounted to an external surface;

at least one connection structure on the mounting surface that is configured to secure the body to the external surface, wherein the connection structure secures the body to the external surface using a particular connection;

a coil having a plurality of turns around a coil axis;

a first end of the coil being oriented in a first direction substantially parallel to the mounting surface such that the first end is attachable to the external surface, wherein the first end of the coil comprises a strengthening portion configured to be directly attached to the external surface; and

a ferromagnetic element that extends along the coil axis such that the ferromagnetic element is magnetically coupled to the coil,

wherein the body is configured to house the coil and the ferromagnetic element and the body is configured to support the coil such that the coil axis is substantially parallel to, and distanced away from, the external surface.

2. The package of claim 1 , wherein the coil further comprises a second end, the second end of the coil being oriented in the first direction such that the second end is attachable to the external surface.

3. The package of claim 1 , wherein the ferromagnetic element comprises a Wiegand wire.

4. The package of claim 1 , wherein the plurality of turns comprises at least 100 turns.

5. The package of claim 1 , wherein the coil comprises a conductive wire which loops around the coil axis, and wherein the strengthening portion comprises a folded portion of the conductive wire.

6. The package of claim 5 , wherein the strengthening portion comprises a plurality of winding portions of the conductive wire, and wherein the plurality of winding portions extend longitudinally in the first direction.

7. The package of claim 5 , wherein the strengthening portion comprises a portion of the conductive wire that is folded more than one time to strengthen the first end of the coil.

8. The package of claim 1 , wherein the mounting surface of the body comprises a substantially flat portion so as to engage the external surface, and wherein the body comprises at least one opening allowing the first end of the coil to pass through when the mounting surface of the body is engaging the external surface.

9. The package of claim 1 , wherein the mounting surface of the body comprises a trench that is configured to allow a portion of the coil to pass through.

10. The package of claim 1 , wherein the coil comprises a copper coil.

11. The package of claim 1 , wherein the at least one connection structure extends in a second direction orthogonal to the first direction.

12. The package of claim 11 , wherein the at least one connection structure extends into the mounting surface for engaging a mating structure protruding from the external surface.

13. The package of claim 11 , wherein the at least one connection structure extends outwardly from the mounting surface for engaging a receiving structure disposed on the external surface.

14. A sensing device comprising:

a body having a mounting surface so as to be mounted to a substrate having at least a first contact pad and a second contact pad;

at least one connection structure on the mounting surface that secures the body to the substrate, wherein the connection structure secures the body to the substrate using a particular connection;

a coil having a center looping portion and an end portion, wherein the center looping portion turns around a coil axis that is substantially parallel to the substrate, and wherein the end portion is oriented in a first direction substantially parallel to the substrate;

a ferromagnetic element that extends along the coil axis such that the ferromagnetic element is magnetically coupled to the coil; and

a housing on the substrate and supporting the coil such that the coil axis is substantially parallel to but distanced away from the substrate, wherein the coil comprises a center conductive portion, wherein the end portion of the coil comprises a first end and a second end, and wherein the center conductive portion of the coil at the first end comprises a first strengthening portion to be directly attached to the first contact pad and the second end comprises a second strengthening portion to be directly attached to the second contact pad to establish a first electrical connection between the first end and the first contact pad and a second electrical connection between the second end and the second contact pad.

15. The sensing device of claim 14 , further comprising:

a semiconductor die electrically coupled to the coil, the semiconductor die being configured to process an electrical signal generated from the coil when an external magnetic field is applied to at least one of the coil and the ferromagnetic element, wherein the semiconductor die comprises at least one of a counter, a Hall sensor, a non-volatile memory, a microprocessor, a current detector, and a pulse detector.

16. The sensing device of claim 14 , wherein the center looping portion turns around the coil axis at least 100 times per millimeter such that when an external magnetic field is applied thereto, an electrical current is generated.

17. The sensing device of claim 14 , wherein the coil comprises an insulation portion covering the center conductive portion such that the coil is electrically insulated but exposed at the first end and the second end so as to establish the first and second electrical connections with the first contact pad and the second contact pad.

18. The sensing device of claim 14 , wherein the center conductive portion of the coil at the first end is folded more than one time on the first contact pad so as to enhance electrical connection between the first end of the coil and the first contact pad.

19. The sensing device of claim 14 , wherein the center conductive portion of the coil at the first end comprises a winding portion disposed on the first contact pad so as to enhance electrical connection between the first end of the coil and the first contact pad.

20. A package comprising:

a body having a mounting surface so as to be mounted to an external surface;

at least one connection structure on the mounting surface that is configured to secure the body to the external surface, wherein the connection structure secures the body to the external surface using a particular connection;

a coil having a plurality of turns around a coil axis,

a first end of the coil being oriented in a first direction substantially parallel to the mounting surface such that the first end is attachable to the external surface, wherein the first end of the coil comprises a strengthening portion configured to be directly attached to the external surface;

at least one recess in the mounting surface that allows for the first end of the coil to exit the body for connection of the first end to the external surface; and

a ferromagnetic element that extends along the coil axis such that the ferromagnetic element is magnetically coupled to the coil,

wherein the body is configured to house the coil and the ferromagnetic element and the body is configured to support the coil such that the coil axis is substantially parallel to, and distanced away from, the external surface.

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE OF THE MERGER AND APPLICATION NOS. 13/237,550 AND 16/103,107 FROM THE MERGER PREVIOUSLY RECORDED ON REEL 047231 FRAME 0369. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 8, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048549/0113 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047231/0369 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2018
From: CHONG, CHOON AUN; WONG, WENG FEI; SOO, YIK FOONG
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 045553/0192 →
Continuity (1)
Related Publication 20190316934A1 · Oct 17, 2019