Metal contactless smart card and method for fabricating the same
View Patent ↗A metal contactless smart card includes a first metal layer having a first slit, a second layer, a radio-frequency integrated circuit chip module, and an inlay having an antenna. A nonconductive insert may be fitted in the slit. The first metal layer may include an inlay recess where the inlay may be received and a through-hole where the chip may be inserted. The second layer of the smart card may be made of metal and may also include a slit.
1. A method for fabricating a smart card having a first metal layer ( 10 or 10 ′) with a first slit ( 15 or 15 ′), a RFIC chip module ( 20 ), an inlay ( 40 ) having an antenna, and a second layer ( 60 or 80 ) comprising the steps of:
forming a RFIC chip module through-hole ( 12 ) and an inlay recess ( 11 ) on the first metal layer ( 10 );
plugging the first slit ( 15 or 15 ′) formed in the first layer ( 10 ) with a nonconductive material;
layering the inlay ( 40 ) on the second layer ( 60 or 80 );
layering a dummy chip module ( 20 ′) on the inlay ( 40 ) such that the dummy chip module is positioned in the through-hole;
subsequent to the steps of layering the inlay on the second layer and layering the dummy chip module on the inlay, bonding the first layer ( 10 or 10 ′) and the second layer ( 60 or 80 ); and
after bonding the first layer ( 10 ) and the second layer ( 60 ), removing the dummy chip module ( 20 ′) and installing the RFIC chip module ( 20 ).
2. The method of claim 1 , wherein the first layer ( 10 or 10 ′) and the second layer ( 60 or 80 ) are bonded by heat-pressing.
3. The method of claim 1 , wherein the recess ( 11 ) surrounds the through-hole ( 12 ).
4. The method of claim 1 , wherein the first slit ( 15 ) is at least 0.1 mm in width.
5. The method of claim 1 , wherein the cross-sectional profile of the first slit ( 15 ′) is wider on the lower side of the first metal layer ( 10 ′) than an upper side of the first metal layer ( 10 ).
6. The method of claim 1 , wherein the second layer ( 60 ) is made of a synthetic resin.
7. The method of claim 1 , wherein the inlay ( 40 ) comprises a substrate, the antenna having a first wound coil ( 42 ) and a second wound coil ( 42 ′), and two inlay terminals ( 41 and 41 ′),
wherein the inlay terminals ( 41 and 41 ′) are formed to pass through the substrate of the inlay ( 40 ) as to be exposed on both sides of the inlay ( 40 ),
wherein the inlay terminals ( 41 and 41 ′) are formed at the ends of the first wound coil ( 42 ) and the second wound coil ( 42 ′),
wherein the first wound coil ( 42 ) is formed on a surface of the substrate of the inlay ( 40 ) and the second coil ( 42 ′) is formed on an opposite surface of the substrate of the inlay ( 40 ),
wherein the two coils ( 42 and 42 ′) are connected by a via hole ( 43 ) formed through the substrate of the inlay ( 40 ),
wherein the inlay terminals ( 41 and 41 ′) are electrically connected to two RFIC chip module terminals ( 14 and 14 ′),
wherein one of the two coils ( 42 and 42 ′) further comprises a wide portion ( 42 a ) and the other of the two coils ( 42 and 42 ′) further comprises a plurality of islands ( 44 and 44 ′), wherein the overall capacitance of the inlay may be adjusted by electrically insulating a number of islands ( 44 ′) and facilitate impedance matching.
8. The method of claim 1 , wherein the second layer ( 80 ) is metallic and comprises a second slit ( 85 ),
wherein the second slit ( 85 ) is disposed from an interior portion of the second layer ( 80 ) to an edge of the second layer ( 80 ),
wherein the second slit ( 85 ) is disposed to be substantially aligned in a lengthwise direction with the first slit ( 15 ) and shifted in a widthwise direction with respect to the first slit ( 15 ) by less than the width of the first slit ( 15 ) and an insert having a shape corresponding to the stacked slits is snugly fit in the slits.
9. A method for fabricating a smart card having a first metal layer ( 10 or 10 ′) with a slit ( 15 and 15 ′), an RFIC chip module ( 20 ), an inlay ( 40 ) having an antenna, and a second layer ( 60 or 80 ) comprising the steps of:
forming a RFIC chip module through-hole ( 12 ) and an inlay recess ( 11 ) on the first metal layer ( 10 or 10 ′);
positioning the inlay ( 40 ) on the inlay recess ( 11 ), an insert ( 90 ) in the first slit ( 15 or 15 ′) of the first metal layer ( 10 or 10 ′), and a dummy chip ( 20 ′) in the through-hole ( 12 );
subsequent to the step of position the inlay, the insert, and the dummy chip, bonding the first metal layer ( 10 or 10 ′) on a second layer ( 60 or 80 ) by heat-pressing; and
removing the dummy chip module ( 20 ′) and installing a RFIC chip module ( 20 ).
10. The method claim 9 , wherein the insert ( 90 ) has a shape corresponding to the slit ( 15 or 15 ′), wherein the insert ( 90 ) is made of a nonconductive material.
11. The method claim 10 , wherein the insert ( 90 ′) comprises a rod-shaped body ( 90 a ) with a left wing and a right wing ( 90 b ),
wherein the left wing and right wing ( 90 b ) are formed on opposite sides of the rod-shaped body ( 90 a ),
wherein the left wing and right wing ( 90 b ) are smaller than the rod-shaped body ( 90 a ).
12. A method for fabricating a smart card having a first metal layer ( 10 or 10 ′) with a first slit ( 15 or 15 ′), a RFIC chip module ( 20 ), an inlay ( 40 ) having an antenna, and a second layer ( 60 or 80 ) comprising the steps of:
forming a RFIC chip module through-hole ( 12 ) and an inlay recess ( 11 ) on the first metal layer ( 10 );
plugging the first slit ( 15 or 15 ′) formed in the first layer ( 10 ) with a nonconductive material;
layering the inlay ( 40 ) on the second layer ( 60 or 80 );
layering a dummy chip module ( 20 ′) on the inlay ( 40 );
bonding the first layer ( 10 or 10 ′) and the second layer ( 60 or 80 ); and
after bonding the first layer ( 10 ) and the second layer ( 60 ), removing the dummy chip module ( 20 ′) and installing the RFIC chip module ( 20 ),
wherein the second layer ( 80 ) is metallic and comprises a second slit ( 85 ), wherein the second slit ( 85 ) is disposed from an interior portion of the second layer ( 80 ) to an edge of the second layer ( 80 ),
wherein the second slit ( 85 ) is disposed to be substantially aligned in a lengthwise direction with the first slit ( 15 ) and shifted in a widthwise direction with respect to the first slit ( 15 ) by less than the width of the first slit ( 15 ) and an insert having a shape corresponding to the stacked slits is snugly fit in the slits.
13. The method of claim 12 , wherein the first layer ( 10 or 10 ′) and the second layer ( 60 or 80 ) are bonded by heat-pressing.
14. The method of claim 13 , wherein the cross-sectional profile of the first slit ( 15 ′) is wider on the lower side of the first metal layer ( 10 ′) than an upper side of the first metal layer ( 10 ).
15. The method of claim 12 , wherein the recess ( 11 ) surrounds the through-hole ( 12 ).
16. The method of claim 12 , wherein the first slit ( 15 ) is at least 0.1 mm in width.
17. The method of claim 12 , wherein the second layer ( 60 ) is made of a synthetic resin.