IP Library Granted Patent US 10,672,430
Granted Patent B2
US 10,672,430 · App. 15/954,748 · Granted Jun 2, 2020

Chassis and heat sink for use in chassis

Inventors: Haifang Zhai (Shanghai, CN); Yujie Zhou (Shanghai, CN); Qingqiang Guo (Shanghai, CN); Hendry Xiaoping Wu (Shanghai, CN); David Dong (Shanghai, CN); Michael Hao Zhou (Shanghai, CN)
Assignee: EMC IP Holding Company LLC
G11B33/142G06F1/20G11B33/02G11B33/125G11B33/128G11B33/1406H05K7/20736G11B25/04
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Quick Facts
Patent No.
US 10,672,430
App. No.
15/954,748
Granted
Jun 2, 2020
Kind
B2
Abstract

The present disclosure relates to a chassis and a heat sink for use in the chassis. Disks in rows are arranged in the chassis, and the heat sink comprises an air ingress channel extending from a first end of a housing of the chassis to a side portion of the disks away from the first end; an air egress channel extending from the first end to a second end opposite to the first end, the air egress channel being spaced apart from the air ingress channel by the disks; an intermediate channel comprised of gaps between the disks and fluidically communicating the air ingress channel with the air egress channel; and a fan disposed in the air egress channel and being operable to form a negative pressure in the air egress channel.

Claims (35)

1. A heat sink for use in a chassis, disks being arranged in rows in the chassis, the heat sink comprising:

an air ingress channel extending from a first end of a housing of the chassis to a side portion of the disks away from the first end;

an air egress channel extending from the first end to a second end that is opposite to the first end, the air egress channel being spaced apart from the air ingress channel by the disks;

an intermediate channel comprising gaps between the disks and in fluid communication with the air ingress channel and the air egress channel; a fan disposed within the air egress channel and being operable to form a negative pressure in the air egress channel; and

vertical partitions disposed within the housing, the disks being arranged in the rows in the chassis, the disks being further arranged as abutting against the vertical partitions;

wherein the air ingress channel comprises a plurality of air flow outlets arranged as being corresponding to the gaps between the disks;

wherein the air egress channel comprises a plurality of air flow inlets arranged as being corresponding to the gaps between the disks; and

wherein areas of each of the air flow outlets and each of the air flow inlets gradually reduce from the first end towards the second end.

2. The heat sink of claim 1 , wherein the air ingress channel comprises an air inlet located at the first end;

wherein the air egress channel further comprises an air outlet located at the second end; and

wherein the fan is disposed adjacent to the air outlet.

3. The heat sink of claim 1 , wherein the side portion of the disks away from the first end provides a furthest one of the rows of the disks within the chassis;

wherein an area of a section of the air ingress channel parallel to the first end gradually reduces from the first end towards the side portion of the disks; and

wherein an area of a section of the air egress channel parallel to the first end gradually increases from the side portion of the disks towards the second end.

4. The heat sink of claim 1 , wherein the vertical partitions are arranged parallel to the first end.

5. The heat sink of claim 4 , wherein an air inlet is arranged adjacent to a top cover of the housing, and an air outlet is arranged adjacent to a bottom of the housing.

6. The heat sink of claim 5 , wherein the air ingress channel is arranged between the top cover and the disks, and the air egress channel is located between the bottom of the housing and the disks.

7. The heat sink of claim 1 , wherein the vertical partitions are disposed perpendicular to the first end and comprise through holes disposed in the vertical partitions as being corresponding to the gaps of the disks.

8. The heat sink of claim 7 , wherein an air inlet is arranged adjacent to a first sidewall of the housing, and an air outlet is arranged adjacent to a second sidewall of the housing, the first sidewall being opposite to the second sidewall.

9. The heat sink of claim 8 , wherein the air ingress channel is arranged between the first sidewall and the disks, and the air egress channel is arranged between the second sidewall and the disks.

10. The heat sink of claim 1 , wherein the vertical partitions are disposed oblique to the first end and comprise through holes disposed on the vertical partitions as being corresponding to the gaps of the disks.

11. The heat sink of claim 10 , wherein the vertical partitions comprise at least two vertical partitions, and the at least two vertical partitions are arranged symmetrically with respect to a plane that is parallel to a first sidewall of the housing and the plane passes through a center of the first end.

12. The heat sink of claim 11 , wherein the air inlet is arranged in a middle of the first end, and the air outlet is arranged adjacent to a bottom of the housing or a top cover of the housing.

13. The heat sink of claim 11 , wherein the air egress channel comprises two air egress channels, the air ingress channel is arranged between the disks that are symmetrical with and adjacent to one another, and the two air egress channels are arranged between the first sidewall of the housing and the disks and between a second sidewall and the disks, respectively.

14. A chassis, comprising:

a housing for receiving disks arranged in rows; and

a heat sink comprising:

an air ingress channel extending from a first end of the housing of the chassis to a side portion of the disks away from the first end;

an air egress channel extending from the first end to a second end that is opposite to the first end, the air egress channel being spaced apart from the air ingress channel by the disks;

an intermediate channel comprising gaps between the disks and in fluid communication with the air ingress channel and the air egress channel;

a fan disposed within the air egress channel and being operable to form a negative pressure in the air egress channel; and

vertical partitions disposed within the housing, the disks being arranged in the rows in the chassis, the disks being further arranged as abutting against the vertical partitions;

wherein the air ingress channel of the heatsink comprises a plurality of air flow outlets arranged as being corresponding to the gaps between the disks;

wherein the air egress channel of the heatsink comprises a plurality of air flow inlets arranged as being corresponding to the gaps between the disks; and

wherein areas of each of the air flow outlets and each of the air flow inlets gradually reduce from the first end towards the second end.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (046366/0014) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 060450/0306 →
RELEASE OF SECURITY INTEREST AT REEL 046286 FRAME 0653 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
Reel/Frame 058298/0093 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY AGREEMENT (CREDIT) Recorded Jun 1, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 046286/0653 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Jun 1, 2018
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 046366/0014 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 20, 2018
From: ZHAI, HAIFANG; ZHOU, YUJIE; GUO, QINGQIANG; WU, HENDRY XIAOPING; DONG, DAVID; ZHOU, MICHAEL HAO
To: EMC IP HOLDING COMPANY LLC
Reel/Frame 045597/0177 →
Priority Claims (1)
CN 2017 1 0250598 · Apr 17, 2017 · national
Continuity (1)
Related Publication 20180299932A1 · Oct 18, 2018